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| Number | Title | Issue Date |
| 6722555 | Friction stir welding method On a main shaft 30 of a numeric control type machine tool, a rotary tool 50 is installed. The main shaft 30 is not inclined in the machine tool. A first member 70 and a second member 76 to be subjected to friction stir welding are ... | 04/20/2004 |
| 6702175 | Method of soldering using lead-free solder and bonded article prepared through soldering by the method There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the... | 03/09/2004 |
| 6662993 | Bondhead lead clamp apparatus An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wi... | 12/16/2003 |
| 6655574 | Apparatus for selective soldering The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially verti... | 12/02/2003 |
| 6653590 | Projection bolt welding device A projection bolt feed unit (14) is mounted on a welding frame (5) which is made to move by a robot system (1), and on either one of two electrodes (6, 7) installed on the welding frame (5) is formed a receiving hole (9) in which to insert a shaft (11). T... | 11/25/2003 |
| 6648209 | Process for producing welded steel pipes with a high degree of strength, ductility and deformability In a process for producing welded steel pipes, a pipe is molded cold from a TM-rolled sheet, welded together and sized to the desired diameter, whereby the sheet includes steel with (in wt. %) 0.02 to 0.20% carbon, 0.05 to 0.50% silicon, 0.50 to 2.50% man... | 11/18/2003 |
| 6641029 | Guide assembly for cutting torch A holder secured to the tip of a cutting torch supports a guide about which a hole is to be cut in a steel pipe or sheet. A fixture, magnetically attached to the pipe or sheet supports a magnetically retained fitting to be tack welded to the cut hole at t... | 11/04/2003 |
| 6637642 | Method of solid state welding and welded parts A method of solid state welding for joining metal parts having opposed planar and parallel surfaces which includes quickly heating the opposed surfaces of the metal parts with a high frequency induction heater to the hot working temperature of the metal p... | 10/28/2003 |
| 6637637 | Reflow apparatus A reflow apparatus includes at least one heating unit. Each of the at least one heating unit includes an air blower for circulating air; a partition for defining an air circulating path; at least a first slit heater and a second slit heater for heating a ... | 10/28/2003 |
| 6637643 | Method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles A method for applying at least one bond coating on a surface of a metal-based substrate is described. A foil of the bond coating material is first attached to the substrate surface and then fused thereto, e.g., by brazing. The foil is often initially prep... | 10/28/2003 |
| 6639194 | Method for manufacturing a multiple walled tube A method for manufacturing a multiple walled tube comprising a rolling of a plated metal strip through at least two complete revolutions to form a tube having at least a double wall which has a plated layer on the inside of the tube, said rolling being fo... | 10/28/2003 |
| 6637644 | Method of manufacturing heat insulating structural and/or light elements and installation for carrying out the method A method of manufacturing heat-insulating structural and/or light elements composed of at least two wall elements of glass, a glass alloy or metal, wherein the wall elements are separated from each other by support elements and are provided on at least on... | 10/28/2003 |
| 6634543 | Method of forming metallic z-interconnects for laminate chip packages and boards Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperat... | 10/21/2003 |
| 6634538 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/21/2003 |
| 6626349 | Large vibration tool, especially for welding applications Large vibration tool, vibrating at ultrasonic frequency, especially for applications in the welding, joining or cutting of materials, especially thermoplastics, in cleaning or emulsifying by the activation of a liquid medium, in gas spraying or in shot bl... | 09/30/2003 |
| 6626352 | Soldering method for sealing on-line transfer device of cable and products made thereby A soldering method is designed to seal an on-line transfer device of cable such that a housing of the device is sealed off to prevent the electromagnetic interference. The method includes a first step in which a fusing portion between a receiving seat and... | 09/30/2003 |
| 6622907 | Sacrificial seed layer process for forming C4 solder bumps Start with a semiconductor substrate with contacts exposed through an insulating layer. Form a base over the contacts, with the base composed of at least one metal layer. Then form a conductive metal layer over the base. Form a mask over the top surface o... | 09/23/2003 |
| 6624387 | Process for MSG-soldering and use of a shielding gas The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby a shielding gas that essentially consists of inert gas is... | 09/23/2003 |
| 6622903 | Production of a tailless ball bump A method of producing a ball bump on a workpiece employs a capillary having a passageway therethrough. A wire extends through the passageway and has a ball formed on its end below the capillary. The capillary is positioned above a bond site and is lowered... | 09/23/2003 |
