Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 6900985 | Heat sink clip with pressing cam A heat sink clip (1) includes a main body (50), an operating part (30) movably received in the main body, and a pressing cam (70) pivotably attached to the main body. The main body includes a central portion (52), and two hooks ( | 05/31/2005 |
| 6882536 | Wrap-around cooling arrangement for printed circuit board A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a f... | 04/19/2005 |
| 6781836 | Microprocessor-heat slug fastening frame A fastening frame of the invention includes a fastener comprised of a transversal connecting arm that connects two attachment parts at two opposite sides. The transversal connecting arm has a thickness that is smaller than the space between the fins, and an edge tha... | 08/24/2004 |
| 6771493 | Notebook computer with sliding keyboard A notebook computer with a sliding keyboard has the keyboard portion forming an independent keyboard module that mounts on slide rails located on two sides of the body. The keyboard module is laid flat on the body in normal conditions. When in use, the keyboard modu... | 08/03/2004 |
| 6760224 | Heat sink with alignment and retaining features An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader. ... | 07/06/2004 |
| 6724631 | Power converter package with enhanced thermal management A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of sy... | 04/20/2004 |
| 6717815 | Heat dissipation module and its fixed member A heat dissipation module and its fixed member. The fixed member is disposed on a main board and is provided with a base. The base is provided with a plurality of protrusions. Each of the protrusions is provided with a flange. By means of the flange, the protrusion ... | 04/06/2004 |
| 6711015 | Device for cooling CPU chip A CPU chip-cooling device is provided. The CPU chip is disposed on a chassis, and the cooling device comprises a heat sink, a bracket and a fan. The heat sink is disposed on the CPU chip. The bracket, having a pivot portion and a retention portion, is pivotally disp... | 03/23/2004 |
| 6711018 | Heat-dissipating module In a heat-dissipating module for an electronic device, a heat-conducting unit is adapted to be disposed in close contact with a heat-generating component, and includes inner and outer tubes that cooperatively confine an enclosed chamber filled with a thermal superco... | 03/23/2004 |
| 6707672 | Heat sink clip assembly A heat sink clip assembly includes a clip (10) and a frame (50). The clip is formed from a single strand of resilient metallic material that is bent and coiled to become generally U-shaped. The clip includes a retaining bar (11), and two confini... | 03/16/2004 |
| 6707673 | Heat sink for chip stacking applications A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the c... | 03/16/2004 |
| 6704197 | Electronic unit having desired heat radiation properties An electronic unit includes a housing and a plurality of heat-generating electronic devices. The devices are stored in the housing. The heat generated by the devices is transferred to the housing and further transferred to ambient air from the housing to ... | 03/09/2004 |
| 6704200 | Loop thermosyphon using microchannel etched semiconductor die as evaporator The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and suc... | 03/09/2004 |
| 6700781 | Heat-dissipating module for removing heat generated from heat-generating device A heat-dissipating module includes a lower housing, a first magnet portion, a second magnet portion and a circuit board. The lower housing is made of a highly thermal conductive material. The upper housing has an opening in the center thereof, wherein whe... | 03/02/2004 |
| 6700780 | Apparatus for cooling electronics The present invention relates to an apparatus for supplying heat to directly cooled electronics. To ensure that directly cooled electronics are maintained at a temperature above 0° C., a circulation fan is provided in a transverse junction between an out... | 03/02/2004 |
| 6690576 | Externally mounted on-line replaceable fan module A cooling fan apparatus includes a plastic housing and an electric fan. The housing containing the fan is mounted directly on the external surface of equipment being cooled. No separate mounting frame is utilized. The modular fan apparatus is on-line repl... | 02/10/2004 |
| 6687124 | Apparatus for cooling electronic components in a phase change electronic cooling system An apparatus for cooling electronic components disposed in a sealed container in a phase change electronic cooling system includes a hood disposed in the container adjacent the electronic components. The electronic components and the hood are immersed in ... | 02/03/2004 |
| 6680847 | Electronic circuitry enclosure with air vents that comply with emissions and safety standards An air vent comprises a vent assembly including an electrically-conductive screen mounted inside an enclosure constructed of panels. One or more of the panels has an array of holes through it. The holes are configured and sized to prevent an appendage, su... | 01/20/2004 |
| 6678158 | Heat sink assembly with fixing device A heat sink assembly includes a fixing device (10), a fin member (40), and a fan (50). The fixing device is integrally formed by extruding aluminum. The fixing device includes a base (12), two side plates (16) extending upwardly from opposite sides of the... | 01/13/2004 |
| 6671177 | Graphics card apparatus with improved heat dissipation Graphics card apparatus with improved heat dissipation and including a planar metallic cover plate having an external perimeter configuration that generally corresponds to the plan-form of the printed circuit board used in the graphics card assembly, a pl... | 12/30/2003 |
