Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 5629840 | High powered die with bus bars Power bus bars are provided for a semiconductor die. Power bus bars are thick electrical conductors that extend the length of the die in an electrically isolated array of stripes. The electrical stripes are divided into two or more interdigitated groups, ... | 05/13/1997 |
| 5490041 | Semiconductor integrated circuit module and a semiconductor integrated circuit device stacking the same A plurality of memory modules are stacked so as to form a multilayer integrated memory circuit. All of the memory modules have a plurality of bare memory IC chips mounted thereon, and have the same structure, the same circuit configuration and the same te... | 02/06/1996 |
| 5452182 | Flexible high density interconnect structure and flexibly interconnected system A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconne... | 09/19/1995 |
| 5434747 | Photoelectric transducer A photoelectric transducer includes a conductive case having an optical connector receptacle and circuit board forming a photoelectric transducer circuit. Conductive stands are erected from the bottom of the conductive case to bridge-support the opposite ... | 07/18/1995 |
| 5434752 | System and method for regulating staggered connection insertion timing A system for controlling staggered connection timing of an adapter module so that live insertion, or "hot swapping", may be performed with the adapter module, has a connector with staggered pins, i.e., some pins being longer than others for initial contac... | 07/18/1995 |
| 5434751 | Reworkable high density interconnect structure incorporating a release layer A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the ch... | 07/18/1995 |
| 5432680 | Electronic assembly including lead terminals spaced apart in two different modes A pair of holding members, which are displaced from each other along the horizontal plane of a plate face, are formed on each forward end of a plurality of plate type lead terminals fixed to a long base tape. An electronic component body is resiliently he... | 07/11/1995 |
| 5430615 | Printed circuit board assembly Electronic apparatus comprises a main circuit board, a transition board, and a first connector composed of a first part attached to the main circuit board at one edge thereof and a second part attached to the transition board at a first main face thereof,... | 07/04/1995 |
| 5428506 | Circuit board EMI suppressor including a lossy dielectric layer An improved printed circuit card or second level electronics package (circuit board) including a laminate of lossy material and dielectric material between the voltage supply plane (Vcc) and the ground (GND) plane. The laminate suppresses common mode nois... | 06/27/1995 |
| 5426568 | Launch-protected electronic assembly A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each con... | 06/20/1995 |
| 5426566 | Multichip integrated circuit packages and systems Multichip integrated circuit packages and systems of multichip packages having reduced interconnecting lead lengths are disclosed. The multichip package includes a multiplicity of semiconductor chip layers laminated together in a unitized module. A first ... | 06/20/1995 |
| 5420760 | Microcomputer enclosure with interrupted wedge locking arrangement and shielding liner This invention relates to enclosures for microcomputers, and more particularly to such an enclosure which facilitates access to and shielding of the operative components of a personal computer. The enclosure includes a chassis, a cover for cooperating wit... | 05/30/1995 |
| 5420758 | Integrated circuit package using a multi-layer PCB in a plastic package An integrated-circuit package assembly including a lead frame having a number of inwardly extending fingers, the alternate ends of which are formed into an upper row and a lower row to provide a space there between for receipt of the outer edges of a mult... | 05/30/1995 |
| 5420756 | Memory card including stacked semiconductor memory elements located on a printed circuit board having a straight wiring pattern TCP (tape carrier package) type semiconductor memory elements, each having a thickness less than that of the conventional package, are provided on the front and rear surface of a print circuit board in a stacking manner. Close to the semiconductor memory ... | 05/30/1995 |
| 5418691 | Two printed circuit boards superiposed on one another both having position registry marks A printed circuit board device comprising at least two printed circuit boards in superposition to connect their interconnection patterns, and a positioning member for putting the two boards into registry when being superimposed, the positioning member inc... | 05/23/1995 |
| 5414594 | Self-adjusting insertion/extraction apparatus for printed circuit boards A self-adjusting insertion/extraction apparatus is disclosed for inserting and extracting a printed circuit (PC) board into and from an electrical connector mounted at the base of a PC board rack, the apparatus being configured to function effectively reg... | 05/09/1995 |
| 5412540 | Apparatus for removably applying a flat-pack to a socket The contacts extending from the four sides of a flat-pack are releasably held against corresponding contacts extending from the sides of a socket for the flat-pack, by means of a cover comprising four arms pivotally mounted on the socket each near one of ... | 05/02/1995 |
| 5410450 | Internal wiring structure of a semiconductor device External lead-through terminals of a semiconductor device, such as a power transistor module, are internally wired to a circuit assembly by a wiring block consisting of one or more conductive lead frames interposed between the lead-through terminals and t... | 04/25/1995 |
