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| Number | Title | Issue Date |
| 6500051 | Polishing apparatus and method A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a t... | 12/31/2002 |
| 6352466 | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portio... | 03/05/2002 |
| 6331137 | Polishing pad having open area which varies with distance from initial pad surface A polishing pad having a cross-sectional open area which varies with depth from the pad surface is provided. The cross-sectional open area of the pad may increase and/or decrease moving away from the outer pad surface. In some cases, the cross-sectional o... | 12/18/2001 |
| 6315650 | Method for lathing a lens A method of lathing a lens, especially a contact lens, involves attaching the cylindrical blank of lens material to a first block of machineable plastic material, lathe cutting a desired first lens surface in the cylindrical blank, attaching the machined ... | 11/13/2001 |
| 6312320 | Disk cleaner A disk cleaner includes a polishing member which is adapted to be rotated while being engaged with a surface of the disk, thereby to polish the surface of the disk. The polishing member is disposed such that the rotational axis of the polishing member is ... | 11/06/2001 |
| 6309291 | Brush cutter A brush cutter adapted to be driven in rotary motion by a conventional machine tool. The brush cutter includes an annular wall having a cylindrical outer surface defining a longitudinal center axis. Front and rear faces are connected to opposing ends of t... | 10/30/2001 |
| 6309276 | Endpoint monitoring with polishing rate change A substrate with a first layer disposed on a second layer is chemically mechanically polished. A polishing endpoint detection system generates a signal that is monitored for an endpoint criterion. The polishing rate of the substrate is reduced when the bu... | 10/30/2001 |
| 6299511 | Chemical mechanical polishing conditioner A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid,... | 10/09/2001 |
| 6296558 | Sanding device A sanding device for sanding substantially planar surfaces and substantially non-planar surfaces including a first section and a second section releasably coupled thereto. The second section for supporting a piece of sandpaper having ends captured between... | 10/02/2001 |
| 6293855 | Polishing apparatus The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning secti... | 09/25/2001 |
| 6293853 | Conditioner apparatus for chemical mechanical polishing In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad ... | 09/25/2001 |
| 6293859 | Electric power tool with rotatable handle A power tool is disclosed, having an elongated motor housing in which an electric motor is received, having a gear drive housing at a first end of the motor housing to receive a gear drive for driving a working spindle, and having a handle element which i... | 09/25/2001 |
| 6290581 | Automatic mower reel grinder A grinding system (10) for sharpening the blades in cutting reels of mowing units incorporates an articulated grinding head (90) mounted for movement on a carriage (92). A unique index/guide assembly (160) is mounted on the grinding head (90). The index/g... | 09/18/2001 |
| 6290577 | Fluid pressure regulated wafer polishing head A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge s... | 09/18/2001 |
| 6287183 | Vacuum-hydrostatic shoe for centerless grinding A vacuum-hydrostatic shoe especially suited for supporting a workpiece in metalworking operations is disclosed. The vacuum-hydrostatic shoe is comprised of a body with a support surface confronting the workpiece. Preferably the support surface is shaped t... | 09/11/2001 |
| 6287177 | Method of and apparatus for high tolerance brush honing The present invention relates to a honing method and apparatus which provides greater control over the edge shape, as well as reductions in the effort required to hone multiple edges on workpieces. The invention accomplishes these improvements by controll... | 09/11/2001 |
| 6287192 | Slurry supply system for chemical mechanical polishing process having sonic wave generator A system for supplying slurry to a processing facility, includes a tank containing the slurry, and slurry supply piping connected to the tank to allow the slurry to flow from the tank to the processing facility. A sonic wave generator is disposed along th... | 09/11/2001 |
| 6287171 | System and method for detecting CMP endpoint via direct chemical monitoring of reactions A system and method for detecting process endpoint in CMP is presented which monitors the progression of chemical activities that take place from the chemical reaction that occurs at the wafer surface during polishing. In order to monitor the progression ... | 09/11/2001 |
| 6283837 | Grinding machine A grinding machine has a swivel head (1) with at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the workpiece.... | 09/04/2001 |
| 6280297 | Apparatus and method for distribution of slurry in a chemical mechanical polishing system Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible membe... | 08/28/2001 |
| 6276996 | Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad The invention comprises copper chemical-mechanical polishing processes using fixed abrasive polishing pads, and copper layer chemical-mechanical polishing solutions specifically adapted for chemical-mechanical polishing with fixed abrasive pads. In one im... | 08/21/2001 |
