| Patent No. | Patent Title: |
| 5923951 | Method of making a flip-chip bonded GaAs-based opto-electronic de... |
| 5904500 | Method for the preparation of lead-on-chip assemblies |
| 5897335 | Flip-chip bonding method |
| 5874319 | Vacuum die bond for known good die assembly |
| 5869406 | Method for forming insulating layers between polysilicon layers |
| 5856212 | Method of producing semiconductor package having solder balls |
| 5843809 | Lead frames for trench drams |
| 5843807 | Method of manufacturing an ultra-high density warp-resistant memo... |
| 5843829 | Method for fabricating a semiconductor device including a step fo... |
| 5840597 | Method of making a semiconductor device force and/or acceleration... |
| 5834338 | Chip carrier semiconductor device assembly and a method for formi... |
| 5834370 | Manufacture of semiconductor device containing polycide electrode |
| 5834335 | Non-metallurgical connection between an integrated circuit and a ... |
| 5830774 | Method for forming a metal pattern on a substrate |
| 5830782 | Microelectronic element bonding with deformation of leads in rows |
| 5817543 | Method of constructing an integrated circuit memory |
| 5817545 | Pressurized underfill encapsulation of integrated circuits |
| 5810945 | Method of fabricating an electronic micropatterned electrode devi... |
| 5810924 | Low defect density/arbitrary lattice constant heteroepitaxial lay... |
| 5807768 | Method for fabricating a heat sink-integrated semiconductor packa... |
| 5804456 | Method and apparatus for chemically generating terminal bumps on ... |
| 5804504 | Method for forming wiring of semiconductor device |
| 5801074 | Method of making an air tight cavity in an assembly package |
| 5786271 | Production of semiconductor package having semiconductor chip mou... |
| 5786269 | II-VI group compound semiconductor device and method for manufact... |
| 5786230 | Method of fabricating multi-chip packages |
| 5786239 | Method of manufacturing a semiconductor package |
| 5783461 | Temporary semiconductor package having hard-metal, dense-array ba... |
| 5783466 | Semiconductor device and method of manufacturing the same |
| 5780361 | Salicide process for selectively forming a monocobalt disilicide ... |
| 5780362 | CoSi2 salicide method |
| 5776802 | Semiconductor device and manufacturing method of the same |
| 5776801 | Leadframe having contact pads defined by a polymer insulating fil... |
| 5766984 | Method of making a vertical integrated circuit |
| 5763297 | Integrated circuit carrier having lead-socket array with various ... |
| 5763325 | Fabrication process of a semiconductor device using a slurry cont... |
| 5759875 | Reduced filler particle size encapsulant for reduction in die sur... |
| 5756378 | Method of and apparatus for laser processing |
| 5753538 | Method of sealing electronic parts with molded resin and mold emp... |
| 5753537 | Method of manufacturing a semiconductor device for surface mounti... |
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