| Patent No. | Patent Title: |
| 6184587 | Resilient contact structures, electronic interconnection componen... |
| 5969417 | Chip package device mountable on a mother board in whichever of f... |
| 5959353 | Semiconductor device |
| 5955762 | Microelectronic package with polymer ESD protection |
| 5942797 | Power semiconductor module |
| 5939784 | Shielded surface acoustical wave package |
| 5939785 | Micromechanical device including time-release passivant |
| 5932890 | Field effect transistor loaded with multiquantum barrier |
| 5932924 | Leadframe having continuously reducing width and semiconductor de... |
| 5932923 | Semiconductor device packages having dummy block leads and tie ba... |
| 5925928 | Data carrier card, assembly of at least two data carrier cards an... |
| 5925896 | Surface-emitting semiconductor optical device |
| 5923089 | Efficient routing method and resulting structure for integrated c... |
| 5923084 | Semiconductor device for heat discharge |
| 5920113 | Leadframe structure having moveable sub-frame |
| 5917246 | Semiconductor package with pocket for sealing material |
| 5914535 | Flip chip-on-flip chip multi-chip module |
| 5909055 | Chip package device mountable on a mother board in whichever of f... |
| 5903027 | MOSFET with solid phase diffusion source |
| 5903056 | Conductive polymer film bonding technique |
| 5898203 | Semiconductor device having solid phase diffusion sources |
| 5898192 | Light emitting diode with improved luminous efficiency having a c... |
| 5895969 | Thin type semiconductor device, module structure using the device... |
| 5895976 | Microelectronic assembly including polymeric reinforcement on an ... |
| 5892269 | Semiconductor device including an intrusion film layer |
| 5892287 | Semiconductor device including stacked chips having metal pattern... |
| 5892245 | Ball grid array package emulator |
| 5889324 | Package for a semiconductor device |
| 5886407 | Heat-dissipating package for microcircuit devices |
| 5886397 | Crushable bead on lead finger side surface to improve moldability |
| 5886402 | Semiconductor device card |
| 5880526 | Barrier metal layer |
| 5880494 | Active type photoelectric converting device and an active type ... |
| 5880518 | Semiconductor device including a two-layer protective insulating ... |
| 5877549 | UFBGA package equipped with interface assembly including a photos... |
| 5877533 | Hybrid integrated circuit component |
| 5872397 | Semiconductor device package including a thick integrated circuit... |
| 5872398 | Reduced stress LOC assembly including cantilevered leads |
| 5872375 | Semiconductor device including a pair of field effect transistors... |
| 5869888 | Semiconductor device with lead structure on principal surface of ... |
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