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| Number | Title | Issue Date |
| 8143689 | Sensor device A sensor device for sensing air flow speed at the exterior of an aircraft, comprising a substrate having an upper side on which is mounted a diaphragm over an aperture or recess in the substrate, the diaphragm being thermally and electrically insulative, and mountin... | 03/27/2012 |
| 7888172 | Chip stacked structure and the forming method A chip package structure is provided, includes a chip that having a plurality of pads and an adhesive layer on the back side; an encapsulated structure is covered around the four sides of the chip to expose the pads, and the through holes is formed within the encaps... | 02/15/2011 |
| 7463831 | Transponder assembly for use with parallel optics modules in fiber optic communications systems A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately trans... | 12/09/2008 |
| 7445971 | Thin film transistor and method for manufacturing the same The present invention provides a thin-film transistor that is formed by using a patterning method capable of forming a semiconductor channel layer in sub-micron order and a method for manufacturing thereof that provides a thin-film transistor with a larger area, and... | 11/04/2008 |
| 7446392 | Electronic device and method for manufacturing the same An electronic device is provided using wiring comprising aluminum to prevent hillock or whisker from generating, wherein the wiring contains oxygen atoms at a concentration of 8×1018 atoms·cm−3 or less, carbon atoms at a concentration of 5Ã... | 11/04/2008 |
| 7445979 | Method of fabricating isolated semiconductor devices in epi-less substrate An structure for electrically isolating a semiconductor device is formed by implanting dopant into a semiconductor substrate that does not include an epitaxial layer. Following the implant the structure is exposed to a very limited thermal budget so that dopant does... | 11/04/2008 |
| 7446002 | Method for making a semiconductor device comprising a superlattice dielectric interface layer A method for making a semiconductor device may include forming a superlattice comprising a plurality of stacked groups of layers adjacent a substrate. Each group of layers of the superlattice may include a plurality of stacked base semiconductor monolayers defining ... | 11/04/2008 |
| 7435673 | Methods of forming integrated circuit devices having metal interconnect structures therein Methods of forming metal interconnect structures include forming a first electrically insulating layer on a semiconductor substrate and forming a second electrically insulating layer on the first electrically insulating layer. The second and first electrically insul... | 10/14/2008 |
| 7427548 | Method for producing charge-trapping memory cell arrays A memory layer sequence comprising a lower confinement layer (2), a charge-trapping layer (3), and an upper confinement layer (4) is applied on the main surface of a silicon substrate (1). By a photolithography step, trenches running para... | 09/23/2008 |
| 7427537 | Semiconductor integrated circuit device and method for manufacturing the same In a semiconductor integrated circuit device having a system-on-chip structure in which a DRAM and a logic integrated circuit are mixedly mounted on a chip, a silicide layer is formed on the surfaces of the source and the drain of a MISFET of a direct peripheral cir... | 09/23/2008 |
| 7410879 | System and method for providing a dual via architecture for thin film resistors A buried thin film resistor having end caps defined by a dielectric mask is disclosed. A thin film resistor is formed on an integrated circuit substrate. A resistor protect layer is formed over the thin film resistor. First and second portions of a first dielectric ... | 08/12/2008 |
| 7402182 | High-power LGA socket A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion ... | 07/22/2008 |
| 7402466 | Strained silicon CMOS on hybrid crystal orientations Methods of forming a strained Si-containing hybrid substrate are provided as well as the strained Si-containing hybrid substrate formed by the methods. In the methods of the present invention, a strained Si layer is formed overlying a regrown semiconductor material,... | 07/22/2008 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7399671 | Disposable pillars for contact formation Sacrificial plugs for forming contacts in integrated circuits, as well as methods of forming connections in integrated circuit arrays are disclosed. Various pattern transfer and etching steps can be used to create densely-packed features and the connections between ... | 07/15/2008 |
| 7399919 | Flexible heat sink Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, ... | 07/15/2008 |
| 7388279 | Tapered dielectric and conductor structures and applications thereof Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes ... | 06/17/2008 |
| 7387902 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/17/2008 |
| 7387912 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 06/17/2008 |
| 7384799 | Method to avoid amorphous-si damage during wet stripping processes in the manufacture of MEMS devices A method for forming a MEMS device using an amorphous silicon layer as a release layer includes etching superjacent films and using the amorphous silicon layer as an etch stop layer. The amorphous silicon layer is resistant to attack during the post-etch solvent str... | 06/10/2008 |
