Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 7230877 | Method of making a semiconductor memory device A method for fabricating a semiconductor memory device is described. An insulating layer is disposed on a semiconductor substrate. A matrix of semiconductor memory elements is disposed in the substrate. The semiconductor memory elements include a plurality of contac... | 06/12/2007 |
| 7198962 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on th... | 04/03/2007 |
| 7154605 | Method for characterizing defects on semiconductor wafers A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to ... | 12/26/2006 |
| 7109788 | Apparatus and method of improving impedance matching between an RF signal and a multi- segmented electrode An apparatus and method of improving impedance matching between a RF signal and a multi-segmented electrode in a plasma reactor powered by the RF signal. The apparatus and method phase shifts the RF signal driving one or more electrode segment of the multi-segmented... | 09/19/2006 |
| 7101721 | Adaptive manufacturing for film bulk acoustic wave resonators An adaptive manufacturing process for a Film Bulk Acoustic Resonator (FBAR) tests the FBAR circuit during manufacturing to determine a resonant frequency thereof. Reactive tuning elements may be adjusted as needed depending on the testing to change the resonant freq... | 09/05/2006 |
| 7079433 | Wafer level burn-in of SRAM A wafer level burn-in method for static-random access memory. The SRAM memory has a plurality of word lines and a plurality of bit lines. The SRAM memory also has pull up circuits and equalizer circuits connected to various bit lines. All the word lines are switched... | 07/18/2006 |
| 7049586 | Multi beam scanning with bright/dark field imaging Bright and dark field imaging operations in an optical inspection system occur along substantially the same optical path using the same light source by producing either a circular or an annular laser beam. Multiple beam splitting is achieved through the use of a dif... | 05/23/2006 |
| 7045430 | Atomic layer-deposited LaAlO3 films for gate dielectrics A dielectric film containing LaAlO3 and method of fabricating a dielectric film contained LaAlO3 produce a reliable gate dielectric having a thinner equivalent oxide thickness than attainable using SiO2. The LaAlO3 gate di... | 05/16/2006 |
| 7038481 | Method and apparatus for determining burn-in reliability from wafer level burn-in A method and apparatus for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the durat... | 05/02/2006 |
| 7026187 | Method of manufacturing high-mobility organic thin films using organic vapor phase deposition A method of employing organic vapor phase deposition to fabricate a polycrystalline organic thin film is described. By employing organic vapor phase deposition at moderate deposition chamber pressures and substrate temperatures, a polycrystalline organic thin film r... | 04/11/2006 |
| 7018860 | Method of preventing cathode of active matrix organic light emitting diode from breaking A method of preventing the cathode of an active matrix organic light emitting diode from breaking. A substrate having an array of thin film transistors thereon is provided. Each thin film transistor includes a gate electrode, a channel layer, a source terminal and a... | 03/28/2006 |
| 7018873 | Method of making a device threshold control of front-gate silicon-on-insulator MOSFET using a self-aligned back-gate provides SOI CMOS technology whereby a polysilicon back-gate is used to control the threshold voltage of the front-gate device, and the nMOS and pMOS back-gates are switched independently of each other and the front gates. Specifically, the present invention provide... | 03/28/2006 |
| 7015107 | Method of manufacturing semiconductor device When a dummy sidewall and source and drain regions are once formed and then the dummy sidewall is removed to extend the source and drain regions, the removal of the dummy sidewall is performed after formation of a protective oxide film on a gate electrode and on the... | 03/21/2006 |
| 7015057 | Method of manufacturing a drive circuit of active matrix device A data holding control signal for each data line is supplied to a plurality of source followers that are connected together in parallel. The parallel-connected source followers are a combination of at least one first follower that is illuminated with laser light onl... | 03/21/2006 |
| 6989073 | Semiconductor device manufacturing system for etching a semiconductor by plasma discharge A semiconductor device manufacturing system has a vacuum chamber which is provided with a cathode electrode for holding a substrate to be processed and into which a reactive gas for generating discharging plasma by the application of a high-frequency electric power ... | 01/24/2006 |
| 6984198 | Experiment management system, method and medium Systems, methods and mediums are provided for automating experiments within an automated environment without the need to disassociate the test subject (e.g., the semiconductor chip or chips) from that environment. An “experiment” may be a pre-planned deviation o... | 01/10/2006 |
| 6985291 | Non-inverting transflective assembly A film that includes a first reflective polarizer substantially reflecting light having a first polarization state and substantially transmitting light having a second polarization state, a polarization rotating layer or depolarizing layer (or both) positioned to re... | 01/10/2006 |
| 6979578 | Process endpoint detection method using broadband reflectometry A method of determining a parameter of interest during processing of a patterned substrate includes obtaining a measured net reflectance spectrum resulting from illuminating at least a portion of the patterned substrate with a light beam having a broadband spectrum,... | 12/27/2005 |
| 6964892 | N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same An N-channel metal oxide semiconductor (NMOS) driver circuit (and method for making the same), includes a boost gate stack formed on a substrate and having a source and drain formed by a low concentration implantation, and an N-driver coupled to the boost gate stack... | 11/15/2005 |
| 6955264 | Method of detecting protrusion of inspection object from palette and method of fabricating semiconductor device In order to provide a method of detecting protrusion of an inspection object from a palette improved to be capable of making highly precise detection and reducing a socket breakage ratio, an inspection object is introduced into each of a plurality of pockets provide... | 10/18/2005 |
