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| Number | Title | Issue Date |
| 5088638 | Method for making sucker rods A method for making sucker rods composed of a rod body (1) and end heads (2), consisting in upsetting the rod body end portions (8) carried out at a temperature that precludes softening of the rod body (1) metal, a thickening (9) being formed on each of t... | 02/18/1992 |
| 5065933 | Electronic device manipulating apparatus and method A robotically controlled pick-uo to tool (11) is modified by connecting to it a load cell (26) that generates a signal indicative of stress on the pick-up tool. The pick-up tool is directed toward a chip (12) to be removed and movement is stopped when the... | 11/19/1991 |
| 4993618 | Wire bonding method A wire bonding method for connecting a pad of a semiconductor chip and an inner lead with a bonding wire, which comprises the steps of pressing a ball formed on an end of the bonding wire to the pad, and applying ultrasonic waves to the ball, while the ou... | 02/19/1991 |
| 4972989 | Through the lead soldering A method of joining surface mount components includes screen printing a single layer of solder paste or other adhesive onto a substrate, positioning a component with a planar lead with a hole through the planar lead over the solder and mounting a second c... | 11/27/1990 |
| 4969592 | Method for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions in a materially bonded manner and apparatus for performing the method A method and apparatus for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions includes surrounding each of two silicon-infiltrated silicon carbide workpieces with at least one tightly closing shell in the vicinity of a junctio... | 11/13/1990 |
| 4964560 | Non-dedicated pallet assembly for wave soldering packaged integrated circuits A non-dedicated pallet assembly (10) is provided to carry and precisely position a plurality of integrated circuit package (12). The pallet assembly includes an exterior frame subassembly (14) encompassing an interior frame subassembly (16) formed to incl... | 10/23/1990 |
| 4958764 | Die-bonding method of pellets A die-bonding method of pellets, which includes a first step for causing a first paste to adhere to a forward end of a needle, a second step for lowering the needle from above a pellet located at a first position so as to cause the first paste stuck to th... | 09/25/1990 |
| 4955522 | Process for the leakproof joining of ceramic sealing disks to metallic attachments A process for the leakproof joining of a ceramic sealing disk, which regulates the passage of a fluid, and metallic attachments which are presented to the disk, wherein a roughly finished ceramic disk is metallized at the points that are to be joined to t... | 09/11/1990 |
| 4953776 | Turbine blade repair A method of repairing turbine blades where it is required to repair a blade while it is in situ on a rotor involves the movement of a lacing wire out of engagement with the blade to be repaired so that the blade may be repaired. The lacing wire may be com... | 09/04/1990 |
| 4953775 | Method of effecting a single joint between two pipes The invention relates to a method of effecting a single joint between two pipes of the pipe-line type by means of explosion welding, without the pipes being displaced in axial direction. This is achieved by moving an inner peripheral body (9) for welding ... | 09/04/1990 |
| 4949895 | Process of fixing internally titanium-lined doubled-walled tubing structure to titanium tube sheet A process of fixing a double-walled tubing structure to a titanium tube sheet, the tubing structure comprising a non-titanium outer tube and a titanium inner lining tube, comprising the steps of: pressure-welding a titanium collar to an end face of the ou... | 08/21/1990 |
| 4948027 | Device for retaining an attachment member A device for retaining an attachment member having an engagement portion for engagement with an outer circumferential surface of a rod-like member, comprising: a receptacle for receiving a main part of the attachment member with some play; an elastic memb... | 08/14/1990 |
| 4948031 | Process for bonding aluminum with cadmium and product thereof A process for joining first and second aluminum sheets in which the bonding surfaces of the aluminum sheets have their aluminum oxide layer replaced by a zinc layer and the zinc layers are plated with a non-alloy metal bonding material such as cadmium. Th... | 08/14/1990 |
| 4948032 | Fluxing agent Disclosed in a fluxing agent comprising 45% to 55% by weight of peanut oil and 45% to 55% by weight of water-white rosin.... | 08/14/1990 |
| 4948026 | Apparatus for mounting and/or soldering or cementing electronic components, in particular SMD components, on printed circuit boards An apparatus for mounting and/or soldering or cementing electronic components on printed circuit boards, having a first carrier for at least one circuit board and a second carrier for the component, the first and second carriers being displaceable relativ... | 08/14/1990 |
| 4948029 | Method of bonding two bodies Two bodies are provided with mutually different metal layers. The combination of wringing in contact of the metal surfaces and low-temperature interdiffusion provides a strong bond between the two bodies.... | 08/14/1990 |
| 4946088 | Bushing forming machine A bushing forming machine including: a metal strip delivery system including a metal strip wound on a drum; a forming mill for forming the metal strip to a shape; a first conveyer carrying the metal strip to the forming mill; and a punch provided on a pas... | 08/07/1990 |
| 4946090 | Seals between ceramic articles or between ceramic articles and metal articles A seal between two ceramic articles, or between a ceramic article and a metal article, is formed by providing a sealing member comprising an aluminum body, and a film of zinc or tin being deposited threon, with the inevitable aluminum oxide surface film r... | 08/07/1990 |
| 4944447 | Bonding verification process incorporating test patterns A bonding verification process which incorporates bonding test patterns and verifies the integrity of bonds by inspecting the bonding test patterns. For a bonding agent of solder, the bonding verification process verifies the integrity of solder connectio... | 07/31/1990 |