| 6270392 | Polishing apparatus and method with constant polishing pressure In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing hea... | 08/07/2001 |
| 6264536 | Reducing polish platen corrosion during integrated circuit fabrication A technique for reducing corrosion over a steel platen used during semiconductor wafer polishing. An anodic metal plate is attached to the steel platen to cathodically protect the surface of the steel platen via an electrochemical process. This cathodic p... | 07/24/2001 |
| 6261157 | Selective damascene chemical mechanical polishing A selective Damascene chemical mechanical polishing (CMP) technique is used to planarize a semiconductor device to remove surface topography. The semiconductor device includes a semiconductor layer formed on a substrate, an insulating layer formed over th... | 07/17/2001 |
| 6261155 | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring ... | 07/17/2001 |
| 6257224 | Process for working a preform made of an oxide single crystal, and a process for producing functional devices A process for dicing a preform made of an oxide single crystal into cut pieces each having a given shape, includes the steps of removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under irradia... | 07/10/2001 |
| 6257972 | Steady rest having linear sliding clamping bars This invention is related to a steady rest, which employs a pair of parallel, sliding, linear moving clamping bars for moving wear pads or rollers toward a workpiece.... | 07/10/2001 |
| 6254456 | Modifying contact areas of a polishing pad to promote uniform removal rates A polishing pad surface having a surface designed for chemical mechanical polishing of a substrate surface is described. The polishing pad surface includes a first area on the surface exposed to and capable of contacting a first amount of the substrate su... | 07/03/2001 |
| 6250995 | Apparatus for polishing outer periphery of workpiece To provide a small polishing means featuring high machining efficiency that is capable of efficiently and quickly mirror-polishing an outer periphery of a chamfered workpiece (5) by bringing the outer periphery into even contact with a plurality of polish... | 06/26/2001 |
| 6251002 | Surface treating articles and method of making same Surface treating articles and methods for the manufacture of such articles are provided. The articles of the invention comprise a rotatable core; a plurality of surface treating segments, the segments having first ends adjacent the core and second ends op... | 06/26/2001 |
| 6250295 | Tool A tool for treatment of rock, masonry or concrete by drilling, grinding or cutting off, the tool has a plurality of cutting segments each having a plurality of bonded cutting bodies formed as diamond crystals and subjected to an abrasive wear during an op... | 06/26/2001 |
| 6241592 | Polishing apparatus A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has a pusher for transferring the workpiece between a top ring of a polishing apparatus and the pusher. The polishing ap... | 06/05/2001 |
| 6241580 | Polish applying and buffing mitt, kit and method A disposable polish applying and buffing mitt comprising a multilayered mitt with a polish impervious layer removably attached to a material pervious to polish such that the material pervious to polish would stain the hand of the user if used to apply the... | 06/05/2001 |
| 6241595 | Edger blade sharpener This invention is a sharpening device for lawn edger blades. The device is specifically designed for attachment to the machine and in use for when the machine is in operation. The reason for this is to keep the cutting edge of the blade continually sharp.... | 06/05/2001 |
| 6238279 | Magnetic filtration for slurry used in chemical mechanical polishing of semiconductor wafers A method and apparatus for filtering a slurry used in a chemical mechanical polishing apparatus is disclosed. Magnets are provided along the piping network between a slurry reservoir and the CMP apparatus. A magnet may also be placed adjacent to the slurr... | 05/29/2001 |
| 6234875 | Method of modifying a surface A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface of an abrasive article, the abrasive article comprising a phase separated polymer having a first phase and a second phase, the first ... | 05/22/2001 |
| 6234885 | Roll grinding machine In a roll grinding machine (2) for profile grinding of rolls with a constructionally simple device for a very precise adjustment of a grinding wheels (4) supported on a grinding spindle (7) tangentially with respect to a roll profile, the grinding spindle... | 05/22/2001 |
| 6231427 | Linear polisher and method for semiconductor wafer planarization A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the s... | 05/15/2001 |
| 6227950 | Dual purpose handoff station for workpiece polishing machine The present invention provides a dual purpose workpiece handoff station for intermediately staging a semiconductor wafer, or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine.... | 05/08/2001 |
| 6227958 | Knife and sharpening holder A sharpening holder and a knife are uniquely configured for use with each other, the holder and the knife having permanent elements that mate when the holder is installed on the knife so that the holder is installed on the knife in exactly the same positi... | 05/08/2001 |
