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| Number | Title | Issue Date |
| 8187484 | Down-stream plasma etching with deflectable radical stream The invention relates to a process for etching a substrate (3) in an etching chamber (1) with a plasma ignited outside of the etching chamber (1). The process is characterized in that during the etching process at least temporarily at least one ... | 05/29/2012 |
| 8187478 | Fabricating process of structure with embedded circuit A fabricating process of a structure with an embedded circuit is described as follows. Firstly, a substrate having an upper surface and a lower surface opposite to the upper surface is provided. Afterward, a dielectric layer is formed on the upper surface of the sub... | 05/29/2012 |
| 8187486 | Modulating etch selectivity and etch rate of silicon nitride thin films Etching of nitride and oxide layers with reactant gases is modulated by etching in different process regimes. High etch selectivity to silicon nitride is achieved in an adsorption regime where the partial pressure of the etchant is lower than its vapor pressure. Low... | 05/29/2012 |
| 8182704 | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole tip on a side of a medium-opposing surface opposing a recording medium, a write shield ... | 05/22/2012 |
| 8183163 | Etching liquid, etching method, and method of manufacturing electronic component An etching liquid used for selectively etching silicon nitride, the etching liquid includes: water; a first liquid that can be mixed with the water to produce a mixture liquid having a boiling point of 150° C. or more; and a second liquid capable of producing proto... | 05/22/2012 |
| 8182703 | Tuning fork resonator element and tuning fork resonator A tuning fork resonator element that has a base portion, first and second resonating arms extending from the base portion in a first direction, and a support frame sandwiching the first and second resonating arms and being connected to the base portion includes: a f... | 05/22/2012 |
| 8178442 | Method of forming patterns of semiconductor device A method in the fabrication of a semiconductor device simultaneously forms different patterns on the same level of the device. The device has a first area and a second area. A low density mask pattern of at least one relatively wide topographic feature is formed on ... | 05/15/2012 |
| 8173034 | Methods of utilizing block copolymer to form patterns Some embodiments include methods of utilizing block copolymer to form patterns between weirs. The methods may utilize liners along surfaces of the weirs to compensate for partial-width segments of the patterns in regions adjacent the weirs. Some embodiments include ... | 05/08/2012 |
| 8173214 | Substrate processing method A substrate processing method for use in a substrate processing apparatus having a stocker therein which stores a multiplicity of dummy substrates; a reaction chamber for producing semiconductor products; and a transferring unit for transferring into the reaction ch... | 05/08/2012 |
| 8168075 | Methods for machining inorganic, non-metallic workpieces A method of machining a workpiece includes applying a fluid between a fixed abrasive component and a workpiece, followed by translation of the fixed abrasive component and the workpiece relative to each other. The fluid contains an anti-clogging agent containing a p... | 05/01/2012 |
| 8163191 | Apparatus and methods for using high frequency chokes in a substrate deposition apparatus In certain aspects, a substrate deposition apparatus, including a gas tube coupled to a gas source, an RF power source and a substrate processing chamber, is provided. The gas tube is adapted to carry process gas and cleaning plasma from the gas source/remote plasma... | 04/24/2012 |
| 8158533 | Piezoelectric tactile sensor A piezoelectric tactile sensor comprises a piezoelectric membrane with a top surface, a transducer of elastic column with a bottom end surface to overlay over the top surface of the piezoelectric membrane and plural microelectrodes being sandwiched between the top s... | 04/17/2012 |
| 8158528 | Method for forming pattern of semiconductor device A method for forming a pattern of a semiconductor device comprises: forming a stacked film including an underlying layer, an antireflection film and a photoresist film over a semiconductor substrate; coating an over-coating composition over the photoresist film to f... | 04/17/2012 |
| 8153526 | High planarizing method for use in a gate last process A method for performing a chemical-mechanical polishing (CMP) is provided. The method includes processing a semiconductor substrate to form a dummy gate structure on the substrate, to form a hard mask on the dummy gate structure, and to form a contact etch stop laye... | 04/10/2012 |
| 8153017 | Substrate treating method A substrate treating apparatus for heating a treating solution formed of a chemical and a diluent, and immersing substrates in the treating solution for treatment. The apparatus includes a treating tank for storing the treating solution, a heater for heating the tre... | 04/10/2012 |
| 8147712 | Polishing composition Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition. ... | 04/03/2012 |
| 8142670 | Micro-oscillating element and method of making the same A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force... | 03/27/2012 |
| 8142672 | Manufacturing method of opto-electric hybrid board An opto-electric hybrid board manufacturing method which improves the alignment accuracy of an optical element with respect to a core of an optical waveguide. When a core (7) of an optical waveguide (W) is formed on a surface of an electric circuit board (E),... | 03/27/2012 |
| 8129285 | Substrate processing system A substrate processing method implemented in a substrate processing system that includes an etching apparatus that carries out plasma etching processing on a substrate and a vacuum-type substrate transferring apparatus to which the etching apparatus is connected is ... | 03/06/2012 |
| 8123866 | Wafer manufacturing method and device The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the sur... | 02/28/2012 |
| 8114780 | Method for dielectric material removal between conductive lines A method of removing carbon doped silicon oxide between metal contacts is provided. A layer of the carbon doped silicon oxide is converted to a layer of silicon oxide by removing the carbon dopant. The converted layer of silicon oxide is selectively wet etched with ... | 02/14/2012 |
