U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

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...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!

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Ryan, Patrick


Primary examiner statistics: 5932 patents; average approval time: 5930 days
Assistant examiner statistics: 231 patents; average approval time: 234 days

Patents as Assistant Examiner


1            
NumberTitleIssue Date
7968235Long life lithium batteries with stabilized electrodes
The present invention relates to non-aqueous electrolytes having stabilization additives and electrochemical devices containing the same. Thus the present invention provides electrolytes containing an alkali metal salt, a polar aprotic solvent, a first additive that...
06/28/2011
5338645Three dimensional printed circuits
Printed circuits which reside on three dimensional surfaces are disclosed. Using a first technique, a three dimensional surface is formed on a substrate having a high melting point or permitting a high degree of infrared energy transmittance. The surface ...
08/16/1994
4885200Infant car seat liner
A disposable infant seat liner in accordance with the present invention includes an upper section, a middle section and a lower section. Plural shoulder strap receiving slotways are provided in the upper section. These slotways may be accessible from side...
12/05/1989
4868047Printed wiring board
An injection molding resin-type printed wiring board having an electric circuit pattern layer formed integrally on the surface thereof and having reduced warpage. In the printed circuit board, the injection molding resin includes a thermoplastic resin com...
09/19/1989
4861641Substrates with dense metal vias
Dense vias may be made with a metallizing composition containing tungsten, alumina, and either nickel or palladium. Further, an infiltration process ensures that vias in ceramic substrates are heremetic. Infiltrating materials, including metals and alloys...
08/29/1989
4835061Conductive laminate
A conductive laminate comprising a substrate (2), an intermedaite layer (3) provided on the substrate (2) and made of an amorphous metallic or semi-metallic oxide, and a transparent conductive layer (4) provided on the intermediate layer (3) and made of a...
05/30/1989
4794061Device for aligning a photomask onto a printed wiring board
An apparatus for applying a phototool to a light sensitive substrate by means of a roller for applying the phototool to the substrate and a vacuum restraining means for restraining the phototool to maintain it under tension during application of the photo...
12/27/1988
4792451Medicinal capsule
A medicinal capsule comprising a cap member containing a first circumferential slot formed on the outer surface of the upper portion, at least one raised member formed on the inner surface of the cap, a body member containing a second circumferential slot...
12/20/1988
4792474Optical memory element
An optical memory element comprises a substrate, a recording medium layer and an aluminum silicon nitride film laminated in this order....
12/20/1988
4788096Devices for making piezoelectric ceramic or ceramic-base composite sensors
Cubelets are made from a piezoelectrically active ceramic material having holes therein which may be cross-cored. The holes are selectively filled with a liquid curable resin, such as an epoxy. The cubelets may also be formed from bonded or sintered "half...
11/29/1988
4786539Thermal insulating composite laminate
The composite laminate is made of two metal parts 1, 2 and a pair of thermal insulating bars of fiber reinforced synthetic material. Each metal part has a longitudinally extending groove which is provided with two rows of transversely disposed teeth which...
11/22/1988
4783354Adherable, yet removable sheet material
A sheet material which can be firmly adhered to a surface, and yet readily removed thereform, without the necessity of pre-wetting and without damaging the surface is prepared by coating one side of a base sheet with an adhesive composition containing a t...
11/08/1988
4780382Process for making a transmission mask
The invention is a process for making a transmission mask which can be used in structuring a semiconductor substrate in an additive or subtractive way by two galvanic depositions of layers of which one provides the mask structure and the other a grid stru...
10/25/1988
4778710One-piece ski edge with integrated tip and/or end protection
A ski edge whose vertical flange and horizontal flange of the ski edge portions extend around the ski tip, the horizontal flange having a cutout in the region of the ski tip. The ski edge is one piece whose side edge portions are divided into successive s...
10/18/1988
4774143Impact resistant glass
A transparent laminated window structure having high impact resistance is disclosed, wherein the window comprises a continuous inner layer of thermoplastic material, and an outer layer substantially parallel to the inner layer including at least a first c...
09/27/1988
4772472Formed or molded body and method and apparatus for manufacturing such body
A formed or molded body, a manufacturing method and a manufacturing apparatus therefor, wherein several equal or different active ingredients in suitable, equal or different carrier substances are filled at the same time side-by-side without a partition i...
09/20/1988
4770921Self-shielding multi-layer circuit boards
Self-shielding multi-layer circuit boards are produced utilizing augmentative replacement techniques....
09/13/1988
4769272Ceramic lid hermetic seal package structure
A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallizatio...
09/06/1988
4769309Printed circuit boards and method for manufacturing printed circuit boards
A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting ...
09/06/1988
4769270Substrate for a printed circuit board
A substrate for a printed circuit board, comprising a metal core plate having apertures and an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, coated thereon, wherein said apertures are filled with a mixture of said resin and ...
