Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 6507106 | Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapes A semiconductor module of the type having a number of semiconductor chips disposed on a chip carrier has at least a second subset of the semiconductor chips disposed above a first subset and conductive connections between the semiconductor chips disposed ... | 01/14/2003 |
| 6359232 | Electrical insulating material and stator bar formed therewith Resin-impregnated sheet materials, such as fabrics, films, paper and tapes, for forming electrical insulation that exhibits significantly improved voltage endurance performance. The present invention finds particular use as groundwall insulation for high ... | 03/19/2002 |
| 6359236 | Mounting component with leads having polymeric strips A semiconductor chip mounting component includes a support structure having top and bottom surfaces and an edge, a plurality of electrically conductive leads, not attached to a chip, each lead having a first end securement section secured to the support s... | 03/19/2002 |
| 6326555 | Method and structure of z-connected laminated substrate for high density electronic packaging Structures, methods and materials for making multilayer circuit substrates are disclosed. The structures include bumped structures or microencapsulated conductive particles suitable for use in a lamination process to make a multilayer printed circuit subs... | 12/04/2001 |
| 6310304 | Electronic part fabricated by intaglio printing A pattern, in which a groove of an optional position is deeper than that of the other portion, is formed on a surface of a flexible resin sheet by laser process, and then a release layer is formed on the surface of the thus obtained pattern, thereby formi... | 10/30/2001 |
| 6310300 | Fluorine-free barrier layer between conductor and insulator for degradation prevention Integrated circuit structure having improved resistance in metal against degradation from exposure to fluorine released from a fluorine-containing material by forming a fluorine barrier layer between the insulator material and the metal. The invention is ... | 10/30/2001 |
| 6281445 | Device and method for connecting two electronic components A connection device for use in connection between two electronic components and a connection device provided on a first electronic component. The connection device includes two metal layers which have mutually different coefficients of thermal expansion, ... | 08/28/2001 |
| 6274823 | Interconnection substrates with resilient contact structures on both sides An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate membe... | 08/14/2001 |
| 6265669 | Semiconductive attachment disc for insulators to reduce electrical stress-induced corrosion Insulator terminator device, for attachment to the top or bottom of a high voltage power line insulator having a conventional end fitting, for prevention of high surface leakage currents and corona discharges, and the corrosive and erosion effects produce... | 07/24/2001 |
| 6259039 | Surface mount connector with pins in vias A surface mountable pin connector has a substrate or a circuit board carrier, which has a number of through holes or vias formed therein, and a number of connector pins, each of which is soldered into a respective one of the through holes with high melt t... | 07/10/2001 |
| 6256877 | Method for transforming a substrate with edge contacts into a ball grid array The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from ... | 07/10/2001 |
| 6255595 | Superconducting cable with the phase conductors connected at the ends A superconducting cable for high power with at least one phase includes a superconducting core wherein a plurality of elements are housed, which are structurally independent and magnetically uncoupled, each of which includes--for each phase--a couple of p... | 07/03/2001 |
| 6255596 | Aluminum stabilized superconductor with Cu and Mg A tube made of oxygen free copper is filled with a plurality of copper matrix Nb--Ti superconducting lead wires to obtain a composite billet. The resulting billet is subjected to hydrostatic pressure extrusion. Further, ageing heat treatment and wire draw... | 07/03/2001 |
| 6252179 | Electronic package on metal carrier An electronic circuit package includes a metal carrier, a first dielectric layer of an epoxy glass material, a first electrically conductive circuit layer, a second dielectric layer, a second electrically conductive circuit layer and an electrical interco... | 06/26/2001 |
| 6252174 | Lead wire strain relief connector and switch mount A lead wire strain relief connector and switch mount is configured to be attached to a surface of an electrical device to secure lead wires of a switch employed in the device, resisting the lead wires from being pulled from the device. The connector and s... | 06/26/2001 |
| 6252178 | Semiconductor device with bonding anchors in build-up layers A semiconductor device and method that provides for the manufacture of semiconductor devices using high temperature wire bonding in combination with build-up layers having a low glass transition temperature. Anchors are created to serve as thermal gateway... | 06/26/2001 |
| 6248961 | Wave solder application for ball grid array modules and solder plug A method and product for fabricating a printed circuit board assembly comprising a via, wherein the method inhibits the flow of molten solder into the via during a wave soldering step, thereby preventing heat transfer that might otherwise degrade a solder... | 06/19/2001 |
| 6248962 | Electrically conductive projections of the same material as their substrate An electrically conductive apparatus includes, a) an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced from the base surface by a first distance thereby defining ... | 06/19/2001 |
| 6248959 | Substrate with die area having same CTE as IC A package for mounting an integrated circuit chip includes a body having at least a first region, the size of the integrated circuit chip, and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has ... | 06/19/2001 |
| 6246012 | Electroplated conductive carbon fibers with adhesive An electrical component has at least one end adapted to be electrically connected to another component. The electrical component includes a support with a plurality of electrically conductive fibers having at least a portion thereof extending outwardly th... | 06/12/2001 |