| 8105497 | Method for fabricating cylinder type capacitor A method for fabricating a cylinder type capacitor includes forming connection contacts passing through a lower layer over a semiconductor substrate; forming a mold layer covering the connection contacts; forming a first floated pinning layer with a stress in a firs... | 01/31/2012 |
| 8097178 | Surface acoustic wave device and manufacturing method therefor, and communications equipment A surface acoustic wave device configured by forming an oxide layer 2 on a piezoelectric substrate 1 composed of a lithium tantalate single crystal or a lithium niobate single crystal and having weak pyroelectric properties having a lower oxygen conten... | 01/17/2012 |
| 8084366 | Modified DARC stack for resist patterning A method of making a device includes forming a device layer, forming an organic hard mask layer over the device layer, forming a first oxide hard mask layer over the organic hard mask layer, forming a DARC layer over the first oxide hard mask layer, forming a photor... | 12/27/2011 |
| 8066895 | Method to control uniformity using tri-zone showerhead Embodiments of the present invention provide apparatus and method for processing a substrate with increased uniformity. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus comprises a chamber body defining a proces... | 11/29/2011 |
| 8062978 | Crystalline aluminum oxide layers having increased energy band gap, charge trap layer devices including crystalline aluminum oxide layers, and methods of manufacturing the same Crystalline aluminum oxide layers having increased energy band gap, charge trap memory devices including crystalline aluminum oxide layers and methods of manufacturing the same are provided. A method of forming an aluminum oxide layer having an increased energy band... | 11/22/2011 |
| 8062535 | Video rate-enabling probes for atomic force microscopy Method for producing a probe for atomic force microscopy with a silicon nitride cantilever and an integrated single crystal silicon tetrahedral tip with high resonant frequencies and low spring constants intended for high speed AFM imaging. ... | 11/22/2011 |
| 8062538 | Etching apparatus and method for semiconductor device Disclosed is an etching method for a semiconductor device. The protecting layer, such as the hydrocarbon layer or the hydrocarbon layer containing phosphorous, is formed on the photoresist layer by using the precursor gas containing no fluorine. Therefore, the etchi... | 11/22/2011 |
| 8057692 | Methods of forming fine patterns in the fabrication of semiconductor devices In a method of forming a semiconductor device, a feature layer is provided on a substrate and a mask layer is provided on the feature layer. A portion of the mask layer is removed in a first region of the semiconductor device where fine features of the feature layer... | 11/15/2011 |
| 8057697 | Lapping composition and method using same A lapping composition is presented, wherein that lapping composition is formed by mixing a solvent, a base, and a phenolic compound having structure I: wherein R1 is selected from the group consisting of —O−M... | 11/15/2011 |
| 8052884 | Method of fabricating microchannel plate devices with multiple emissive layers A method of fabricating a microchannel plate includes defining a plurality of pores extending from a top surface of a substrate to a bottom surface of the substrate where the plurality of pores has a resistive material on an outer surface that forms a first emissive... | 11/08/2011 |
| 8052507 | Damping polyurethane CMP pads with microfillers A system for preparing a microcellular polyurethane material, includes a froth, prepared, for instance, by inert gas frothing a urethane prepolymer, preferably an aliphatic isocyanate polyether prepolymer, in the presence of a surfactant; a filler soluble in a CMP s... | 11/08/2011 |
| 8048331 | Etching composition and etching process An etching composition which comprises at least one organic carboxylic acid compound selected from acetic acid, propionic acid, butyric acid, succinic acid, citric acid, lactic acid, malic acid, tartaric acid, malonic acid, maleic acid, glutaric acid, aconitic acid,... | 11/01/2011 |
| 8038893 | Method for producing semiconductor optical device To grasp a removable particle contamination and appropriately removing a particle contamination exposing from a surface of a semiconductor layer, this production method of the semiconductor optical device includes a surface treatment step in which particle contamina... | 10/18/2011 |
| 8034409 | Methods, apparatuses, and systems for fabricating three dimensional integrated circuits The present invention pertains to methods, apparatuses, and systems for fabricating three-dimensional integrated circuits. One embodiment of the method comprises providing a wafer or other substrate having a plurality of through holes. In addition, the method includ... | 10/11/2011 |
| 8029640 | Multilayer retaining ring for chemical mechanical polishing A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion. ... | 10/04/2011 |
| 8029688 | Method of fine patterning semiconductor device For patterning during integrated circuit fabrication, a first pattern of first masking structures is formed, and a buffer layer is formed on exposed surfaces of the first masking structures. Also, a second pattern of second masking structures is formed in recesses b... | 10/04/2011 |
| 8025808 | Methods for machine ceramics A method for machining a ceramic substrate containing Al, including providing a solution containing a phosphorus compound on the ceramic substrate; and machining the substrate with an abrasive. ... | 09/27/2011 |
| 8025809 | Polishing methods A chemical-mechanical polishing (CMP) method includes applying a solid abrasive material to a substrate, polishing the substrate, flocculating at least a portion of the abrasive material, and removing at least a majority portion of the flocculated portion from the s... | 09/27/2011 |
| 8017027 | Semiconductor fabricating process A semiconductor fabricating process is provided. First, a substrate is provided. The substrate has thereon a stacked structure and a mask layer disposed on the stacked structure. Thereafter, an oxide layer is formed on a surface of the mask layer and a surface of at... | 09/13/2011 |
