Famous Patents
Pong, the Atari creation that launched the computer game craze, came with these instructions: "Avoid missing ball for high score."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7211889 | Semiconductor package and method for manufacturing the same A semiconductor package includes a wiring board, a semiconductor chip flip-chip bonded to the wiring board, an adhesive coated on the wiring board, a stiffener ring attached to the wiring board, and a heat spreader attached to the stiffener ring and the semiconducto... | 05/01/2007 |
| 7019221 | Printed wiring board A printed wiring board including a first printed wiring board and at least one second printed wiring board composed of a different material from a material of which the first printed wiring board is composed. The second printed wiring board is fixed to at least a pa... | 03/28/2006 |
| 6995983 | Component carrier The present invention is a component carrier comprising a plate of insulating material having a plurality of apertures for accepting the leads of a thru-hole differential and common mode filter. Another embodiment comprises a surface mount component carrier comprise... | 02/07/2006 |
| 6921869 | Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof A conductive pattern made of copper foil is formed on a base material in each of a plurality of laminated flexible printed circuit boards, and a land is formed to expose the conductive pattern at a predetermined position in the base material. The plurality of flexib... | 07/26/2005 |
| 6914196 | Reel-deployed printed circuit board A reel-deployed printed circuit board for chip-on-board (COB) packages and a method for manufacturing COB packages using the reel printed circuit board are disclosed. The novel circuit board comprises an elongated, flexible base board and a plurality of unit boards ... | 07/05/2005 |
| 6888243 | Semiconductor device To improve the radiation property without inhibiting miniaturization of the device, heat generated at a heat generating layer (5) is radiated to a substrate (1) via plugs (7, 17), wiring layers (8, 18), and plugs (9, 19). A cross s... | 05/03/2005 |
| 6884944 | Multi-layer printed wiring boards having blind vias A multi-layer printed wiring board having via holes is characterized by having the outer copper wifing circuit lines on a layer of an alkaline refractory metal which is adjacent to a thermosetting resin layer. An alkaline refractory metal which is insoluble is alkal... | 04/26/2005 |
| 6864430 | Superconducting cable having a flexible former In order to provide a flexible oxide superconducting cable which is reduced in AC loss, tape-shaped superconducting wires covered with a stabilizing metal are wound on a flexible former. The superconducting wires are preferably laid on the former at a bending strain... | 03/08/2005 |
| 6838755 | Leadframe for integrated circuit chips having low resistance connections A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the s... | 01/04/2005 |
| 6838760 | Packaged microelectronic devices with interconnecting units Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attache... | 01/04/2005 |
| 6838297 | Nanostructure, electron emitting device, carbon nanotube device, and method of producing the same The invention provides a nanostructure including an anodized film including nanoholes. The anodized film is formed on a substrate having a surface including at least one material selected from the group consisting of semiconductors, noble metals, Mn, Fe, Co, Ni, Cu ... | 01/04/2005 |
| 6828511 | Prefabricated semiconductor chip carrier A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semic... | 12/07/2004 |
| 6809411 | Low-inductance semiconductor components In order to obtain a minimal leakage inductance in a semiconductor component, it is necessary to provide at least two adjacent switching elements whose load current connection elements which are adjacent on one housing side to have different polarities. A multiplici... | 10/26/2004 |
| 6806558 | Integrated segmented and interdigitated broadside- and edge-coupled transmission lines A combination edge- and broadside-coupled transmission line element formed in an integrated circuit chip, using semiconductor processes, in a stack of metal layers separated by dielectric layers. Each of the metal layers includes a number of transmission lines. Inte... | 10/19/2004 |
| 6787710 | Wiring board and a method for manufacturing the wiring board In holes formed in a multi-layer wiring board for transmitting differential signals, a first hole is formed, an insulating portion is formed by filling the first hole with an insulating resin, a pair of second holes is formed for transmitting the differential signal... | 09/07/2004 |
| 6784526 | Integrated circuit device module According to the present invention, for a module in which a plurality of integrated circuit devices are mounted in parallel, the inductance generated by the unit length of a branched signal line on a motherboard is so set that it is smaller for a branched signal lin... | 08/31/2004 |
| 6753483 | Printed circuit board and method of manufacturing the same The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring ... | 06/22/2004 |
| 6753556 | Silicate gate dielectric A method of forming a silicate dielectric having superior electrical properties comprising forming a metal oxide layer on a Si-containing semiconductor material and reacting the metal oxide with the underlying Si-containing material in the presence of an oxidizing g... | 06/22/2004 |
| 6747362 | Perimeter matrix ball grid array circuit package with a populated center A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the pa... | 06/08/2004 |
| 6737720 | Packaging structure of image sensor and method for packaging the same A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The m... | 05/18/2004 |
| 6734535 | Semiconductor device, method of manufacture thereof, circuit board, and electronic instrument A semiconductor device comprising: a semiconductor chip (10) on which a plurality of electrodes are formed; a first flexible substrate (20) which is larger than the surface of the semiconductor chip (10) on which the electrodes (12) are f... | 05/11/2004 |
