Bizarre Patents
Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8187976 | Stable P-type semiconducting behaviour in Li and Ni codoped ZnO A method is provided for growing a stable p-type ZnO thin film with low resistivity and high mobility. The method includes providing an n-type Li—Ni co-doped ZnO target in a chamber, providing a substrate in the chamber, and ablating the target to form the thin fi... | 05/29/2012 |
| 8188500 | Organic light-emitting element and light-emitting device using the same An organic light-emitting element includes a first electrode, a second electrode, and at least one organic compound layer disposed between the first electrode and the second electrode. The organic compound layer includes a light-emitting layer containing a light-emi... | 05/29/2012 |
| 8188516 | Creating integrated circuit capacitance from gate array structures Techniques for using gate arrays to create capacitive structures within an integrated circuit are disclosed. Embodiments comprise placing a gate array of P-type field effect transistors (P-fets) and N-type field effect transistors (N-fets) in an integrated circuit d... | 05/29/2012 |
| 8188422 | Fabrication of three-dimensional ion optics assemblies by metallization of non-conductive substrates A die assembly for creating a ring electrode including a cylindrically-shaped die base, two die walls and a die top sized to fit inside a cylindrical die housing. The die base and die top having a series of concentric elevations used as impressions to form on two en... | 05/29/2012 |
| 8183598 | Semiconductor device, semiconductor module, and electronic apparatus including process monitoring pattern overlapping with I/O pad A semiconductor device includes a process monitoring pattern overlapping with an input/output (I/O) pad. The semiconductor device may include a semiconductor substrate having a cell array region and a peripheral circuit array region, and a plurality of process monit... | 05/22/2012 |
| 8183641 | Semiconductor device and method for manufacturing same A silicon oxynitride film is formed on entire surface of a semiconductor substrate, a lanthanum oxide film is formed on the silicon oxynitride film and the lanthanum oxide film is removed from a pMOS region. Then, a nitrided hafnium silicate film serving as a highly... | 05/22/2012 |
| 8183664 | Electrostatic discharge protection device, method of manufacturing the same, method of testing the same An electrostatic discharge protection device, a method of manufacturing the same, and a method of testing the same. The electrostatic protection device includes a plurality of device isolation regions formed in a semiconductor substrate at a predetermined width and ... | 05/22/2012 |
| 8178390 | Semiconductor component and production method A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provide... | 05/15/2012 |
| 8178909 | Integrated circuit cell architecture configurable for memory or logic elements An improved integrated circuit cell architecture is provided for configurability between a memory cell or logic elements. The cell architecture is configured on variable layers above a first layer of metal, with the first layer of metal and layers therebelow reserve... | 05/15/2012 |
| 8178920 | Semiconductor device and method of forming the same A semiconductor device and a method of forming thereof has a base body has a field stopping layer, a drift layer, a current spreading layer, a body region, and a source contact region layered in the order on a substrate. A trench that reaches the field stopping laye... | 05/15/2012 |
| 8178952 | Method of forming high-k dual dielectric stack The present invention discloses a method including: providing a Group III-V component semiconductor material; forming a first layer over a surface of the Group III-V component semiconductor material, the first layer to unpin a Fermi level at the surface; forming a s... | 05/15/2012 |
| 8178921 | Semiconductor device having reduced standby leakage current and increased driving current and method for manufacturing the same A semiconductor device includes a semiconductor substrate having an active region which includes a gate forming zone and an isolation region; an isolation layer formed in the isolation region of the semiconductor substrate to expose side surfaces of a portion of the... | 05/15/2012 |
| 8173515 | Method for manufacturing semiconductor device An oxide film and a liner film are formed on an inner wall of a trench in a semiconductor substrate. After filling an SOD film in the trench, a heat treatment is carried out. Part of the liner film in contact with the SOD film is removed to expose part of the SOD fi... | 05/08/2012 |
| 8174012 | Organic light emitting diode display device and method of manufacturing the same An organic light emitting diode display device (OLED display device) having uniform electrical characteristics and a method of manufacturing the same. The OLED display device includes: a substrate; a semiconductor layer disposed on the substrate, and including sourc... | 05/08/2012 |
| 8174097 | Electric sub-assembly An electric sub-assembly has an integrated circuit, which contains at least one power semi-conductor component and additional electronic components, the latter being interconnected and linked to connections by the conductors of a lead frame (1, 2, 3). The lea... | 05/08/2012 |
| 8173462 | Manufacturing method of nitride crystalline film, nitride film and substrate structure A manufacturing method of a nitride crystalline film includes following steps. First, a substrate is provided. Next, a first nitride crystalline film is formed on the substrate. A patterned mask is then formed on the first nitride crystalline film. The patterned mas... | 05/08/2012 |
| 8174175 | Light-emitting device and method for manufacturing same The light-emitting device of the present invention is a light-emitting device having a plurality of pixels that comprises a light-emitting function layer of at least one layer that emits light in accordance with a supplied current, a first electrode layer of a condu... | 05/08/2012 |
| 8174125 | Manufacturing method of a semiconductor device A manufacturing method of a semiconductor device comprises: providing a first insulating film whose relative dielectric constant is at most a predetermined value above a substrate; providing a second insulating film whose relative dielectric constant is greater than... | 05/08/2012 |
| 8173508 | Semiconductor device having vertical type MOSFET and manufacturing method thereof A method (and resultant structure) includes forming a semiconductor layer having plural stripe-like trenches, forming a gate electrode buried partially in each of the plural trenches, and introducing an impurity into the semiconductor layer by ion implantation after... | 05/08/2012 |
