U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

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Examiner: Zarneke, David A.


Primary examiner statistics: 854 patents; average approval time: 853 days
Assistant examiner statistics: 438 patents; average approval time: 661 days

Patents as Primary Examiner (view all)

Patent No. Patent Title:
7727809 Attachment method, attachment apparatus, manufacturing method of ...
7462932 Manufacture of mountable capped chips
7462925 Method and apparatus for stacking electrical components using via...
7459404 Adhesion improvement for low k dielectrics
7459781 Fan out type wafer level package structure and method of the same
7459378 Wafer dividing method
7459347 Manufacturing method of a semiconductor device
7459386 Method for forming solder bumps of increased height
7459341 Method of manufacturing an electronic device
7452787 Fabrication method of semiconductor integrated circuit device
7452750 Capacitor attachment method
7452753 Method of processing a semiconductor wafer for manufacture of sem...
7449775 Integrated thermal solution for electronic packages with material...
7449369 Integrated circuit package system with multiple molding
7449366 Wafer level packaging cap and fabrication method thereof
7449785 Solder bump on a semiconductor substrate
7446424 Interconnect structure for semiconductor package
7446409 Cavity-down multiple-chip package
7445965 Method of manufacturing radiating plate and semiconductor apparat...
7445960 Adhesion by plasma conditioning of semiconductor chip
7439621 Radio frequency signal processing device
7436055 Packaging method of a plurality of chips stacked on each other an...
7436047 Wafer having scribe lanes suitable for sawing process, reticle us...
7435623 Integrated micro channels and manifold/plenum using separate sili...
7423347 In-situ deposition for cu hillock suppression
7423336 Bond pad rerouting element, rerouted semiconductor devices includ...
7419842 Encapsulation of electroluminescent devices with shaped spacers
7417306 Apparatuses and methods for forming electronic assemblies
7417313 Method for manufacturing an adhesive substrate with a die-cavity ...
7413935 Semiconductor device and method of fabricating the same
7411306 Packaging structure and method of an image sensor module
7408246 Controlling warping in integrated circuit devices
7407834 Manufacturing method of a semiconductor device
7408254 Stack land grid array package and method for manufacturing the sa...
7408259 Sheet to form a protective film for chips
7407836 High-voltage module and method for producing same
7405091 Method for testing contact open in semicoductor device
7405453 Incorporation of nitrogen into high k dielectric film
7405447 Silicon rich barrier layers for integrated circuit devices
7402908 Intermediate semiconductor device structures

Patents as Assistant Examiner (view all)

Patent No. Patent Title:
7101795 Method and apparatus for depositing refractory metal layers emplo...
6841422 Plastic lead frames for semiconductor devices, packages including...
6808947 Substrate mapping
6787399 Plastic lead frames for semiconductor devices, packages including...
6709874 Method of manufacturing a metal cap layer for preventing damascen...
6642083 Semiconductor device and manufacturing method thereof
6617646 Reduced substrate capacitance high performance SOI process
6602777 Method for controlling the formation of intermetallic compounds i...
6602738 Method of manufacturing semiconductor device having tie bars for ...
6602739 Method for making multichip module substrates by encapsulating el...
6603145 High temperature circuit apparatus
6593171 Stereolithographic methods for fabricating hermetic semiconductor...
6576495 Microelectronic assembly with pre-disposed fill material and asso...
6569755 Semiconductor device having an improved structure for preventing ...
6569702 Triple layer isolation for silicon microstructure and structures ...
6566252 Method for simultaneous deposition and sputtering of TEOS and dev...
6566744 Integrated circuit packages assembled utilizing fluidic self-asse...
6562643 Packaging types of light-emitting diode
6562647 Chip scale surface mount package for semiconductor device and pro...
6562661 Tape stiffener, semiconductor device component assemblies includi...
6563207 Split-mold and method for manufacturing semiconductor device by u...
6562660 Method of manufacturing the circuit device and circuit device
6559519 Integrated circuit device having cyanate ester buffer coat and me...
6559545 Semiconductor devices and methods for manufacturing semiconductor...
6555400 Method for substrate mapping
6555444 Device and method for core buildup using a separator
6551860 Systems and methods for application of substantially dry atmosphe...
6551929 Bifurcated deposition process for depositing refractory metal lay...
6551920 Semiconductor device and fabrication method thereof
6551863 Flip chip dip coating encapsulant
6548909 Method of interconnecting electronic components using a plurality...
6548906 Method for reducing a metal seam in an interconnect structure and...
6544820 Plastic lead frames for semiconductor devices, packages including...
6544821 Stereolithographic methods of fabricating semiconductor devices h...
6541871 Method for fabricating a stacked chip package
6541852 Framed sheets
6541364 Bump forming method and bump forming apparatus
6537857 Enhanced BGA grounded heatsink
6537858 Method for manufacturing semiconductor device
6538311 Two-stage transfer molding method to encapsulate MMC module
 
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