| Patent No. | Patent Title: |
| 6900524 | Resin molded semiconductor device on a lead frame and method of m... |
| 6888243 | Semiconductor device |
| 6855575 | Semiconductor chip package having a semiconductor chip with cente... |
| 6838767 | Semiconductor device |
| 6825547 | Semiconductor device including edge bond pads |
| 6803258 | Semiconductor device |
| 6800942 | Vertically mountable semiconductor device and methods |
| 6791194 | Circuit tape having adhesive film, semiconductor device, and a me... |
| 6791185 | Apparatus and methods of testing and assembling bumped devices us... |
| 6787926 | Wire stitch bond on an integrated circuit bond pad and method of ... |
| 6787897 | Wafer-level package with silicon gasket |
| 6784534 | Thin integrated circuit package having an optically transparent w... |
| 6770980 | Semiconductor device having semiconductor element packaged on int... |
| 6765720 | Glass microspheres for use in films and projection screen display... |
| 6762505 | 150 degree bump placement layout for an integrated circuit power ... |
| 6753556 | Silicate gate dielectric |
| 6744121 | Multi-chip package |
| 6734555 | Integrated circuit package and printed circuit board arrangement |
| 6727582 | Semiconductor device |
| 6716673 | Two-pole SMT miniature housing for semiconductor components and m... |
| 6717255 | Chip carrier for a high-frequency electronic package |
| 6717279 | Semiconductor device with recessed portion in the molding resin |
| 6713815 | Semiconductor device with transistors that convert a voltage diff... |
| 6713792 | Integrated circuit heat sink device including through hole to fac... |
| 6713862 | Low temperature co-fired ceramic-metal packaging technology |
| 6713844 | Semiconductor-chip mounting substrate having at least one project... |
| 6710433 | Leadless chip carrier with embedded inductor |
| 6710446 | Semiconductor device comprising stress relaxation layers and meth... |
| 6707139 | Semiconductor device with plural unit regions in which one or mor... |
| 6707148 | Bumped integrated circuits for optical applications |
| 6707149 | Low cost and compliant microelectronic packages for high i/o and ... |
| 6707168 | Shielded semiconductor package with single-sided substrate and me... |
| 6707153 | Semiconductor chip with plural resin layers on a surface thereof ... |
| 6707167 | Semiconductor package with crack-preventing member |
| 6703701 | Semiconductor device with integrated circuit elements of group II... |
| 6700203 | Semiconductor structure having in-situ formed unit resistors |
| 6700207 | Flip-chip ball grid array package for electromigration testing |
| 6700162 | Chip structure to improve resistance-capacitance delay and reduce... |
| 6700178 | Package of a chip with beveled edges |
| 6700200 | Reliable via structures having hydrophobic inner wall surfaces |
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