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| Number | Title | Issue Date |
| 8163110 | Superfine copper alloy wire and method for manufacturing same A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine... | 04/24/2012 |
| 8142574 | Steel product for welding A steel product for welding includes the following component: by mass %, C: 0.3% or less, Si: 0.5% or less, Mn: 0.3˜2%, P: 0.03% or less, S: 0.03% or less, Al: 0.3˜5%, O: 0.003˜0.01%, and N: 0.006% or less; wherein the balance is composed of Fe and inevitable imp... | 03/27/2012 |
| 8133334 | Process for manufacturing high strength corrosion resistant alloy for oil patch applications A Ni—Fe—Cr alloy having high strength, ductility and corrosion resistance especially for use in deep-drilled, corrosive oil and gas well environments, as well as for marine environments. The alloy comprises in weight %: 35-55% Ni, 12-25% Cr, 0.5-5% Mo, up to 3% ... | 03/13/2012 |
| 8123877 | Heat-resistant magnesium alloy for casting heat-resistant magnesium alloy cast product, and process for producing heat-resistant magnesium alloy cast product A heat-resistant magnesium alloy is for casting, and includes Ca in an amount of from 1 to 15% by mass, Al in a summed amount of from 4 to 25% by mass with the amount of Ca, and the balance being Mg and inevitable impurities when the entirety is taken as 100% by mas... | 02/28/2012 |
| 8092620 | High strength austenitic TRIP steel An austenitic TRIP steel consisting essentially of, in weight %, 0.14 to 0.18% Al, 2.8 to 3.2% Ti, 23.5 to 23.8% Ni, 3.8 to 4.2% Cr, 1.1 to 1.3% Mo, 0.29 to 0.31% V, 0.01 to 0.015% B, 0.01 to 0.02% C, and balance Fe and incidental impurities exhibits combined high y... | 01/10/2012 |
| 8070893 | Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electr... | 12/06/2011 |
| 8062440 | Hafnium alloy target and process for producing the same A hafnium alloy target containing either or both of Zr and Ti in a gross amount of 100 wtppm-10 wt % in Hf, wherein the average crystal grain size is 1-100 μm, the impurities of Fe, Cr and Ni are respectively 1 wtppm or less, and the habit plane ratio of the plane ... | 11/22/2011 |
| 8038931 | On-site induction heating apparatus A method and apparatus for heating a workpiece. An induction heating system is used to induce magnetic fields in a workpiece to inductively heat the workpiece. The induction heating system may comprise a portable power source, a portable power source controller, a f... | 10/18/2011 |
| 8034197 | Ultra-high strength stainless steels An ultra-high strength stainless steel alloy with enhanced toughness includes in % by weight: 0 to 0.06% carbon (C); 12.0 to 18% chromium (Cr); 16.5 to 31.0% cobalt (Co); 0 to 8% molybdenum (Mo); 0.5 to 5.0% nickel (Ni); 0 to 0.5% titanium (Ti); 0 to 1.0% niobium (N... | 10/11/2011 |
| 8029724 | Method of making a cutting insert with a hole for clamping A method of making a cutting insert using powder metallurgical methods including using a press with a main pressing direction and a press tool setup with a die, a male core rod, a female core rod, a bottom punch, a top punch and a feed shoe. The insert has a noncyli... | 10/04/2011 |
| 8025749 | Ultrafine-grain-copper-base sputter targets The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at ... | 09/27/2011 |
| 8021604 | Preparation of filler-metal weld rod by injection molding of powder A filler-metal weld rod of a filler-metal composition is prepared by providing a mass of metallic powders, mixing the metallic powders with a temporary thermoplastic binder to form an injection-moldable mixture, and thereafter injection molding the injection-moldabl... | 09/20/2011 |
| 8016956 | Ce-based amorphous metallic plastic The present invention concerns a Ce-base amorphous metallic plastics being CeaAlbMc, in which 55≦a≦75, 5≦b≦25, 10≦c≦25, and a+b+c=100; said M is Co, Cu or Ni. Otherwise the metallic plastics could be CedAl... | 09/13/2011 |
| 7976652 | Method for producing beryllium-copper A method for producing beryllium-copper containing at least Be and Cu, includes holding the beryllium-copper for a predetermined solid solution time in a solid solution temperature range in which the Be is dissolved into the Cu, cooling the beryllium-copper at a coo... | 07/12/2011 |
| 7947133 | Copper alloy strip material for electrical/electronic equipment and process for producing the same A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C c... | 05/24/2011 |
| 7942986 | Magnesium alloy A magnesium-based alloy consists of 1.5-4.0% by weight rare earth element(s), 0.3-0.8% by weight zinc, 0.02-0.1% by weight aluminium, and 4-25 ppm beryllium. The alloy optionally contains up to 0.2% by weight zirconium, 0.3% by weight manganese, 0.5% by weight yttri... | 05/17/2011 |
| 7914629 | High strength thick steel plate superior in crack arrestability The present invention provides high strength thick steel plate superior in crack arrestability high in strength, free of deterioration of HAZ toughness, and free of anisotropy, that steel plate containing, by mass %, C: 0.03 to 0.15%, Si: 0.1 to 0.5%, Mn: 0.5 to 2.0... | 03/29/2011 |
| 7883588 | Pb-free bearing used for fuel-injection pump In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the ... | 02/08/2011 |
| 7850794 | Spring steel with improved hardenability and pitting resistance The present invention provides a spring steel that has superior hardenability, undergoes less pitting in a corrosive environment, and can achieve higher stress and toughness. More specifically, the present invention provides a high-strength and high-toughness spring... | 12/14/2010 |
