Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 5885853 | Hollow chip package and method of manufacture Semiconductor package and method in which a chip is mounted in an opening in a frame with the back side of the chip facing outside the package, and a heatsink is positioned in direct thermal contact with the back side of the chip. In one preferred method ... | 03/23/1999 |
| 5597765 | Method for making termination structure for power MOSFET A termination structure (located along a transistor perimeter or a die edge) for a trenched MOSFET or other semiconductor device prevents the undesirable surface channelling phenomena without the need for any additional masking steps to form a channel sto... | 01/28/1997 |
| 5593925 | Semiconductor device capable of preventing humidity invasion In an IC chip having an interlevel insulation film constituted by a first level silicon oxide film, a spin-on-glass film, a second level silicon oxide film, the SOG film is partially removed in a buffer region of a closed loop shape inside of the chip per... | 01/14/1997 |
| 5567657 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers First and second flexible interconnect structures are provided and each includes a flexible interconnect layer and a chip with a surface having chip pads attached to the flexible interconnect layer. Molding material is inserted between the flexible interc... | 10/22/1996 |
| 5534443 | Method of manufacturing a solid state imaging device The method of manufacturing a solid state imaging device of the invention comprises a step of adding carboxylate as a dyeing assistant auxiliary to the aqueous dyestuff solution when forming dyeing layers of acrylic-based resin on a semiconductor substrat... | 07/09/1996 |
| 5534465 | Method for making multichip circuits using active semiconductor substrates In accordance with the invention, a multichip circuit is fabricated by providing an active semiconductor substrate comprising a set of isolated components including active components such as transistors, forming on a surface of the substrate a plurality o... | 07/09/1996 |
| 5529959 | Charge-coupled device image sensor A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding... | 06/25/1996 |
| 5529936 | Method of etching a lens for a semiconductor solid state image sensor Methods of etching optical elements in association with photosensitive elements are described. In some of the arrangements, the optical elements are formed integrally with a substrate containing the photosensitive elements. In other arrangements, an optic... | 06/25/1996 |
| 5529955 | Wiring forming method An insulating layer 6 is formed covering a lower level wiring layer 5. Contact hole 11 registered with the lower level wiring 5 is then formed in the insulating layer 6. An adhesion layer 12 is formed on the lower level wiring layer 5 and a whole surface ... | 06/25/1996 |
| 5527743 | Method for encapsulating an integrated circuit package The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing betwee... | 06/18/1996 |
| 5527741 | Fabrication and structures of circuit modules with flexible interconnect layers A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallizat... | 06/18/1996 |
| 5525528 | Ferroelectric capacitor renewal method Ferroelectric capacitors in an integrated memory are renewed to improve retention performance. The renewal method is performed on a wafer containing ferroelectric memory die. In one method, a rejuvenation anneal is performed after all electrical tests, in... | 06/11/1996 |
| 5525546 | Semiconductor device and method of manufacturing thereof A semiconductor device has a conductive interconnection layer formed on a semiconductor substrate covered with a protection insulation film. A pad electrode opening is provided in the protection insulation film so that the surface of the conductive interc... | 06/11/1996 |
| 5523257 | Mis semiconductor device and method of fabricating the same The invention is concerned with the fabrication of a MIS semiconductor device of high reliability by using a low-temperature process. Disclosed is a method of fabricating a MIS semiconductor device, wherein doped regions are selectively formed in a semico... | 06/04/1996 |
| 5523252 | Method for fabricating and inspecting semiconductor integrated circuit substrate, and semi-finished product used for the sustrate The turn around time required for fabricating a semiconductor integrated circuit from initial conception through packaging may be dramatically reduced by testing the electrostatic integrity of the integrated circuit during fabrication rather than after pa... | 06/04/1996 |
| 5523248 | Method for manufacturing MOS transistors with high breakdown voltage A semiconductor device in which low voltage elements and high voltage elements are formed on the same substrate. To simplify the manufacturing process of semiconductor devices and to improve the punch through voltage resistance between elements, when high... | 06/04/1996 |
| 5521123 | Infrared sensor and method for production thereof The disclosed infrared sensor comprises a substrate provided with a bridging part and a sensing part made of an infrared temperature-sensitive film formed on the bridging part. A first lid member covers the sensing part and bridging part and a second lid ... | 05/28/1996 |
| 5521124 | Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals The method includes the steps of (i). preparing a substrate from a fiber glass reinforced plastic board, then processing the substrate with terminal mounting holes and pre-scared grooves, (ii) fastening lead wire terminals or lead frame terminals to the t... | 05/28/1996 |
| 5518964 | Microelectronic mounting with multiple lead deformation and bonding A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to ... | 05/21/1996 |
| 5516727 | Method for encapsulating light emitting diodes A method of encapsulating semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant f... | 05/14/1996 |
