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| Number | Title | Issue Date |
| 7463484 | Heatsink apparatus A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner sur... | 12/09/2008 |
| 7463486 | Transpiration cooling for passive cooled ultra mobile personal computer In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chas... | 12/09/2008 |
| 7460373 | Heat radiation device for memory module There is disclosed a heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed... | 12/02/2008 |
| 7460368 | Cooling-fan-free system module A cooling-fan-free system module includes a housing unit, a circuit module, and a heat radiating unit. The housing unit includes a front and a rear case assembled together to define a receiving space therebetween, and the rear case is made of a highly heat conductin... | 12/02/2008 |
| 7457121 | Plasma display module A plasma display module with reduced driving noise and improved a heat dissipating performance. The plasma display module includes a chassis base, a plasma display panel arranged at a front portion of the chassis base, the plasma display panel being adapted to displ... | 11/25/2008 |
| 7457119 | Heatsink module A heatsink module used for dissipating heat generated by a heat generating component is provided. The heatsink module includes a heat pipe, a heatsink fin assembly, a fan blade motor set, a fan shell, and an external cover. The heat pipe conducts the heat generated ... | 11/25/2008 |
| 7453697 | Electronic apparatus According to one embodiment, there is provided an electronic apparatus including: a substrate on which an electronic component is mounted; a casing that accommodates the substrate and has a recess portion; an air vent through which the recess portion is communicated... | 11/18/2008 |
| 7453696 | Cooling device for a radial fan driven by an electric motor with IC A radial fan includes an integrated circuit which is conductively connected to a printed circuit board to control a motor. The flow of air provided by a cooling impeller is conveyed directly to the integrated circuit to cool the integrated circuit during operation o... | 11/18/2008 |
| 7450382 | Apparatus for enclosing electronic components An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and ... | 11/11/2008 |
| 7450385 | Liquid-based cooling apparatus for an electronics rack A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each co... | 11/11/2008 |
| 7450368 | Front access electrical enclosure and electrical bus assembly therefor An electrical enclosure includes a housing having a front, a back, a plurality of sides, a plurality of sections disposed between the sides, at least one electrical apparatus, and a plurality of electrical bus members electrically connected to the electrical apparat... | 11/11/2008 |
| 7450380 | Computer system having multi-direction blower A computer system comprises a chassis and first and second electronic components disposed within the chassis. The computer system also comprises a multi-direction blower module having a blower housing connected to the chassis. The blower housing comprises an inlet, ... | 11/11/2008 |
| 7450384 | Card cage with parallel flow paths having substantially similar lengths A card cage configured to hold a set of electronics cards comprises a set of walls having an input and an output and a set of flow paths formed in the set of walls to enable a fluid to flow therein. The set of flow paths includes a first flow path formed between the... | 11/11/2008 |
| 7447031 | Cockpit for a motor vehicle A cockpit for installation in a motor vehicle between two A-pillars includes a printed board having electronic components connected to a crossmember via a pipe. The pipe is filled with a heat-absorbing fluid and conducts away heat generated by the electronic compone... | 11/04/2008 |
| 7447030 | Thermal module having a housing integrally formed with a roll cage of an electronic product A thermal module includes a roll cage mounted to an enclosure of an electronic product, a centrifugal blower, and a fin assembly. The centrifugal blower is disposed in the roll cage and includes a housing integrally formed with the roll cage and defining an air outl... | 11/04/2008 |
| 7447024 | Heat sink for a memory A heat sink for a memory comprises two heat-conducting sheets and a fan. Both sides of the memory are clamped by the two heat-conducting sheets, and between the two heat-conducting sheets is defined a convective space. The upper end of the convective space is sealed... | 11/04/2008 |
| 7447025 | Heat dissipation device A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the te... | 11/04/2008 |
| 7447035 | Heat dissipation device assembly A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in ther... | 11/04/2008 |
| 7443674 | Rack enclosure cooling system A rack panel, rack enclosure, and system for cooling electronic components which are vertically mounted in a rack enclosure wherein the system has a front panel with two hollow internal ducts separated by an inner screen-like wall for more evenly distributing and de... | 10/28/2008 |
| 7443672 | Video graphics array (VGA) card assembly A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining... | 10/28/2008 |
| 7443685 | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermall... | 10/28/2008 |
| 7443676 | Heat dissipation device A heat dissipation device adapted for dissipating heat of a CPU and other electronic components such as MOSFETS mounted on a printed circuit board, includes a base mounted on the CPU, a fin set disposed on the base and a fan attached to a lateral side of the base an... | 10/28/2008 |
| 7440284 | Holding device for a heat sink A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of ... | 10/21/2008 |
| 7440260 | Electrical bus member mounting system and electrical enclosure employing the same An electrical bus member mounting system is provided for an electrical enclosure including a housing having a front, a back and a plurality of sides, a plurality of sections disposed between the sides, at least one electrical apparatus disposed within a first one of... | 10/21/2008 |
| 7440276 | Cooling-fan-free system module A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a circuit module received in the receiving space of the housing unit and incl... | 10/21/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7436661 | Two-compartment AC adaptor An external AC power adaptor having an additional compartment for cooling. The adaptor has a housing that defines a first compartment having power circuitry for converting an AC input to a DC output and a second compartment that has an opening formed in the adaptor ... | 10/14/2008 |
| 7436667 | Electronic device An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connecte... | 10/14/2008 |
| 7436673 | Heat sink fixing assembly A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the e... | 10/14/2008 |
| 7428154 | Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat si... | 09/23/2008 |
| 7428153 | Heat dissipation assembly A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct include... | 09/23/2008 |
| 7426111 | Communication apparatus and rack structure A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communicati... | 09/16/2008 |
| 7426110 | Centrifugal fan clutch for an electronics cooling fan An electronics cooling fan comprises a centrifugal clutch adapted to disengage and freewheel upon fan failure. ... | 09/16/2008 |
| 7423876 | System and method for heat dissipation in an information handling system A system and method is disclosed for dissipating heat within the interior of an information handling system. Heat from a heat source is directed to a heat sink and is also directed in parallel to a thermoelectric cooler. The thermoelectric cooler is oriented to dire... | 09/09/2008 |
| 7423877 | Heat dissipation device A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a mid... | 09/09/2008 |
| 7423881 | Arrangement and method for cooling a power semiconductor In an arrangement and a method for cooling a power semiconductor in which at least one power semiconductor is electrically and thermally conductively connected to at least one passive electric component. Further, a cooling element is thermally conductively connected... | 09/09/2008 |
| 7420808 | Liquid-based cooling system for cooling a multi-component electronics system A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cool... | 09/02/2008 |
| 7417864 | Gear driven socket activation mechanism A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component. ... | 08/26/2008 |
| 7414842 | Heat dissipation device A heat dissipation device includes a heat sink with a plurality of fins, a fan mounted on a side of the heat sink with a space formed between the heat sink and the fan, and at least one airflow guiding board formed by one end of at least one of the fins. The airflow... | 08/19/2008 |
| 7411788 | Cooling fan device for a computer A cooling fan device for a computer including a fan device having a primary housing and a side housing. A computer casing a side walls having an area with air permeable holes, right positioning slots, and a left positioning slot. Projection parts of the primary hous... | 08/12/2008 |