| 6667882 | Cooling assembly for a heat producing assembly A cooling assembly for dissipating heat produced in a heat generating component of an electronic system includes a shroud assembly. The cooling assembly also includes a heat dissipating device removably housed within the shroud assembly and a fan assembly... | 12/23/2003 |
| 6667886 | Cooling body-conductor strips arrangement A cooling body-conductor strips arrangement for electrical devices has a cooling body for withdrawing heat to a surrounding area, a base plate composed of an electrically insulating material and provided with a first conductor strip unit which is embedded... | 12/23/2003 |
| 6665183 | Power supply apparatus A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b... | 12/16/2003 |
| 6665188 | Snapping device for CPU cooler The present invention is to provide a snapping device comprising a fastening resilient strip including a main body; at least one bolt parallel to the fastening resilient strip; a contact section moveable along the shank of the bolt; and a hollow support s... | 12/16/2003 |
| 6665187 | Thermally enhanced lid for multichip modules An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the ... | 12/16/2003 |
| 6661665 | Method and apparatus for removing heat from an electronic device The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit boa... | 12/09/2003 |
| 6661663 | Fiber guide connected to a heatsink fastener A combination device includes an optical fiber guide connected to a fastener for attaching a heatsink to a component and/or to be printed circuit board. As a component on a printed circuit board usually needs to be fastened to a heatsink for cooling, comb... | 12/09/2003 |
| 6661661 | Common heatsink for multiple chips and modules A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables ... | 12/09/2003 |
| 6657866 | Electronics assembly with improved heatsink configuration An electronic assembly 10 is provided, including a substrate 12 having a first a second side 16, and at least one opening 18, and a power device 20 mounted on side 14, positioned over said at least one opening 18, and in thermal communication with said at... | 12/02/2003 |
| 6654250 | Low-stress compressive heatsink structure A structure and technique for forming an I/C chip module and circuit card construction is provided. An I/C chip module having a flexible substrate, with first and second opposite sides concave, results from the CTE mismatch between the I/C chip and substr... | 11/25/2003 |
| 6654246 | Heat sink assembly with fixing members A heat sink assembly includes a fan (10), two fixing members (20), a heat sink (30), and a plurality of screws (40, 50). The fan is generally parallelepiped, and defines four mounting holes (102) in corners thereof. Each fixing member has a first plate (2... | 11/25/2003 |
| 6654244 | Device for the cooling of components For the cooling of electronic components on a board (2) which is located within an (EMC) shield (3), the shield (3) lying within a housing (1), a part air stream of a fan (5) in the housing wall is guided into the shield (3) by an air guide duct (13). Coo... | 11/25/2003 |
| 6654247 | Computer heat dissipating structure A computer heat dissipating structure of the invention is mounted over a computer main board inside a computer principal unit to dissipate the heat irradiated by at least a principal heat source and a secondary heat source. The computer heat dissipating s... | 11/25/2003 |
| 6650543 | Heat dissipation device A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The c... | 11/18/2003 |
| 6646881 | Mounting assembly for heat sink A mounting assembly for securing a heat sink (10) to an electronic package (50) mounted on a circuit board (40) includes a back plate (20), a clip (30), and two screws (70). The back plate abuts an underside of the circuit board. The back plate includes a... | 11/11/2003 |
| 6646891 | Apparatus for adjusting a height of control boxes The present invention relates to an apparatus for adjusting a height of control boxes, which enables a driver to drive with an optimal posture according to his body condition by adjusting a height of the control boxes having operation levers. The apparatu... | 11/11/2003 |
| 6646880 | Heat sink clip A heat sink clip (10) includes two side plates (104), and two pressing portions (102) connecting between opposing ends of the side plates. Each pressing portion is generally arcuate, which enables it to resiliently press a heat sink. Each side plate is sl... | 11/11/2003 |
| 6643123 | Switchgear cabinet with at least one cabinet door and a fan-assisted air circulation on an interior A switchgear cabinet having at least one cabinet door and a fan-assisted air circulation on an interior for cooling heat-generating devices installed inside, which are disposed one above the other in tiers. With particular air circulation, the partial coo... | 11/04/2003 |
| 6643130 | Wash down filtered fan apparatus A wash down filtered fan apparatus for cooling and filtering a cabinet enclosure housing electromechanical equipment and sensitive electronics is provided consisting of an intake housing and exhaust housing. A blower mounted within an intake housing induc... | 11/04/2003 |
| 6643135 | On board mounting electronic apparatus and on board mounting electric power supply An on-board mounting electronic apparatus including an apparatus body 6, made up of a main board 4 and terminal pins 5 for connection with a circuit board 21. The terminal pins 5 extend from an underside of the main board 4. A heat dissipation plate 8 is ... | 11/04/2003 |