| Patent No. | Patent Title: |
| 6451623 | Carrier reel, carriage method using the carrier reel, and method ... |
| 6426241 | Method for forming three-dimensional circuitization and circuits ... |
| 6423571 | Method of making a semiconductor device having a stress relieving... |
| 6406972 | Integrated circuit, components thereof and manufacturing method |
| 6399449 | Semiconductor circuit using trench isolation and method of fabric... |
| 6395582 | Methods for forming ground vias in semiconductor packages |
| 6395579 | Controlling packaging encapsulant leakage |
| 6391729 | Shallow trench isolation formation to eliminate poly stringer wit... |
| 6391686 | Adhesive material applying method and apparatus, interconnect sub... |
| 6391678 | Method for controlling solderability of a conductor and conductor... |
| 6387742 | Thermal conductivity enhanced semiconductor structures and fabric... |
| 6387764 | Trench isolation process to deposit a trench fill oxide prior to ... |
| 6387729 | Method for adhering and sealing a silicon chip in an integrated c... |
| 6383838 | Substrateless chip scale package and method of making same |
| 6383844 | Multi-chip bonding method and apparatus |
| 6379996 | Package for semiconductor chip having thin recess portion and thi... |
| 6372546 | Method of producing semiconductor device and configuration thereo... |
| 6368893 | Method of fabricating semiconductor device |
| 6365446 | Formation of silicided ultra-shallow junctions using implant thro... |
| 6365434 | Method and apparatus for reduced flash encapsulation of microelec... |
| 6365435 | Method for producing a flip chip package |
| 6365432 | Fabrication process of semiconductor package and semiconductor pa... |
| 6358627 | Rolling ball connector |
| 6358773 | Method of making substrate for use in forming image sensor packag... |
| 6358801 | Method and apparatus for trench isolation process with pad gate a... |
| 6355500 | Semiconductor device and manufacturing method thereof |
| 6352897 | Method of improving edge recess problem of shallow trench isolati... |
| 6350625 | Optoelectronic packaging submount arrangement providing 90 degree... |
| 6350655 | Semiconductor device and a method of manufacturing the same |
| 6348371 | Method of forming self-aligned twin wells |
| 6348363 | Method for manufacturing a semiconductor package |
| 6342406 | Flip chip on glass image sensor package fabrication method |
| 6340607 | Process for mounting semiconductor device and mounting apparatus |
| 6338980 | Method for manufacturing chip-scale package and manufacturing IC ... |
| 6339004 | Method of forming shallow trench isolation for preventing torn ox... |
| 6337225 | Method of making stacked die assemblies and modules |
| 6335221 | Ball grid array (BGA) encapsulation mold |
| 6335223 | Method for producing a resin-sealed semiconductor device |
| 6333207 | Peelable lead structure and method of manufacture |
| 6333232 | Semiconductor device and method of manufacturing the same |
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