| 6730858 | Circuit board having bonding areas to be joined with bumps by ultrasonic bonding A circuit board for mounting a part having a plurality of bumps by ultrasonic bonding. The circuit board includes a main body and a conductive layer provided on the main body. The conductive layer has a conductive pattern having at least one bonding area configured ... | 05/04/2004 |
| 6724082 | Systems having modules with selectable on die terminations In some embodiments, the invention includes a system having first and second modules; and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extending from the circuit board ... | 04/20/2004 |
| 6724095 | Apparatus for aligning an integrated circuit package with an interface An integrated circuit package is provided with alignment pads which are solid or annular ring shaped. Alignment members such as balls or bullets are attached to the alignment pads via a wetting media. When heated, the wetting media serves to center and seat the alig... | 04/20/2004 |
| 6720207 | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof... | 04/13/2004 |
| 6720662 | Semiconductor device of chip-on-chip structure with a radiation noise shield A semiconductor device of chip-on-chip structure is provided which includes a first semiconductor chip and a second semiconductor chip bonded onto the first semiconductor chip in stacked relation. In one embodiment, a noise shield film is provided between the first ... | 04/13/2004 |
| 6717063 | Multi-layer circuit board with supporting layers of different materials The invention relates to a process for manufacturing a structure (100) for a circuit board which comprises a plurality of supporting layers (10, 30, 60, 90), all of different materials, which supporting layers (10, 30, 60, 90) support electrical... | 04/06/2004 |
| 6717823 | Systems having modules with buffer chips In some embodiments, the invention includes a system having first and second modules, the first module having a first group of chips and the second module having a second group of chips, and a circuit board including first and second module connectors to receive the... | 04/06/2004 |
| 6717819 | Solderable flexible adhesive interposer as for an electronic package, and method for making same A solderable flexible adhesive interposer having solderable contacts includes low-modulus-of-elasticity (i.e. molecularly flexible) conductive adhesive vias to which contacts of an electronic device, such as a semiconductor chip or die or other component, are connec... | 04/06/2004 |
| 6717069 | Surface-mounting substrate and structure comprising substrate and part mounted on the substrate A surface-mounting substrate, for mounting thereon a part such as a semiconductor device, which comprises a core substrate, a plurality of layers of patterned wiring lines, which are separated from each other by an insulation layer interposed therebetween, vias pier... | 04/06/2004 |
| 6710434 | Window-type semiconductor package and fabrication method thereof A window-type semiconductor package and a fabrication method thereof are provided. A substrate having an opening is mounted with at least a chip in a manner that, a conductive area of an active surface of the chip is exposed to the opening, and electrically connecte... | 03/23/2004 |
| 6710260 | Printed circuit board and manufacturing method of the printed circuit board In a manufacturing method of a printed circuit board comprising a process of forming a circuit pattern on the surface of the base substrate (13) of which surface is at least composed of an insulative material, a process of forming the insulative layer (15 | 03/23/2004 |
| 6706975 | Paste for filling throughhole and printed wiring board using same A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): ... | 03/16/2004 |
| 6707108 | Transient voltage suppressor structure A kind of transient voltage suppressor structure that prevents the edge of the signal electrode from contacting with the variable impedance material by using an insulation layer to remove the point discharge existing on the edge of the signal electrode and increase ... | 03/16/2004 |
| 6704206 | Assembly device and method for assembling an electronic component An assembly device for an electronic component in sandwich type of construction. The electronic component includes at least one semiconductor element which is contacted in a planar fashion on its lower side and its upper side each by one circuit substrate... | 03/09/2004 |
| 6700073 | Semiconductor device A silicone resin for sealing a semiconductor chip. A cured silicone resin, which is obtained by curing the silicone resin at a given temperature, has a percent elongation, after fracture, measured at a room temperature, not less than 4% of a penetration n... | 03/02/2004 |
| 6700075 | Reduced crosstalk ultrasonic piezo film array on a printed circuit board A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four layers with the two external layers being ground planes to... | 03/02/2004 |
| 6700796 | Transponder and appliance The invention relates to a transponder provided with an integrated circuit, an antenna, and a first capacitor provided with a dielectric and a first and a second capacitor electrode, which transponder comprises a stack of layers, i.e.: a first layer o... | 03/02/2004 |
| 6700070 | Alignment mark for placement of guide hole The field of the manufacture of electronic components, specifically to manufacturing flexible conductive strips having contact pads thereon, wherein a first set of alignment marks are provided on a substrate. Using the first set of alignment marks, severa... | 03/02/2004 |
| 6700076 | Multi-layer interconnect module and method of interconnection An electronic module includes an interconnect module having a plurality of metal layers separated by a plurality of dielectric layers in a stacked structure with electronic components mounted on one surface of the module. The electronic components are sel... | 03/02/2004 |
