| Patent No. | Patent Title: |
| 5622873 | Process for manufacturing a resin molded image pick-up semiconduc... |
| 5622897 | Process of manufacturing a drop-on-demand ink jet printhead havin... |
| 5614441 | Process of folding a strip leadframe to superpose two leadframes ... |
| 5605863 | Device packaging using heat spreaders and assisted deposition of ... |
| 5593465 | Mounting for carrier bodies in an apparatus for the deposition of... |
| 5591678 | Process of manufacturing a microelectric device using a removable... |
| 5591649 | Process of removing a tape automated bonded semiconductor from bo... |
| 5589402 | Process for manufacturing a package for mating with a bare semico... |
| 5587341 | Process for manufacturing a stacked integrated circuit package |
| 5585282 | Process for forming a raised portion on a projecting contact for ... |
| 5585281 | Process and apparatus for forming and testing semiconductor packa... |
| 5578532 | Wafer surface protection in a gas deposition process |
| 5569625 | Process for manufacturing a plural stacked leadframe semiconducto... |
| 5567653 | Process for aligning etch masks on an integrated circuit surface ... |
| 5567648 | Process for providing interconnect bumps on a bonding pad by appl... |
| 5565378 | Process of passivating a semiconductor device bonding pad by imme... |
| 5565008 | Process of raising a semiconductor device out of a pallet using a... |
| 5563103 | Method for manufacturing thermoplastic resin molded semiconductor |
| 5563076 | Process for adjusting heights of plural semiconductor devices on ... |
| 5559051 | Process for manufacturing a silicon chip with an integrated ... |
| 5549716 | Process for manufacturing integrated circuits using an automated ... |
| 5550087 | Process for bonding a semiconductor die to a variable die size in... |
| 5550083 | Process of wirebond pad repair and reuse |
| 5543363 | Process for adhesively attaching a semiconductor device to an ele... |
| 5539550 | Liquid crystal display having adhered circuit tiles |
| 5536677 | Method of forming conductive bumps on a semiconductor device usin... |
| 5533243 | Notch position aligning apparatus and process for using the appar... |
| 5534442 | Process of providing uniform photoresist thickness on an opto-ele... |
| 5532186 | Process for manufacturing bumped tab tape |
| 5532187 | Process for sealing apertures in glass-silicon-glass micromechani... |
| 5529950 | Method for manufacturing a cubically integrated circuit arrangeme... |
| 5529957 | Method for blocking contamination and stabilizing chip capacitor ... |
| 5525548 | Process of fixing a heat sink to a semiconductor chip and package... |
| 5521122 | Process of manufacturing a multichip module using a temporary sup... |
| 5518957 | Method for making a thin profile semiconductor package |
| 5510273 | Process of mounting semiconductor chips in a full-width-array ima... |
| 5504035 | Process for solder ball interconnecting a semiconductor device to... |
| 5502002 | Polyimide passivation of GaAs microwave monolithic integrated cir... |
| 5498767 | Method for positioning bond pads in a semiconductor die layout |
| 5492866 | Process for correcting warped surface of plastic encapsulated ... |
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