| 6622906 | Welding method and welding device The welding apparatus has a positioner (1) provided with workpiece supporting means (11) which is rotatable about a first central axis (Ca) and is pivotable up and down about a second central axis (Cb) crossing the first central axis (Ca). A welding robot... | 09/23/2003 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A sho... | 09/16/2003 |
| 6619531 | Temperature control method of solder bumps in reflow furnace, and reflow furnace A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor... | 09/16/2003 |
| 6621036 | Programmable pogo welding apparatus and method A pogo welding apparatus especially for spot welding metal sheets at selected locations spaced away from their edges wherein the sheets are held in a temporary assembly with the selected locations engaged and separate programmable positioners move a prima... | 09/16/2003 |
| 6619536 | Solder process and solder alloy therefor A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver... | 09/16/2003 |
| 6619534 | Friction stir welding method using members which overlap and have protrusion at the weld location prior to the welding Disclosed is a friction stir welding technique which avoids occurrence of a dent, in adjoining region, extending to a level beneath the joined surfaces, structural body formed. At end portions of the frame members to be joined, at the joining region, thic... | 09/16/2003 |
| 6619533 | Multi-piece extruded link arm Link arms for use in suspension systems are produced through an extrusion and friction stir welding process. Blocks having an eye and a planar body section are formed through an extrusion process. These sections are then paired together and joined through... | 09/16/2003 |
| 6616031 | Apparatus and method for bond force control An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compens... | 09/09/2003 |
| 6612481 | Wellscreen An apparatus and method of manufacturing a wellscreen for subterranean use in oil, gas, and water wells, incorporating numerous automated processes, whereby layers of mesh are continuously sintered to a perforated strip, formed into a tube, placed over a ... | 09/02/2003 |
| 6613999 | Method of joining a sintered hard alloy member to a stainless steel member and method of making a cutting tool therefrom A method of joining a sintered hard alloy member 1 such as a cylindrical rod-shaped twist drill bit blank made of material whose main component is tungsten carbide to a softer metal member such as a stainless steel shank 2 includes the steps of connecting... | 09/02/2003 |
| 6607121 | Quick change precisor A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignm... | 08/19/2003 |
| 6607116 | Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained... | 08/19/2003 |
| 6607837 | Structural body formed by friction stir welding method Disclosed is a friction stir welding technique which avoids occurrence of a dent, in adjoining region, extending to a level beneath the joined surfaces. At end portions of the frame members to be joined, at the joining region, thickened parts which projec... | 08/19/2003 |
| 6604673 | Filling device and method for filling balls in the apertures of a ball-receiving element A filling device for and a method of filling balls in an array of apertures in a ball-receiving element, the filling device comprising: a housing including an opening at a lower surface thereof and defining in part a chamber for containing a supply of bal... | 08/12/2003 |
| 6604670 | Lead penetrating clamping system An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp... | 08/12/2003 |
| 6604671 | Bondhead lead clamp apparatus and method A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to prov... | 08/12/2003 |
| 6604667 | Device for joining, by friction stir welding, at least two workpieces In a device for joining, by friction stir welding, at least two workpieces, a support structure is provided with a head portion which includes drive means and a shaft which is rotatable by the drive means and has a pin-like projection projecting toward a ... | 08/12/2003 |
| 6604669 | Manifold for heat exchanger and process therefor Manifold for a heat exchanger intended to be joined by brazing or soldering to heat transfer tubes. A portion of a surface of the manifold that will be joined to the tubes is proved with at least one recess in which a brazing material is mechanically lock... | 08/12/2003 |
| 6601750 | Integrated clamping and clinching device, particularly for joining sheet-metal panels and the like Described herein is an integrated clamping and clinching device for sheet-metal panels which simultaneously performs a clamping operation on two or more panels in the precise assembly condition, and application of at least one clinching point for obtainin... | 08/05/2003 |
| 6598779 | Electronic component mounting method An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste (4) is supplied to electrodes (2) for receiving surface-mount c... | 07/29/2003 |
| 6595400 | Wire bonding apparatus In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and ... | 07/22/2003 |