| 8170235 | Hearing apparatus with unsymmetrical tone balance unit and corresponding control method For hearing apparatus and especially for hearing devices a tone balance unit is to be able to be used even under difficult general conditions. Therefore a hearing apparatus with a signal processing device, through which signals are able to be processed in a number o... | 05/01/2012 |
| 8170258 | Bass drum microphone device A bass drum microphone device for securing a microphone inside a bass drum comprising a first support bar, a second support bar, and a cross support bar, and the bars connect to form an H-shaped structure. Attached to the cross support bar is a microphone attachment... | 05/01/2012 |
| 8168514 | Laser separation of thin laminated glass substrates for flexible display applications A method of separating a sheet of coated brittle material comprises the steps of providing a sheet of layered brittle material comprising a brittle layer and a coating material adhered to a surface of the brittle layer and applying a laser along a separation line in... | 05/01/2012 |
| 8168933 | Method for forming image sensor with shield structures An image sensor having shield structures and methods of forming the same are provided. Generally, the image sensor includes: (i) substrate having at least one photosensitive element formed therein; (ii) a dielectric layer overlying the substrate and the photosensiti... | 05/01/2012 |
| 8168539 | Method for forming tungsten film at a surface of a processing target material, film-forming apparatus, storage medium and semiconductor device with a tungsten film A tungsten film with a lower specific resistance and a lower fluorine concentration over its boundary with the base barrier layer, which adheres to the barrier layer with a high level of reliability, compared to tungsten films formed through methods in the related a... | 05/01/2012 |
| 8163640 | Metal gate compatible electrical fuse A dielectric material layer is formed on a metal gate layer for a metal gate electrode, and then lithographically patterned to form a dielectric material portion, followed by formation of a polycrystalline semiconductor layer thereupon. A semiconductor device employ... | 04/24/2012 |
| 8164117 | Nitride semiconductor device A nitride semiconductor device includes: a main semiconductor region comprising a first nitride semiconductor layer having a first band gap, and a second nitride semiconductor layer having a second band gap larger than the first band gap, a heterojunction being form... | 04/24/2012 |
| 8163639 | Photo diode and method for manufacturing the same A method of fabricating a photo diode includes sequentially forming a buried layer of a first conductivity type, a first epitaxial layer of the first conductivity type, and a second epitaxial layer of a second conductivity type on a semiconductor substrate; forming ... | 04/24/2012 |
| 8164151 | Thin active layer fishbone photodiode and method of manufacturing the same The present invention is directed toward a detector structure, detector arrays, and a method of detecting incident radiation. The present invention comprises a photodiode array and method of manufacturing a photodiode array that provides for reduced radiation damage... | 04/24/2012 |
| 8165327 | Method for generating acoustic signals of a hearing aid Acoustic signal tones of a hearing aid need to be adjusted to the particular situation so as to be easy to hear, i.e. on the one hand they should not be too loud in quiet situations, and on the other hand they should not be too quiet in noisy situations. In order to... | 04/24/2012 |
| 8165328 | Hearing aid A hearing aid is provided which comprise an audio signal input device (11), a signal processor (12) a signal output device (13) which presents a processed audio signal perceivable as sound to an ear of a user, where the signal processor comprise... | 04/24/2012 |
| 8159045 | Semiconductor device with shield line disposed between capacitors A semiconductor device includes: a first capacitor including an upper electrode, a lower electrode, an intermediate electrode arranged between the upper electrode and the lower electrode, and a shield line arranged in the same layer as the intermediate electrode; an... | 04/17/2012 |
| 8158511 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features A method of depositing a metal seed layer with underlying barrier layer on a wafer substrate comprising a plurality of recessed device features. A first portion of the barrier layer is deposited on the wafer substrate without excessive build-up of barrier layer mate... | 04/17/2012 |
| 8156981 | Combination of a substrate and a wafer The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated betwe... | 04/17/2012 |
| 8159000 | LED package having an array of light emitting cells coupled in series Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Si... | 04/17/2012 |
| 8158491 | IC card and booking-account system using the IC card It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a disp... | 04/17/2012 |
| 8158458 | Power semiconductor module and method of manufacturing the same A power semiconductor module and a method of manufacture thereof includes lead a frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using b... | 04/17/2012 |
| 8158514 | Method for producing vertical electrical contact connections in semiconductor wafers The invention relates to a method for producing vertical electrical connections in semiconductor wafers, the method including the following steps: application of a protective resist to the wafer front side; patterning of the protective resist such that the contacts ... | 04/17/2012 |
| 8154047 | Solid element device and method for manufacturing the same A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic se... | 04/10/2012 |
| 8153483 | Semiconductor device having a vertical transistor and method for manufacturing the same A semiconductor device having a vertical transistor comprises a silicon substrate; a drain region, a channel region and a source region vertically stacked on the silicon substrate; a buried type bit line formed under the drain region in the silicon substrate to cont... | 04/10/2012 |
| 8154121 | Polymer interlayer dielectric and passivation materials for a microelectronic device Polymer interlayer dielectric and passivation materials for a microelectronic device are generally described. In one example, an apparatus includes one or more interconnect structures of a microelectronic device and one or more polymeric dielectric layers coupled wi... | 04/10/2012 |
