"To place a man in a multi-stage rocket and project him into the controlling gravitational field of the moon where the passengers can make scientific observations, perhaps land alive, and then return to earth--all that constitutes a wild dream worthy of Jules Verne. I am bold enough to say that such a man-made voyage will never occur regardless of all future advances."
Lee deForest, American radio pioneer ; 1957
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| Number | Title | Issue Date |
| 7270038 | Mat for die cutter A cutting mat includes a flat, planar sheet of rigid but flexible material with a plastic film affixed to the lower surface and extending across the length and width of the sheet. In the preferred embodiment, the mat is formed of spring steel. A holder for the mat i... | 09/18/2007 |
| 6979153 | Deep-grooving insert having stepped cutting edge A deep-grooving chip-forming cutting insert includes a rear mounting portion, a front cutting portion, and a pair of side walls, each side wall extending along the front and rear portions. The front cutting portion includes a front end surface, a top surface, and a ... | 12/27/2005 |
| 6948339 | Punch assembly for producing hollow glass articles in a mold A punch assembly for producing hollow glass articles in a mold has a punch member, which is moved to and from the mold along a straight axis by an electric motor positioned eccentrically with respect to the straight axis and connected to the punch member by a rotary... | 09/27/2005 |
| 6311597 | Self-guiding punch and die set A punch and die set is provided for use in a stamping press having a punch assembly and a die assembly reciprocated by a driving mechanism. The punch and die assemblies are aligned to a common center and are structured to slidably engage one another for p... | 11/06/2001 |
| 6178861 | Single station cutting apparatus for separating semiconductor packages Apparatus for cutting single or multiple semiconductor packages from a multilayer substrate wherein the semiconductor packages are partially encapsulated by an elastomer sealant layer disposed on a polymer film layer of the substrate. The apparatus includ... | 01/30/2001 |
| 6173632 | Single station cutting apparatus for separating semiconductor packages Apparatus for cutting single or multiple semiconductor packages from a multilayer substrate wherein the semiconductor packages are partially encapsulated by an elastomer sealant layer disposed on a polymer film layer of the substrate. The apparatus includ... | 01/16/2001 |
| 5615592 | Leather cutting apparatus An apparatus is disclosed for bringing a cutting die into engagement with a workpiece such as leather, the apparatus includes first and second plates secured to C-shaped frame members and a platen for supporting the workpiece that is movable relative to t... | 04/01/1997 |