| Patent No. | Patent Title: |
| 7154155 | Wing-shaped surface mount package for light emitting diodes |
| 7049693 | Electrical contact array for substrate assemblies |
| 6963142 | Flip chip integrated package mount support |
| 6894319 | Semiconductor device |
| 6885107 | Flip-chip image sensor packages and methods of fabrication |
| 6882034 | Routing element for use in multi-chip modules, multi-chip modules... |
| 6861749 | Semiconductor device with bump electrodes |
| 6861710 | Light emitting device and method of manufacturing the same |
| 6849930 | Semiconductor device with uneven metal plate to improve adhesion ... |
| 6847120 | Flip chip semiconductor device having signal pads arranged outsid... |
| 6847054 | Optical transistor and method thereof |
| 6841886 | Layout structure for a flip chip semiconductor integrated circuit |
| 6841889 | Field correction of overlay error |
| 6841865 | Semiconductor device having clips for connecting to external elem... |
| 6833566 | Light emitting diode with heat sink |
| 6828678 | Semiconductor topography with a fill material arranged within a p... |
| 6822337 | Window-type ball grid array semiconductor package |
| 6818973 | Exposed lead QFP package fabricated through the use of a partial ... |
| 6812556 | Multi-chip package semiconductor device having plural level inter... |
| 6812563 | Microcooling device |
| 6800884 | Inter-tile buffer system for a field programmable gate array |
| 6800910 | FinFET device incorporating strained silicon in the channel regio... |
| 6798069 | Integrated circuit having adaptable core and input/output regions... |
| 6794691 | Use of irregularly shaped conductive filler features to improve p... |
| 6791154 | Integrated semiconductor circuit device having Schottky barrier d... |
| 6787928 | Integrated circuit device having pads structure formed thereon an... |
| 6787866 | Semiconductor device having a moveable member therein and a prote... |
| 6787815 | High-isolation semiconductor device |
| 6787893 | Semiconductor device |
| 6784528 | Semiconductor device with plating wiring connecting IC electrode ... |
| 6777796 | Stacked semiconductor chips on a wiring board |
| 6774403 | Multi-colored LED lighted sign |
| 6765282 | Semiconductor structure and method for determining critical dimen... |
| 6759737 | Semiconductor package including stacked chips with aligned input/... |
| 6756687 | Interfacial strengthening for electroless nickel immersion gold s... |
| 6750544 | Metallization system for use in a semiconductor component |
| 6750542 | Sputter target, barrier film and electronic component |
| 6750529 | Semiconductor devices including fuses and multiple insulation lay... |
| 6740903 | Substrate for light emitting diodes |
| 6740972 | Electronic device having fibrous interface |
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