Bizarre Patents
Pet Toilet-Like Water Disk and Food Storage
One pet-friendly inventor patented "a device for watering pets, e.g., a dog or cat." The device, he helpfully noted, "has the general shape of a toilet."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 5614758 | Fully walled emitter-base in a bipolar transistor A self-aligned fully-walled monocrystalline silicon emitter-base structure for a bipolar transistor and methods for producing the structure are provided. The methods involve creating an oxide side wall surrounding a monocrystalline silicon emitter-base st... | 03/25/1997 |
| 5585671 | Reliable low thermal resistance package for high power flip clip ICs A flip-chip IC package (10) provides a thermally-conductive lid (20) attached to a backside of the chip (12) by a die attach layer (18) of a predetermined thickness range. A rim (22), preferably KOVAR iron-nickel alloy, is formed on the lid (20) with a de... | 12/17/1996 |
| 5567987 | Semiconductor device having a multi-layer metallization structure The invention relates to a wiring structure for a semiconductor device and a method for manufacturing the same, which fills up a contact hole of below one half micron. An insulating layer is formed on a semiconductor substrate, and a contact hole is forme... | 10/22/1996 |
| 5561324 | Semiconductor chip mounting sector The present invention relates to a semiconductor device which comprises a semiconductor chip mounting section having a through hole, a radiating plate attached to one surface of the semiconductor chip mounting section so as to cover the through hole of th... | 10/01/1996 |
| 5559363 | Off-chip impedance matching utilizing a dielectric element and high density interconnect technology A high-frequency, high-power, semiconductor device chip is impedance matched to an off-chip impedance by a matching network including a dielectric element located on a substrate ground plane portion adjacent to the device to be matched. A thin film dielec... | 09/24/1996 |
| 5559369 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 09/24/1996 |
| 5557139 | Buried base vertical bipolar power transistor with improved current gain and operation area The transistor comprises a buried base P region, a buried emitter N+ region with elongate portions (fingers), deep contact P+ base regions, emitter N+ interconnection regions serving balancing resistor functions, and base, emitter, and collector surface c... | 09/17/1996 |
| 5557142 | Shielded semiconductor device package A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsu... | 09/17/1996 |
| 5555112 | Liquid crystal display device having multilayer gate busline composed of metal oxide and semiconductor In a liquid crystal display substrate in which the pixel electrode is applied with a voltage through the drain and source of a thin-film transistor (TFT) that conducts by a voltage applied to the TFT gate electrode, this gate electrode and a busline conne... | 09/10/1996 |
| 5554867 | Nonvolatile semiconductor memory device having a memory cell transistor and a select transistor A nonvolatile semiconductor memory device is provided including a DINOR (Divided Bit Line NOR) type cell that allows further reduction of the cell size while ensuring immunity from drain-disturb. In the nonvolatile semiconductor memory device, a sub-bit l... | 09/10/1996 |
| 5552636 | Discrete transitor assembly A discrete element electronic package (100) includes a heat spreader (180) with a cavity (185) for receiving a substrate (110), a substrate (110) mounted within the cavity (185) of the heat spreader (180), a heat-generating semiconductor device (170), suc... | 09/03/1996 |
| 5550409 | Semiconductor device having internal wire and method of fabricating the same In order to obtain a semiconductor device having an internal wire of low resistance, a conductive layer whose surface is silicified is provided in a surface of a semiconductor substrate. A conductor whose surface is silicified is provided on the semicondu... | 08/27/1996 |
| 5550553 | Dielectric rod antenna A dielectric rod antenna including a dielectric rod, a ring-shaped conductive film provided on an outer peripheral surface of the dielectric rod, and a waveguide. The conductive film is provided on an outer peripheral surface portion of the dielectric rod... | 08/27/1996 |
| 5550630 | Spectrophotometric method for structural analysis of organic compounds, polymers, nucleotides and peptides A method for analyzing the structures of chemical organic compounds, polymers, polynucleotides and peptides is disclosed. The method uses the integrated intensity of spectral light absorption in wide or narrow regions of the ultraviolet and/or visible spe... | 08/27/1996 |
| 5545913 | Assembly for mounting semiconductor chips in a full-width-array image scanner An assembly facilitates mounting a set of abutted semiconductor chips, such as chips aligned to form a single full-page-width linear array of photosensors in a digital scanner or copier. An elongated bead of electrically conductive adhesive extends along ... | 08/13/1996 |
| 5543648 | Semiconductor member and semiconductor device having a substrate with a hydrogenated surface A semiconductor member with a monocrystalline semiconductor layer for forming a functional element. The main plane of the monocrystalline semiconductor layer has a center line average surface roughness Ra of not more than 0.4 nm when the main plane is was... | 08/06/1996 |
| 5541748 | Liquid crystal display having patterned insulating and semiconductor layers and a method of fabricating the same A liquid crystal display provided with a matrix of inverted-stagger thin-film transistors has a plurality of gate insulating films formed over gate lines and including one insulating film formed in contact with gate electrodes of the thin-film transistors... | 07/30/1996 |
| 5541753 | Liquid crystal display and device having a total retardance of (M+1) λ/2 and (Mλ/2) at first and second operating voltages A liquid crystal display comprises a nematic liquid crystal layer disposed between alignment layers. The alignment layers are formed on substrates which also carry display control electrodes connected to a drive circuit. Polarisers are provided on opposit... | 07/30/1996 |
| 5541422 | Tunnel diode with several permanent switching states The invention relates to a tunnel diode provided with two metallically conducting electrodes (1, 2) with an insulating dielectric (3) in between, which forms a barrier with a barrier level for electrons and which has a thickness such that electrons can tu... | 07/30/1996 |
