| Patent No. | Patent Title: |
| 7687917 | Single damascene structure semiconductor device having silicon-di... |
| 7462940 | Semiconductor component comprising flip chip contacts with polyme... |
| 7462887 | Semiconductor connection component |
| 7459777 | Semiconductor package containing multi-layered semiconductor chip... |
| 7459770 | Lead frame structure having blocking surfaces and semiconductor p... |
| 7459776 | Stacked die assembly having semiconductor die projecting beyond s... |
| 7456502 | Wiring board with connection electrode formed in opening and semi... |
| 7453159 | Semiconductor chip having bond pads |
| 7446400 | Chip package structure and fabricating method thereof |
| 7446398 | Bump pattern design for flip chip semiconductor package |
| 7446412 | Heat sink design using clad metal |
| 7443032 | Memory device with chemical vapor deposition of titanium for tita... |
| 7443038 | Flip-chip image sensor packages |
| 7443020 | Minimizing number of masks to be changed when changing existing c... |
| 7436002 | Surface-mountable radiation-emitting component |
| 7436069 | Semiconductor device, having a through electrode semiconductor mo... |
| 7432585 | Semiconductor device electronic component, circuit board, and ele... |
| 7425758 | Metal core foldover package structures |
| 7414301 | Printed circuit board with soldering lands |
| 7411295 | Circuit board, device mounting structure, device mounting method,... |
| 7411290 | Integrated circuit chip and method for cooling an integrated circ... |
| 7411294 | Display device having misalignment detection pattern for detectin... |
| 7411284 | Accessible electronic storage apparatus |
| 7405470 | Adaptable electronic storage apparatus |
| 7402883 | Back end of the line structures with liner and noble metal layer |
| 7400032 | Module assembly for stacked BGA packages |
| 7400035 | Semiconductor device having multilayer printed wiring board |
| 7399990 | Wafer-level package having test terminal |
| 7397125 | Semiconductor device with bonding pad support structure |
| 7394164 | Semiconductor device having bumps in a same row for staggered pro... |
| 7391100 | Integrated circuit package for semiconductor devices having a red... |
| 7391110 | Apparatus for providing capacitive decoupling between on-die powe... |
| 7388293 | Interposer method of fabricating same, and semiconductor device u... |
| 7385281 | Semiconductor integrated circuit device |
| 7385283 | Three dimensional integrated circuit and method of making the sam... |
| 7382000 | Semiconductor device |
| 7375421 | High density multilayer circuit module |
| 7372139 | Semiconductor chip package |
| 7372153 | Integrated circuit package bond pad having plurality of conductiv... |
| 7368810 | Invertible microfeature device packages |
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