| 7850795 | Build-up wear-resistant copper alloy and valve seat While securing the building-up ability and crack resistance, to provide a build-up wear-resistant copper alloy and valve seat. The build-up wear-resistant copper alloy and valve seat are characterized by having a composition of nickel: 5.0-24.5%, iron: 3.0-20.0%, si... | 12/14/2010 |
| 7819992 | Copper alloy water supply member A member for water works is proposed in which the content of lead is limited to a very small values while maintaining its mechanical properties, castability, machinability, pressure resistance, etc. to levels equivalent to those of conventional copper alloys contain... | 10/26/2010 |
| 7815756 | Build-up wear-resistant copper-based alloy This is to provide a build-up wear-resistant copper-based alloy, which is advantageous for enhancing the cracking resistance and machinability, which is appropriate for cases of building up to form built-up layers especially, and which is equipped with the wear resi... | 10/19/2010 |
| 7806996 | Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0 | 10/05/2010 |
| 7806994 | Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an e... | 10/05/2010 |
| 7771547 | Methods for producing lead-free in-situ composite solder alloys Methods are disclosed for producing in-situ composite solders having a particulate intermetallic phase homogeneously distributed throughout the solder matrix. An eutectic solder is mixed with the components of the intermetallic phase, melted and rapidly cooled to fo... | 08/10/2010 |
| 7749336 | Technique for increasing the compliance of tin-indium solders A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.... | 07/06/2010 |
| 7744705 | Group I-III-VI quaternary or higher alloy semiconductor films This invention relates to group IB-IIIA. VIA quaternary or higher alloys. More particularly, this invention relations to group IB-IIIA-VIA quaternary or pentenary alloys which are suitable for use as semiconductor films. More specifically, the invention relates to q... | 06/29/2010 |
| 7744707 | Deep cryogenic tempering of brake components A deep cryogenic tempering process for brake components such as rotors and drums is provided, wherein the unique processing profile is dependent on properties of the specific brake components. The process comprises the steps of placing a brake component at a tempera... | 06/29/2010 |
| 7744706 | Solder alloy for bonding oxide material, and solder joint using the same The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substant... | 06/29/2010 |
| 7740721 | Copper alloy sputtering target process for producing the same and semiconductor element wiring Provided is a copper alloy sputtering target containing 0.01 to (less than) 0.5 wt % of at least 1 element selected from Al or Sn, and containing Mn or Si in a total amount of 0.25 wtppm or less. The above copper alloy sputtering target allows the formation of a wir... | 06/22/2010 |
| 7736448 | Nano icrystals copper material with super high strength and conductivity and method of preparing thereof The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roug... | 06/15/2010 |
| 7727344 | Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate A copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate, which copper alloy is a Cu—Zn—Mg alloy, a Cu—Sn alloy, a Cu—SN—Ag alloy, a Cu—Fe—Zn—P alloy, or a Cu—Cr alloy, each having a given alloy composition, i... | 06/01/2010 |
| 7727345 | Copper alloy and method of manufacturing the same Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quench... | 06/01/2010 |
| 7708050 | Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the ther... | 05/04/2010 |
| 7704335 | Refractory metal intermetallic composites based on niobium-silicides, and related articles A refractory composition is described, containing niobium, silicon, titanium, and at least one of rhenium and ruthenium. The amount of silicon in the composition is at least about 9 atom %, and the amount of titanium present is less than about 26 atom %, based on to... | 04/27/2010 |
| 7695576 | Low alloy high steel tool having constant toughness Disclosed is an improved low alloy high speed tool steel, which exhibits constant toughness with small dispersion of the properties after heat treatment and regardless of the size of the products. The steel consists essentially of, by weight %, C: 0.50-0.75%, Si: 0.... | 04/13/2010 |
| 7695578 | Bronze alloy, and ingot and liquid-contacting part using the alloy A copper-based alloy that has the soundness of alloy enhanced by restraining the concentrated occurrence of microporosities while suppressing the lead content and an ingot and a liquid-contacting part using the alloy are provided. The copper-based alloy has the soun... | 04/13/2010 |
| 7682468 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/23/2010 |
| 7682467 | High strength hot rolled steel sheet superior in workability, fatigue property, and surface quality Disclosed is a high-strength hot-rolled steel sheet containing C in a range of 0.03 to 0.15 mass %, Mn in a range of 0.5 to 2 mass %, and Al in a range of 0.01 to 0.1 mass %, respectively, while controlling S to not more than 0.02 mass % (0% included), wherein the m... | 03/23/2010 |
| 7682470 | Magnesium alloy A magnesium-based alloy consists of 1.5-4.0% by weight rare earth element(s), 0.3-0.8% by weight zinc, 0.02-0.1% by weight aluminum, and 4-25 ppm beryllium. The alloy optionally contains up to 0.2% by weight zirconium, 0.3% by weight manganese, 0.5% by weight yttriu... | 03/23/2010 |