| 4944444 | Welding or burning shield The invention provides a portable welding or cutting shield to assist in preventing welding or burning by-products from contaminating or damaging the inside surfaces of a pipe. The portable welding shield comprises a shield assembly for capturing the by-p... | 07/31/1990 |
| 4942999 | Metal-ceramic joined composite bodies and joining process therefor Composite bodies comprise a metallic member and a ceramic member integrally joined together by joining a projection of the ceramic member to a recess of the metallic member. Their joining strength is improved by substantially limiting brazing metal to an ... | 07/24/1990 |
| 4943001 | Tube-type vessel having crevice-free joints and method for manufacturing the same A tube-type heat exchanger has two tubesheets, each provided with a multitude of bores, and tubes which extend between the tubesheets at their bores, their hollow interiors opening into the bores. Each tube at its ends is joined to the tubesheets along fi... | 07/24/1990 |
| 4940180 | Thermally stable diamond abrasive compact body A method of producing a thermally stable diamond compact having a metal layer bonded to a surface thereof is provided. The thermally stable diamond compact comprises a mass of diamond particles containing diamond-to-diamond bonding and a second phase unif... | 07/10/1990 |
| 4940178 | Soldering iron A soldering iron comprises a tube and a soldering tip slipped onto the front or outer end of the tube with a close sliding fit. The soldering tip is fastened axially by means of a spring element which is fastened to an inner end of the tube. In order to s... | 07/10/1990 |
| 4940179 | Device for forming a solder connection A device for connecting two bodies such as wires, and for sealing the connection between them, comprising a heat-shrinkable sleeve, a solder insert and an annular composite adhesive insert which comprises two layers of heat-activatable adhesive material. ... | 07/10/1990 |
| 4936504 | Process for producing a clad plate The present invention provides a process for producing a clad plate which comprises a first step of forming a coil by taking up two or more metal sheets as clad materials and a thin sheet of heat-resistant steel which works as a separator material while t... | 06/26/1990 |
| 4936500 | Bolt-type boiler wall tube tool This invention relates to a bolt-type boiler wall tube tool in which boiler tubes in the form of a wall can be clampingly secured to retain adjacent ends of the boiler tubes forming the wall in aligned relation when connecting the ends of the boiler wall ... | 06/26/1990 |
| 4934582 | Method and apparatus for removing solder mounted electronic components A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering ... | 06/19/1990 |
| 4934578 | Apparatus for mounting and/or soldering or cementing electronic components on printed circuit boards In an apparatus for mounting and/or soldering or cementing electronic components, in particular SMD components, on printed circuit boards, haing a first carrier for at least one circuit board and a second carrier for the component, the first and second ca... | 06/19/1990 |
| 4932585 | Method and apparatus for solder plating an object A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a ... | 06/12/1990 |
| 4932582 | Method for the preparation of a bonding tool A bonding tool to be employed for preparing semiconductor parts, e.g., IC, comprizing a tool-head made of a super hard material, e.g., a single crystal of diamond, etc., which comes into contact with a workpiece in the use of the bonding tool and a shank ... | 06/12/1990 |
| 4930675 | Method of forming hard facings on materials A hard facing of preferably a high speed tool steel or a Stellite along the edge of a substrate is produced by mechanical deposition by means of rotary friction surfacing. The combination of high temperatures below the melting points of coating material a... | 06/05/1990 |
| 4928872 | Method of brazing employing bag-group homogeneous microcrystalline brazing powders A brazing process is disclosed for joining two or more metal parts. The metal parts are brazed by interposing between the parts to be joined a brazing paste composed of a homogeneous microcrystalline rapidly solidified alloy powder having a composition co... | 05/29/1990 |
| 4928869 | Solder leveller A solder leveller for tinning exposed metal on printed circuit boards comprises a solder bath and paired rollers therein for carrying a board in a curvilinear path downwardly into, through and upwardly out of the bath. At least one pair of rollers having ... | 05/29/1990 |
| 4928870 | Process for joining ceramic parts with a reactive conducting material A thin metal foil or an array of fine wires or a graphite web, mat or the ke, having electrical conductivity was interposed between clean polished surfaces of ceramic parts which are to be joined, with application of pressure. A high current electrical di... | 05/29/1990 |
| 4927068 | Method for heating a patterned substrate A method for heating a patterned substrate having electronic components, using a heat control mask having plural apertures is disclosed. Heat transfer rates associated with the apertures are determined by thermodynamic analysis based on the discrete two-d... | 05/22/1990 |
| 4927069 | Soldering method capable of providing a joint of reduced thermal resistance A soldering method is disclosed as adapted for attaching semiconductor devices such as transistors to their lead mounts. A layer of a solder paste, premixed with rosin flux, is first printed or otherwise formed on each of a series of interconnected semico... | 05/22/1990 |
| 4927070 | Method for making multi-colored composite laminates A method for making multi-colored composite laminates comprises stacking a plurality of colored strips in a predetermined pattern and bonding the strips into a composite laminate by continuous bonding. The composite laminate is then rolled before being pa... | 05/22/1990 |
| 4925074 | Welding tool The invention provides a tool useful as an aid in joining pipes by welding. The tool includes means for positioning and holding an insert ring in a predetermined position with respect to the end of a pipe while the insert ring is tack-welded to an end of ... | 05/15/1990 |
| 4925085 | Bonding means and method An improved means and method for bonding closely spaced parallel wires for applications in electronic devices, circuits and assemblies is described herein. A wire guiding means is provided located between a bonding wedge and a releasable wire clamp of a c... | 05/15/1990 |