| 5408386 | Socket assembly including a first circuit board located between a receptacle housing and a second circuit board A unit for providing a socket for a plurality of removably mountable peripheral devices to a computer including a receptacle for receiving the body of such removably mountable peripheral devices, the receptacle being generally block shaped and having a pa... | 04/18/1995 |
| 5406453 | Computer chassis planar/riser card assembly To improve the serviceability, manufacturability and uptime for a computer file server a specially designed planar/riser card assembly is mounted on the computer chassis and includes a card cage structure in which a riser card is secured. Carried on the r... | 04/11/1995 |
| 5406458 | Printed circuit board having tapered contact pads for surface mounted electrical components A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (101) thereon. Each pad (24, 26) has a rectangular portion and a triangular portion extending in the direct... | 04/11/1995 |
| 5404276 | Screened RFI through-let An RFI through-let for screening signals transmitted between different components, for instance circuit boards, of which one component is arranged in a screened space, includes signal-transmission through-let capacitors which are mounted in a screen plate... | 04/04/1995 |
| 5404275 | Rack structure for accommodating electronic modules A rack comprises a plurality of lower guide rails arranged side by side to form the bottom thereof, and a plurality of upper guide rails arranged side by side to form the top thereo, for accommodating a plurality of electronic modules such as modems. Each... | 04/04/1995 |
| 5400221 | Printed circuit board mounted with electric elements thereon Electric elements such as a resistance chip, a capacitor chip, a semiconductor device package, and a connector are mounted on a printed circuit board by using at least two methods selected from the re-flow method using cream solder, the chip-on board meth... | 03/21/1995 |
| 5398169 | Microelectronic package comprising metal housing grounded to board edge A microelectronic package (10) comprises a printed circuit board (12) enclosed within a metal housing (14) for shielding the board from spurious electromagnetic signals. The housing includes a base (30) having side walls (36). A series of first tabs (42) ... | 03/14/1995 |
| 5388030 | Metal module housing having a plurality of lugs formed therein for supporting and grounding a printed circuit board The input and/or output device for process data has a mounting rack (1), as well as a plurality of modules (2) fastened on the mounting rack (1). A process connector (4) can be inserted into each of the modules (2) on the front side in each case. Each mod... | 02/07/1995 |
| 5386342 | Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a voi... | 01/31/1995 |
| 5386341 | Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substr... | 01/31/1995 |
| 5386346 | Circuit card assembly with shielding assembly for reducing EMI emissions A circuit card assembly adapted to be coupled to a housing for reducing the amount of electromagnetic interference (EMI) escaping from the housing into the environment. The circuit card assembly includes a printed circuit board, an insulative faceplate co... | 01/31/1995 |
| 5384689 | Integrated circuit chip including superimposed upper and lower printed circuit boards An integrated circuit chip includes a printed circuit board unit, a die and a plurality of conductive wires. The printed circuit board unit has a top surface, a plurality of conductive strips that is provided on the top surface, and a die-receiving cavity... | 01/24/1995 |
| 5383098 | Shield assembly An electronic device assembly (100)includes a chassis (102), printed circuit boards (108 and 110), and a shield member (128). By placing the circuit boards (108 and 110) inside of chassis (102) and then engaging shield member (128), the printed circuits b... | 01/17/1995 |
| 5383097 | Conductive path ESD shield An electrostatic discharge (ESD) shield protects sensitive components of a hand-held device where the ESD can enter the unit along a seam or join of the casing halves. The shield employs a insulating film of high electrical strength, e.g., Mylar. This is ... | 01/17/1995 |
| 5381307 | Self-aligning electrical contact array A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array inclu... | 01/10/1995 |
| 5379191 | Compact adapter package providing peripheral to area translation for an integrated circuit chip An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the... | 01/03/1995 |
| 5377080 | Printed circuit board mounting box A printed circuit board mounting box includes a casing covered with a top cover, and two reversible end plates vertically disposed at two opposite ends between the top cover and casing thereof, wherein each end plate has parallel rows of horizontal T-rods... | 12/27/1994 |
| 5377081 | Surface mountable electronic part The size precision of a surface mountable electronic part is improved and a production thereof is simplified. The surface mountable electronic part is constructed such that a circuit substrate is housed in a shield case of which an end side is open, and t... | 12/27/1994 |
| 5375041 | Ra-tab array bump tab tape based I.C. package An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plur... | 12/20/1994 |
| 5373419 | Lever mechanism Disclosed is a lever mechanism for clamping a board to a housing. A support block is provided and is adapted to be attached to the board. A first lever, pivotally connected to the support block, is movable between first and second positions, and adapted t... | 12/13/1994 |
| 5371653 | Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mou... | 12/06/1994 |
| 5365409 | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electr... | 11/15/1994 |