| 6245996 | Electrical interconnect structure having electromigration-inhibiting segments An integrated circuit is formed having electrical conductors with electromigration-inhibiting/electrically conductive plugs disposed between electrically conductive segments of the electrical conductor. Windows are formed within a planar surface. An ... | 06/12/2001 |
| 6235991 | Recessed mechanical fasteners for circuit boards An assembly including a back plate and a circuit board coupled to the back plate with mechanical fasteners is provided. The fastener has an end and a head with a top surface. The top surface of the head is between the top and bottom surfaces of the circui... | 05/22/2001 |
| 6235994 | Thermal/electrical break for printed circuit boards A multi-layer printed circuit board including at least one layer of an electrically conducting material and at least one layer of an electrically insulating material. At least one through hole formed at least through the at least one layer of electrically... | 05/22/2001 |
| 6235997 | LSI package with equal length transmission Lines An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which differential signals are transmitted and are adjacent to ea... | 05/22/2001 |
| 6232558 | Electronic component mounting base board having heat slug with slits and projections An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat ma... | 05/15/2001 |
| 6230399 | Backside encapsulation of tape automated bonding device A TAB device (10) is coupled to a circuit board (12). The TAB device (10) includes a semiconductor die (11) having leads (18) extending therefrom. A material layer (30), typically a polyimide layer, covers the inward portion of the leads (18) to maintain ... | 05/15/2001 |
| 6229099 | Multi-layer circuit board with particular pad spacing The invention is concerned with a multi-layer circuit board for mounting an electronic part such as a semiconductor chip having as many pins as 40×40 pins arranged as an array on the side of the mounting surface or a semiconductor device having lands arr... | 05/08/2001 |
| 6229096 | Nonwoven reinforcement for printed wiring base board and process for producing the same There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290° C. or higher (component ... | 05/08/2001 |
| 6225572 | Connecting an electronic card point to a printed circuit on a metal substrate with a capsule An assembly including a printed-circuit electronics card mounted on a metal substrate, and in electronic communication with the same, includes a capsule which is crimped into a cavity in the metal substrate and which extends through a hole in the electron... | 05/01/2001 |
| 6222136 | Printed circuit board with continuous connective bumps A printed circuit board comprising a plurality of conductive bumps having substantially coplanar upper surfaces is provided. The circuit board is formed by providing: a substantially planar metallic layer having a first thickness on at least one surface o... | 04/24/2001 |
| 6218629 | Module with metal-ion matrix induced dendrites for interconnection A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to a... | 04/17/2001 |
| 6215076 | Printed circuit board with noise suppression Noise frequency generated from a circuit is determined. The distance between two arbitrary lines of a plurality of power feed lines or a plurality of power return lines extending parallel to each other is determined on the basis of the determined noise fr... | 04/10/2001 |
| 6211468 | Flexible circuit with conductive vias having off-set axes A flexible circuit includes a flexible non-conductive substrate having a first surface and a second surface. A first electrically conductive trace is provided on the first surface and a second electrically conductive trace is provided on the second surfac... | 04/03/2001 |
| 6207904 | Printed wiring board structure having continuous graphite fibers A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of an organic matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween a... | 03/27/2001 |
| 6207906 | PCB having holes between terminals and method of making the same A printed circuit board (PCB) for mounting a dielectric radio frequency (RF) band pass filter (BPF) thereon, and a method of making the same, is provided. The filter has an input terminal, an output terminal, and a ground terminal including a first, a sec... | 03/27/2001 |
| 6204456 | Filling open through holes in a multilayer board Methods of filling apertures, for example, through holes, in substrates are provided. The methods utilize a dielectric film, preferably a photoimageable dielectric film, which is employed to fill the apertures and to form a dielectric film disposed above ... | 03/20/2001 |
| 6201185 | Substrate for mounting electronic part having conductive projections and process for manufacturing the same A plurality of side-surface patterns 11 and 12 are disposed on the wall surfaces of a mount opening portion 2 for mounting electronic parts thereat. The mount opening portion includes projection portions 21 that project toward an interior thereof from the... | 03/13/2001 |
| 6201194 | Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric A technique for forming an organic chip carrier or circuit board, having two voltage planes and at least two signal planes is provided which includes bonding a first layer of photolithographic dielectric material to a first metal layer and exposing the fi... | 03/13/2001 |
| 6194656 | Mounting structure for a relay arranged on a printed circuit board In a mounting structure for a relay arranged on a printed circuit board, a resin block having at least one insert-molded bus bar is fixed on the printed circuit board. One end of the bus bar held by the resin block is joined together with a terminal of th... | 02/27/2001 |
| 6191368 | Flexible, releasable strip leads A lead element for a microelectronic connection has a rigid body section connected to two parallel strip-like flexible leg sections. The leg sections each have tip ends that are offset from the rigid body section in a horizontal direction. The tip end of ... | 02/20/2001 |