| 5541449 | Semiconductor chip carrier affording a high-density external interface A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the group... | 07/30/1996 |
| 5541447 | Lead frame A lead frame for use in producing of a semiconductor integrated circuit comprises a lead frame member, a plurality of leads, a tie bar, a plurality of auxiliary leads, a support-stay portion and a connecting portion. A semiconductor element such as an IC ... | 07/30/1996 |
| 5539214 | Quantum bridges fabricated by selective etching of superlattice structures A quantum bridge structure including wires of a semiconductor material such as silicon which are formed by selectively etching a superlattice of alternating layers of at least two semiconductor materials. The quantum bridge is useful as a photo emission d... | 07/23/1996 |
| 5539253 | Resin-sealed semiconductor device A resin-sealed semiconductor device includes a heat sink on which a semiconductor chip is provided. An output terminal is connected to the semiconductor chip. A casing surrounds the chip and part of the output terminal. The inside of the casing is filled ... | 07/23/1996 |
| 5539246 | Microelectronic integrated circuit including hexagonal semiconductor "gate " device A microelectronic integrated circuit includes a semiconductor substrate, and a plurality of microelectronic devices formed on the substrate. Each device has a periphery defined by a hexagon, and includes an active area formed within the periphery, a centr... | 07/23/1996 |
| 5539250 | Plastic-molded-type semiconductor device A plastic-molded-type semiconductor device is provided wherein two semiconductor chips, having main surfaces on which electrodes and circuits are formed, are arranged to face each other. A lead frame is placed between these two semiconductor chips and ele... | 07/23/1996 |
| 5536952 | Heterojunction bipolar transistor This transistor is a pnp transistor having a heterojunction of p-type diamond (or BPx N1-x, 6HSiC) and n-type SiC (3CSiC)and having a structure in which a p+ -SiC (3CSiC ) layer, a p-SiC (3CSiC) layer, an n+ -Si... | 07/16/1996 |
| 5536968 | Polysilicon fuse array structure for integrated circuits A programmable read only memory (PROM) including an array of polysilicon fuse elements. The fuse array is formed within a semiconductor substrate including first and second patterned signal layers electrically insulated from one another. Each polysilicon ... | 07/16/1996 |
| 5536974 | Semiconductor device with light reflecting substrate area A semiconductor device having a high packaging yield is disclosed. A light directed to a light reflection area (20) formed on a packaging substrate (10) is reflected with an accurate angle. A light directed to a second light reflection area (50) formed on... | 07/16/1996 |
| 5537242 | Liquid crystal millimeter wave open transmission lines modulators Low-cost, thin-layer liquid crystal (LC) millimeter wave (MMW) phase modulators and phased array antennae are provided based on several types of open transmission strip-line, parallel-line, and ridge-guide configurations in which surface-aligned LCs are m... | 07/16/1996 |
| 5534725 | Resin molded charge coupled device package and method for preparation thereof A resin molded CCD package and a method for preparing the CCD package by employing a transfer molding using a low-priced plastic material having a good moldability. This package comprises a semiconductor chip as a CCD, a lead frame being integrally provid... | 07/09/1996 |
| 5534718 | LED package structure of LED display An improved light emitting diode (LED) package structure for an LED lighting device comprises a reflector having a bowl-shaped reflecting surface formed by a pressing technique. A stand member extends from the center of the reflecting surface to the focus... | 07/09/1996 |
| 5534721 | Area-efficient layout for high voltage lateral devices A lateral semiconductor device is disclosed having a semiconductor body of a first conductivity type, and a drift region having a second conductivity type opposite that of the first conductivity type and formed on a surface of the semiconductor body. A dr... | 07/09/1996 |
| 5534999 | Monitoring sub-micron particles Sub-micron particles in fluid such as ultrapure water are detected or monitored by a simple apparatus in which a light beam from a coherent light source (1) is converged (2) in such a manner that the light beam is focussed in a stream (3) of particle-cont... | 07/09/1996 |
| 5534727 | Semiconductor device A semiconductor device including an insulating film substrate having a surface, a high frequency semiconductor chip disposed on the surface, and circuit elements disposed on the surface and connected to the semiconductor chip wherein the insulating film s... | 07/09/1996 |
| 5532516 | Techniques for via formation and filling Via filling is enhanced by the techniques of 1) providing pillars immediately underneath semiconductor features, such as metal layer contacts (inter-connection points), and 2) polishing off excess via-filling material so that the via-filling plug is flush... | 07/02/1996 |
| 5532851 | Optical switching element An optical switching element having a variable optical path length layer whose optical path length is varied and whose refractive index anisotropy is controlled by application of an external field; external field application device for applying the extern... | 07/02/1996 |
| 5530295 | Drop-in heat sink A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The he... | 06/25/1996 |
| 5530269 | Light emitting device comprising an organic led array on an ultra thin substrate A light emitting device that comprises an organic LED array containing a plurality of light emitting pixels, the pixels each being located on a common electrically insulative transparent substrate, is characterized in that the transparent support is ultra... | 06/25/1996 |
| 5530284 | Semiconductor leadframe structure compatible with differing bond wire materials A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29... | 06/25/1996 |
| 5528370 | Apparatus and method for measuring variations in thickness of an optical interference element In a system for measuring variations in thickness of an optical etalon, a light source and a diffraction grating are mounted on a base structure with an axle. A lever arm is affixed to the axle, and a micrometer is held in contact with the lever arm. The ... | 06/18/1996 |