| 5516732 | Wafer processing machine vacuum front end method and apparatus A carrousel type wafer processing machine in which wafers are held in vertical orientations in holders on a rotatable plate and sequenced through a plurality of processing stations for processing, such as by the application of a sputtered film thereto, is... | 05/14/1996 |
| 5514626 | Method for reducing heterostructure acoustic charge transport device saw drive power requirements A HACT device employing a thin-film overlay of a more strongly piezoelectric material can operate as a delay line and as a tapped delay line, or transversal filter, while requiring less total power for the SAW clock signal. The increased electrical potent... | 05/07/1996 |
| 5510299 | Method for the manufacture of IC-processed micro electro-static motors A method for manufacturing a micro electro-static motor which is provided with a curved bearing structure for rotatably supporting the rotor of the micro electro-static motor in a line contact manner in order to reduce the frictional torque of the micromo... | 04/23/1996 |
| 5508210 | Element isolating method for compound semiconductor device A method of element isolation includes implanting ions in a compound semiconductor substrate at the periphery of a semiconductor device in the substrate to produce a first insulating region having a region of maximum implanted ion concentration within a b... | 04/16/1996 |
| 5508223 | Method for manufacturing DRAM cell with fork-shaped capacitor An efficient method for manufacturing a fork-shaped capacitor, for use as part of a DRAM cell, is described. Starting with a partially completed silicon integrated circuit, comprising a plurality of Field Effect Transistors, the electrode contacting the g... | 04/16/1996 |
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with... | 04/16/1996 |
| 5508231 | Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits A preferred embodiment of an integrated semiconductor device includes a semiconductor die having a hole therethrough. A paddle member includes a handle member connected between the paddle member and the semiconductor die to suspend the paddle member in th... | 04/16/1996 |
| 5508232 | Method of manufacturing a semiconductor device In a method of manufacturing a semiconductor device, overlaid on a first lead frame including a die pad supported by a plurality of die pad suspending leads is a second lead frame having connecting leads wherein the first and second lead frames are dispos... | 04/16/1996 |
| 5506174 | Automated assembly of semiconductor devices using a pair of lead frames Semiconductor rectifier devices having oppositely extending terminals lying in a common plane are fabricated using upper and lower lead frames each comprising a pair of parallel side rails and spaced apart cross bars extending between the side rails. Cant... | 04/09/1996 |
| 5501995 | Method for manufacturing a gate electrode of a MOS transistor A method for manufacturing an electrode, e.g., a gate electrode of a MOS transistor, and an electrode and MOS transistor manufactured in accordance with this method. The method includes the steps of forming a first diffusion preventing layer on an underly... | 03/26/1996 |
| 5498575 | Bonding film member and mounting method of electronic component A method of mounting electronic components on circuit boards, which includes the steps of obtaining a bonding film member by filling bonding material into openings in a predetermined pattern of an electrically-insulating and heat-proof film and holding th... | 03/12/1996 |
| 5496775 | Semiconductor device having ball-bonded pads An integrated circuit (IC) device comprises towers of bonded gold balls located on each bond pad. The towers allow for early encapsulation of the IC die. The IC can then be tested and attached to tab tape or a printed circuit board without particulate con... | 03/05/1996 |
| 5494856 | Apparatus and method for creating detachable solder connections A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semi... | 02/27/1996 |
| 5494859 | Low dielectric constant insulation layer for integrated circuit structure and method of making same A low dielectric constant insulation layer for an integrated circuit structure material, and a method of making same. The low dielectric constant insulation layer comprises a porous insulation layer, preferably sandwiched between non-porous upper and lowe... | 02/27/1996 |
| 5494854 | Enhancement in throughput and planarity during CMP using a dielectric stack containing HDP-SiO2 films A semiconductor device and process for making the same are disclosed which uses a dielectric stack to improve fabrication throughput, gap-fill, planarity, and within-wafer uniformity. A gap-fill dielectric layer 34 (which preferably contains an integral s... | 02/27/1996 |
| 5492863 | Method for forming conductive bumps on a semiconductor device Conductive bumps (24) are formed on a semiconductor device (10) by applying or depositing an imageable conductive layer (18) over the device and in contact with I/O pads of a final metallization layer (14). The imageable conductive material is formed of a... | 02/20/1996 |
| 5492842 | Substrate subassembly and method of making transistor switch module A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at signif... | 02/20/1996 |
| 5491111 | Method of making a semiconductor diode A method of making a semiconductor diode including the steps of: i) stamping a sheet form metal to form a conductor element having a jumper electrode and a bottom electrode, bending connecting strips between the electrodes into a corrugated configuration ... | 02/13/1996 |
| 5491110 | Metal semiconductor package with an external plastic seal An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the ... | 02/13/1996 |
| 5487999 | Method for fabricating a penetration limited contact having a rough textured surface A method for forming contacts for establishing an electrical connection with contact locations on a semiconductor die is provided. The contacts are formed as raised members mounted on a compliant substrate. Each contact includes a rough textured surface h... | 01/30/1996 |
