| Patent No. | Patent Title: |
| 8154134 | Packaged electronic devices with face-up die having TSV connectio... |
| 8097958 | Flip chip connection structure having powder-like conductive subs... |
| 8097952 | Electronic package structure having conductive strip and method |
| 8097951 | Integrated circuit having wiring layer and a pattern in which a g... |
| 8097942 | Semiconductor device including power supply bar having jutted por... |
| 8084849 | Integrated circuit package system with offset stacking |
| 8076771 | Semiconductor device having metal cap divided by slit |
| 8067820 | Silocon wafer supporting method, heat treatment jig and heat-trea... |
| 8063484 | Semiconductor device and heat sink with 3-dimensional thermal con... |
| 8063471 | Copper alloy sheet for electric and electronic parts |
| 8053895 | Metal line of semiconductor device having a multilayer molybdenum... |
| 8039947 | Integrated circuit package system with different mold locking fea... |
| 8039938 | Airgap micro-spring interconnect with bonded underfill seal |
| 8030784 | Semiconductor nanoparticle surface modification |
| 8026602 | Fabrication method of semiconductor device having conductive bump... |
| 8026601 | Encapsulated wafer level package with protection against damage a... |
| 8008757 | Resinous hollow package and producing method thereof |
| 7982316 | Semiconductor package having a land to absorb thermal and mechani... |
| 7982235 | Light emitting device, package and lead frame |
| 7960828 | Carrier frame for electronic components and production method for... |
| 7851858 | MOSFET having SOI and method |
| 7834466 | Semiconductor die with die pad pattern |
| 7834359 | Electro-optical device, transferred chip, and transfer origin sub... |
| 7825502 | Semiconductor die packages having overlapping dice, system using ... |
| 7825499 | Semiconductor package and trenched semiconductor power device usi... |
| 7825474 | Insulated-gate semiconductor device and PN junction diodes |
| 7821033 | Semiconductor component comprising a drift zone and a drift contr... |
| 7816707 | Field-effect transistor with nitride semiconductor and method for... |
| 7812464 | Semiconductor device and a method of manufacturing for high outpu... |
| 7812409 | Trench MOSFET with cell layout, ruggedness, truncated corners |
| 7804173 | Semiconductor device having conductive bumps and deviated solder ... |
| 7804161 | Semiconductor device and dam for resin |
| 7800180 | Semiconductor electrostatic protection device |
| 7786499 | Replaceable through-hole high flux LED lamp |
| 7781878 | Zigzag-stacked package structure |
| 7772687 | Multiple electronic component containing substrate |
| 7772702 | Dielectric spacers for metal interconnects and method to form the... |
| 7763964 | Semiconductor device and semiconductor module using the same |
| 7759694 | Nitride semiconductor light-emitting device |
| 7755186 | Cooling solutions for die-down integrated circuit packages |
Quotables 
PatentStorm News