| 7381573 | Self-aligned, low-resistance, efficient memory array The present invention seeks to reduce the amount of current required for a write operation by using a process for forming the read conductor within a recessed write conductor, the write conductor itself formed within a trench of an insulating layer. The present inve... | 06/03/2008 |
| 7381613 | Self-aligned MIM capacitor process for embedded DRAM A semiconductor device includes a group of capacitors and a trench. Each capacitor includes a first conductive material layer, a dielectric layer, and a second conductive material layer. The dielectric layer is located between the first and second conductive materia... | 06/03/2008 |
| 7381604 | Strained-channel semiconductor structure and method for fabricating the same A strained-channel semiconductor structure and method of fabricating the same. The strained-channel semiconductor structure comprises a substrate composed of a first semiconductor material with a first natural lattice constant. A channel region is disposed in the su... | 06/03/2008 |
| 7371624 | Method of manufacturing thin film semiconductor device, thin film semiconductor device, electro-optical device, and electronic apparatus A method of manufacturing a thin film semiconductor device which includes a thin film transistor having a first semiconductor layer, a gate insulating layer, and a gate electrode which are laminated in this order on a substrate, and a capacitive element having a low... | 05/13/2008 |
| 7361540 | Method of reducing noise disturbing a signal in an electronic device Certain aspects of a method for reducing noise disturbing at least one signal in an electronic device may comprise shielding a first layer doped with a first dopant from a signaling layer employing a second layer doped with a second dopant. A first signaling compone... | 04/22/2008 |
| 7354798 | Three-dimensional device fabrication method A method is described for fabricating a three-dimensional integrated device including a plurality of vertically stacked and interconnected wafers. Wafers (1, 2, 3) are bonded together using bonding layers (26, 36) of thermoplastic material such as poly... | 04/08/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7338882 | Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same A method of fabricating a nano silicon on insulator (SOI) wafer having an excellent thickness evenness without performing a chemical mechanical polishing (CMP) and a wafer fabricated by the same are provided. The provided method includes preparing a bond wafer and a... | 03/04/2008 |
| 7338843 | Method for producing an electronic component, especially a memory chip A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of ... | 03/04/2008 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c... | 02/26/2008 |
| 7335965 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 02/26/2008 |
| 7331102 | Apparatus for detecting an amount of strain and method for manufacturing same An apparatus for detecting an amount of strain comprises a strain generating part, an electrical insulating layer and sensing elements. The strain generating part is a member to which strain is to be applied. The electrical insulating layer is formed on the strain g... | 02/19/2008 |
| 7329564 | Wafer dividing method A method of dividing a wafer having a plurality of dividing lines formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of dividing lines into individual chips, along the dividing lines, the ... | 02/12/2008 |
| 7327035 | System and method for providing a low frequency filter pole Systems are provided for producing a low frequency filter pole. A first bond pad is coupled to a power source. A second bond pad is inductively connected to the first bond pad by a first bond wire. A capacitor is connected to the second bond pad. A third bond pad is... | 02/05/2008 |
| 7318844 | Laser-irradiated metallized electroceramic The manufacturing method for an electroceramic component (1), for example a varistor (1), comprises a laser irradiation of a part (5; 6) of the surface of an electroceramic body (2) before a metallization (3; 4) is applied to the p... | 01/15/2008 |
| 7300823 | Apparatus for housing a micromechanical structure and method for producing the same Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure ... | 11/27/2007 |
| 7298021 | Electronic device and method for manufacturing the same An electronic device is provided using wiring comprising aluminum to prevent hillock or whisker from generating, wherein the wiring contains oxygen atoms at a concentration of 8×1018 atoms·cm−3 or less, carbon atoms at a concentration of 5Ã... | 11/20/2007 |
| 7291385 | Conductive film and method for preparing the same A conductive film comprising: a support; a particle-containing layer; and a metal thin film layer, in this order, wherein the particle-containing layer contains particles having a mean particle size of from 1 to 10 μm and a heat decomposed material of a metal acety... | 11/06/2007 |
| 7291910 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 11/06/2007 |
| 7285764 | Solid state imaging device and method of driving the same An imaging device comprising: a photoelectric conversion element generating photo-generated charges; an accumulation well accumulating the charges; a modulation well storing the charges; a modulation transistor having a channel threshold voltage controlled by the st... | 10/23/2007 |
