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| Number | Title | Issue Date |
| 8186565 | Method of bonding aluminum-boron-carbon composites An aluminum-boron-carbon (ABC) ceramic-metal composite bonded to a metal or metal-ceramic composite other than ABC composite is made by forming a porous body comprised of particulates being comprised of a boron-carbon compound that has a particulate layer of titaniu... | 05/29/2012 |
| 8186564 | Brazing preform manufacture A method and apparatus for forming a brazing preform. The preform is made utilizing a brazing preform member having a first shaped end and a second shaped end. The first and second shaped ends are mated in a friction fit without any welding to provide the brazing pr... | 05/29/2012 |
| 8186562 | Apparatus for increasing coverage of shielding gas during wire bonding A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding... | 05/29/2012 |
| 8186563 | Automatic soldering device and carrier device To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b | 05/29/2012 |
| 8186568 | Assembly of two parts of an integrated electronic circuit A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding, realized on respective application surfaces of the two parts. During a secon... | 05/29/2012 |
| 8186566 | Method for cohesively bonding metal to a non-metallic substrate A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of press... | 05/29/2012 |
| 8181844 | Method for the permanent connection of two components by means of glass or metal solder The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer sy... | 05/22/2012 |
| 8181841 | Linear friction welder with rocker arms A linear friction welding system in one embodiment includes a ram configured to vibrate along a welding axis, at least one rocker arm with a first end portion spaced apart from the welding axis and constrained against movement along the welding axis, and a second en... | 05/22/2012 |
| 8181842 | Device for assembly by brazing an end cap onto a cylindrical body and vacuum cartridge comprising one such device The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a part of one of the end surfaces of the cylindrical body, this device bei... | 05/22/2012 |
| 8181846 | Method of full-field solder coverage using a vacuum fill head A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area... | 05/22/2012 |
| 8181843 | Friction stir welding method and its device In a friction stir welding method, a tool is moved being rotated along portions to be joined of a work piece, where the portions include a corner with a smaller curvature that connect two portions with larger curvatures. The method includes the steps of setting the ... | 05/22/2012 |
| 8181845 | Electrical bond connection system An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At... | 05/22/2012 |
| 8177114 | Method for eliminating carbon contamination of platinum-containing components for a glass making apparatus In the formation of sheet material from molten glass, molten glass is formed in a melting furnace and transported through a precious metal delivery system to the forming apparatus. Disclosed herein is a method to mitigate carbon contamination of individual component... | 05/15/2012 |
| 8177115 | Method and system for retreading track wheel A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway w... | 05/15/2012 |
| 8172125 | Vehicle door frame and method of producing the same A vehicle door frame includes first and second door frame members which are positioned end-to-end to be butt-welded to each other, wherein each of the first and second door frame members includes a design part, an enclosed section provided on a vehicle interior side... | 05/08/2012 |
| 8167189 | Methods for rework of a solder Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, ... | 05/01/2012 |
| 8167190 | Electrically conductive polymer compositions containing metal particles and a graphene and methods for production and use thereof Polymer compositions containing a polymer matrix, a graphene that is covalently bonded to the polymer matrix and metal particles are described herein. A combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percol... | 05/01/2012 |
| 8167191 | High temperature seal for joining ceramic components such as cells in a ceramic oxygen generator A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze compri... | 05/01/2012 |
| 8167188 | Friction stir welding method A friction stir welding method includes providing a joining tool including a friction surface, a first workpiece, and a second workpiece, and arranging the first workpiece and second workpiece in position with a first joining surface abutting a second joining surfac... | 05/01/2012 |
| 8162201 | Method for laying pipeline using motorized elements The present invention consists in a system and a method for installation of duct lines and/or pipelines comprising a pipe shop, supporting, rolling and guiding elements previously provided along a path of duct line/pipeline designed to be formed, the quantity of ele... | 04/24/2012 |
| 8162203 | Spherical solder reflow method The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The proce... | 04/24/2012 |
| 8157157 | Solder ball loading mask, apparatus and associated methodology A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the ... | 04/17/2012 |
| 8141764 | Friction stir welding apparatus, system and method A friction stir welding system is provided herein. More specifically, traditional friction stir welding requires a rotatable head that is forced against a plurality of work pieces to bond the same. The rotational and normal forces generated by the friction stir weld... | 03/27/2012 |
| 8141765 | Cutting blade for a wire bonding system A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proxim... | 03/27/2012 |
| 8141767 | Method for making transmission electron microscope micro-grid A method for making a TEM micro-grid is provided. The method includes the following steps. A carrier, a carbon nanotube structure, and a protector are provided. The carrier defines a first through opening. The protector defines a second through opening. The protecto... | 03/27/2012 |
| 8136715 | Internal pipe clamp alignment guides with purge backup This invention relates to an apparatus for clamping adjacent ends of pipe sections to be welded, the apparatus comprising a plurality of clamping members movable between retracted and extended clamping positions, each of the clamping members comprising a clamping sh... | 03/20/2012 |
| 8132708 | Friction stir welding apparatus, system and method A method of performing friction stir welding is provided herein. More specifically, traditional friction stir welding requires a rotatable head that is forced against a plurality of work pieces to bond the same. The rotational and normal forces generated by the fric... | 03/13/2012 |
| 8132707 | Flow soldering apparatus and flow soldering method using a water content sensor The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the presen... | 03/13/2012 |
| 8127979 | Electrolytic depositon and via filling in coreless substrate processing Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a dielectric material on the core. The method also includes forming vias in the ... | 03/06/2012 |
| 8123107 | Method for forming sputter target assemblies The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, atta... | 02/28/2012 |
| 8123108 | Method of manufacturing semiconductor device and wire bonding apparatus A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is posi... | 02/28/2012 |
| 8123109 | Method for making brazed heat exchanger and apparatus Disclosed is a heat exchanger comprising a boiling passage and cooling passage defined by opposite sides of metal walls. Layers of brazing material between the metal walls and a spacer member bond components of the heat exchanger together. An enhanced boiling layer ... | 02/28/2012 |
| 8123110 | Method for soldering with a multistep temperature profile A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at... | 02/28/2012 |
| 8123104 | Friction welding apparatus, system and method A friction stir welding apparatus is provided herein. More specifically, traditional friction stir welding requires a rotatable head that is forced against a plurality of work pieces to bond the same. The rotational and normal forces generated by the friction stir w... | 02/28/2012 |
| 8123111 | Production method of solder circuit board A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the pr... | 02/28/2012 |
| 8118209 | Ultrasonic welding apparatus and ultrasonic welding method An ultrasonic welding apparatus 1 includes an anvil equipped with a terminal clamp 3 for disposing an electrical contact part 31 connected to an electronic device and a core wire weld part 32 which ranges to the electrical contact part | 02/21/2012 |
| 8118210 | Methods and apparatus for applying metallic cladding to interior surfaces of pipe elbows An apparatus for applying a helical cladding bead to the interior surface of a pipe elbow has a rotor mounted to an elbow carriage so as to be rotatable about a primary axis. The elbow carriage is longitudinally movable parallel to the rotor's rotational axis. A rad... | 02/21/2012 |
| 8118211 | Method for the low-temperature pressure sintering of electronic units to heat sinks A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following steps: pressing the electronic unit using a mold enveloping matrix whil... | 02/21/2012 |
| 8113411 | Universal radio frequency shield removal Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identic... | 02/14/2012 |
| 8113412 | Methods for detecting defect connections between metal bumps A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. G... | 02/14/2012 |
