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U.S. patent applications available from 2005 to present.

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Examiner: Nguyen, Dilinh P


Primary examiner statistics: 0 patents; average approval time: N/A
Assistant examiner statistics: 97 patents; average approval time: 119 days

Patents as Primary Examiner

Patent No. Patent Title:
No patents.

Patents as Assistant Examiner (view all)

Patent No. Patent Title:
8067824 Integrated circuit module package and assembly method thereof
8049256 Active pixel sensor having a sensor wafer connected to a support ...
8030646 Light-emitting element using organic compound
8013439 Injection molded metal stiffener for packaging applications
8008126 Castellation wafer level packaging of integrated circuit chips
8008129 Method of making semiconductor device packaged by sealing resin m...
7999364 Method and flip chip structure for power devices
7968988 Power semiconductor module having a thermally conductive base pla...
7968427 Manufacturing method of semiconductor device
7956433 Image detector and radiation detecting system with separation of ...
7952206 Solder bump structure for flip chip semiconductor devices and met...
7952190 Fabrication of microelectronic devices
7952181 Wiring substrate for a multi-chip semiconductor device
7948050 Core-shell nanowire transistor
7944001 Power mosfet including inter-source connection pattern
7939888 Display device and television device using the same
7932602 Metal sealed wafer level CSP
7932616 Semiconductor device sealed in a resin section and method for man...
7928583 Semiconductor device
7923294 Semiconductor package and method for manufacturing the same for d...
7923845 Alignment features for proximity communication
7919389 Semiconductor memory device that is resistant to high voltages an...
7915738 Stackable multi-chip package system with support structure
7911044 RF module package for releasing stress
7902015 Array of nanoscopic MOSFET transistors and fabrication methods
7902651 Apparatus and method for stacking integrated circuits
7897982 Light emitting device having common N-electrode
7893453 LED device and method for manufacturing the same
7871859 Vertical surface mount assembly and methods
7868438 Multi-chip package for reducing parasitic load of pin
7855464 Semiconductor device having a semiconductor chip and resin sealin...
7847383 Multi-chip package for reducing parasitic load of pin
7838980 TO263 device package having low moisture sensitivity
7838348 Semiconductor device
7834469 Stacked type chip package structure including a chip package and ...
7825430 Semiconductor device with a high breakdown voltage device
7807557 Method of forming a semiconductor device having a trapping film f...
7808112 Wafer level pre-packaged flip chip system
7808096 Semiconductor package and production method thereof, and semicond...
7795716 RF transistor output impedance technique for improved efficiency,...
 
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