| 6955870 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device formed on the wafer. The testing process includes a step bringin... | 10/18/2005 |
| 6955930 | Method for determining thickness of a semiconductor substrate at the floor of a trench Apparatus and method for exposing a selected feature of an integrated circuit device such as a selected portion of the metallization layer, from the backside of the integrated circuit substrate without disturbing adjacent features of the device such as the active se... | 10/18/2005 |
| 6953979 | Semiconductor device, method of manufacturing same and method of designing same A partial oxide film (31) with well regions formed therebeneath isolates transistor formation regions in an SOI layer (3) from each other. A p-type well region (11) is formed beneath part of the partial oxide film (31) which isolates NMOS... | 10/11/2005 |
| 6953705 | Process for removing an organic layer during fabrication of an organic electronic device A method of dry etching a performance sensitive element of an organic electronic device, said method comprising the steps of: (a) having at least one performance sensitive element on the substrate spaced apart from a first conductive member, wherein at least one of ... | 10/11/2005 |
| 6952269 | Apparatus and method for adiabatically heating a semiconductor surface A method for adiabatically heating semiconductor device surfaces, including using capping layers to prevent deformation of surfaces. Using the method, semiconductor surfaces having varying topographies or topologies may be heated adiabatically. In an embodiment of t... | 10/04/2005 |
| 6949452 | Method for fabricating image display device There is provided a method for fabricating an image display device having an active matrix substrate including high-performance transistor circuits operating with high mobility as drive circuits for driving pixel portions which are arranged as a matrix. The portion ... | 09/27/2005 |
| 6946303 | Electronically diagnosing a component in a process line using a substrate signature The present invention is a system for creating a signature of a substrate manufactured in a semiconductor or data storage fabrication facility. A central processing unit is configured to receive external sensor data from a plurality of equipment-types located within... | 09/20/2005 |
| 6946343 | Manufacturing method of an integrated chip A manufacturing method of an integrated chip. The integrated chip includes at least two devices with different functions. The method uses a first production line to form a first device on a semiconductor wafer and then uses a second production line to form a second ... | 09/20/2005 |
| 6943055 | Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant ... | 09/13/2005 |
| 6943575 | Method, circuit and system for determining burn-in reliability from wafer level burn-in A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the... | 09/13/2005 |
| 6944370 | Method of processing a semiconductor wafer A method of processing a semiconductor wafer that has circuits in each of a plurality of regions sectioned by a plurality of streets on the front surface and has a coating layer formed on the front surface having the circuits to a predetermined thickness, the method... | 09/13/2005 |
| 6943066 | Active matrix backplane for controlling controlled elements and method of manufacture thereof An electronic device is formed from electronic elements deposited on a substrate. The electronic elements are deposited on the substrate by advancing the substrate through a plurality of deposition vacuum vessels, with each deposition vacuum vessel having at least o... | 09/13/2005 |
| 6939813 | Apparatus for improved low pressure inductively coupled high density plasma reactor A plasma reactor comprises an electromagnetic energy source coupled to a radiator through first and second variable impedance networks. The plasma reactor includes a chamber having a dielectric window that is proximate to the radiator. A shield is positioned between... | 09/06/2005 |
| 6940112 | Integrated capacitors fabricated with conductive metal oxides A capacitor for a memory device is formed with a conductive oxide for a bottom electrode. The conductive oxide (RuOx) is deposited under low temperatures as an amorphous film. As a result, the film is conformally deposited over a three dimensional, foldin... | 09/06/2005 |
| 6936547 | Gas delivery system for deposition processes, and methods of using same The present invention is generally directed to a novel gas delivery system for various deposition processes, and various methods of using same. In one illustrative embodiment, a deposition tool comprises a process chamber, a wafer stage adapted for holding a wafer p... | 08/30/2005 |
| 6936843 | Fixture used to prepare semiconductor specimens for film adhesion testing The present disclosure pertains to a method of preparing a test specimen for testing of the bonding strength of a layer of additive material to a crystalline substrate, or testing of the bonding strength of one layer of additive material to a second layer of additiv... | 08/30/2005 |
| 6936842 | Method and apparatus for process monitoring Embodiments of the invention provide an apparatus and method to determine the health of a substrate process such as, for example, a pre-clean process using plasma to remove copper oxide from a copper layer on a substrate, and the point at which the process has ended... | 08/30/2005 |
| 6934005 | Reticle focus measurement method using multiple interferometric beams A first set of interferometric measuring beams is used to determine a location of a patterned surface of a reticle and a reticle focus plane for a reticle that is back clamped to a reticle stage. A second set of interferometric measuring beams is used to determine a... | 08/23/2005 |
| 6928635 | Selectively applying resolution enhancement techniques to improve performance and manufacturing cost of integrated circuits One embodiment of the present invention provides a system that applies resolution enhancement techniques (RETs) selectively to a layout of an integrated circuit. Upon receiving the layout of the integrated circuit, the system identifies a plurality of critical regio... | 08/09/2005 |
| 6924178 | Oxide/nitride stacked in FinFET spacer process In a FinFET integrated circuit, the fins are formed with a body thickness in the body area and then thickened in the source/drain area outside the body to improve conductivity. The thickening is performed with epitaxial deposition while the gates are covered by a co... | 08/02/2005 |