09/06/1988
4767654Detachable coupon label
A removable coupon label structure comprising a casting substrate; a resin film attached to the casting substrate to form a composite web; and an adhesive situated on the resin film side of the composite web whereby the composite web is suitable for mount...
08/30/1988
4767679Thin film EL panel
A thin film EL panel including at least a transparent electrode, an EL luminescent layer, an insulating layer and an opposite electrode laminated on a transparent insulating substrate, wherein the thin-film-formed side of the substrate is sealed by a mois...
08/30/1988
4766027Method for making a ceramic multilayer structure having internal copper conductors
The method is directed to a method of forming a hermetic flux-sintered ceramic multilayer structure with internal copper conductor comprising: (a) forming at least one green ceramic layer comprised of a thermoplastic organic binder having dispersed therein a f...
08/23/1988
4759970Electronic carrier devices and methods of manufacture
New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attac...
07/26/1988
4759964Structural panel
A structural panel in the form of a sandwich construction, comprises a core and at least one cover layer on at least one external surface of the core. Said cover layer itself has on its external surface at least a first layer of fibrous material and has o...
07/26/1988
4759965Ceramic, preparation thereof and electronic circuit substrate by use thereof
A ceramic comprises therein two or more dielectric portions having different dielectric constants formed by filling of one or more vacant spaces provided within a dielectric porcelain, a semiconductor porcelain as a precursor of said dielectric porcelain ...
07/26/1988
4759963Fishing pole fastening device
A universally adaptable fastening device for fastening fishing poles to railings, which has a quick release function is provided by an elasticized band of about one foot long having a Velcro fastening mechanism to secure the two ends together. This band i...
07/26/1988
4758459Molded circuit board
A circuit board is molded of a heat resistant synthetic resin. Component mounting positions are formed at the time of molding, the mounting positions comprising formations, such as recesses or protrusions, on at least one surface. A circuit pattern is for...
07/19/1988
4755433Cover film on lipstick sampler
Wax-base or emollient-base cosmetic compositions may be provided as samples on paper carrying sheets by providing the paper with materials that prevent absorption of oleic materials and providing the cosmetic compositions with a lower sheet that is oleoph...
07/05/1988
4755415Optical shutter array and method for making
An optical shutter array comprising a transparent substrate of a material exhibiting an electrooptic effect having parallel channels and electrodes of a conductive resin composition disposed in the channels can be driven with a lower voltage while minimiz...
07/05/1988
4755417Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method
The method ensures the cooling of electronic components fixed on a multilayer, with at least a metal layer interposed between insulating layers, through successive steps for the obtaining of seats or cavities or through-holes with metallized surface, the ...
07/05/1988
4753822Method of providing a bonding, electrically insulating layer, metal ribbon coated with such a layer, and low-loss magnet core
The invention relates to a metal ribbon and a method of manufacturing same, in which a layer or track of magnesium oxide is provided on the metal ribbon by decomposition of magnesium alcoholate which is provided by means of a dosing system which is sealed...
06/28/1988
4753866Method for processing an interlevel dielectric suitable for VLSI metallization schemes
A method of processing an interlevel dielectric layer in a VLSI device having a plurality of leads which includes depositing a layer of photoresist over the dielectric layer. The photoresist is then patterned to open areas where interlevel contacts are to...
06/28/1988
4753694Process for forming multilayered ceramic substrate having solid metal conductors
A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-p...
06/28/1988
4752557Method of radiphotography using light-stimulable radiation image storage panel
A radiation image storage panel having a stimulable phosphor layer provided on a substrate with a honeycomb structure constituted of a number of cells partitioned by wall members filled with the stimulable phosphor is prepared by forming the substrate for...
06/21/1988
4752522Electrostatic recording material
An electrostatic recording material comprising a substrate treated for low electric resistance and a dielectric layer formed on the substrate and composed of a composition comprising an insulating resin having a volume specific resistance of at least 10
06/21/1988
4751146Printed circuit boards
A heat resistant printed circuit board is disclosed which comprises a laminate of: (A) a thin-walled body having a thickness of from 0.2 μm to less than 5 mm and containing a cross-linked product of a mixture of (a) 1 to 99 wt. % of an ethylenic copolyme...
06/14/1988
4751140High-brightness pavement marking sheet material
In a high-brightness pavement marking sheet material, a continuous pattern of a multiplicity of protuberances and depressions is formed on the surface of a base sheet made of rubber, synthetic resin or the like and that glass microspheres are embedded in ...
06/14/1988
4749600Liquid absorbing and immobilizing packet
A packet for absorbing and immobilizing a liquid including an envelope which is degradable in the liquid and a liquid absorbing and immobilizing material in the envelope....
06/07/1988
4749621Electronic components comprising polyimide-filled isolation structures
Electronic components are disclosed comprising an insulator which is the in situ cured reaction product of a polymerizable oligomer which is end capped with a vinyl and/or acetylenic end groups....
06/07/1988
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