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Class 700/121 - Integrated circuit production or semiconductor fabrication


Subclass of Class 700 - Data processing: generic control systems or specific applications
Definition: Subject matter wherein the particular manufactured product
No. of patents: 2219
Last issue date: 05/22/2012


1                      
NumberTitleIssue Date
8185230Method and apparatus for predicting device electrical parameters during fabrication
A method includes providing a set of initial characteristic values associated with the semiconductor device. A first fabrication process is performed on the semiconductor device. Fabrication data associated with the first fabrication process is collected. At least o...
05/22/2012
8180473Exposure system, method of testing exposure apparatus, and method of manufacturing device
An exposure system is configured to update control software installed on an exposure apparatus to new control software. The exposure system comprises: at least one exposure apparatus; a simulator configured to test an operation of the exposure apparatus; an output u...
05/15/2012
8170707Failure detecting method, failure detecting apparatus, and semiconductor device manufacturing method
A method for inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process,...
05/01/2012
8165709Four pad self-calibrating electronic lapping guide
Lapping guides for use in fabrication of a magnetic recording head are provided. The lapping guides comprise a first differential electronic lapping guide (ELG) disposed in a first layer of the magnetic recording head. The first differential ELG has a first resistiv...
04/24/2012
8165710Polishing method, polishing apparatus, and program for controlling polishing apparatus
A polishing method includes: a pre-polishing film thickness measurement step of taking a substrate before polishing out of a cassette and measuring a thickness of a polishing film of the substrate with a film thickness measurement device; the pre-polishing substrate...
04/24/2012
8145342Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is pre...
03/27/2012
8145341Product based configuration and control of manufacturing equipment
Methods and apparatus, including computer program products, for product based configuration and control of manufacturing equipment. The present invention provides a method for manufacturing. The method includes identifying components to be mounted on a printed circu...
03/27/2012
8135487Temperature setting method and apparatus for a thermal processing plate
A temperature setting method of the present invention includes the steps of: measuring states of an etching pattern within the substrate for a substrate for which a series of photolithography processing including thermal processing and an etching treatment thereafte...
03/13/2012
8135488Controller for a positioning device, method for controlling a positioning device, positioning device, and lithographic apparatus provided with a positioning device
A controller for a positioning device is constructed and arranged to receive a position signal indicative of a position of the positioning device, compare the position signal to a set-point signal indicative of a desired position of the positioning device to obtain ...
03/13/2012
8132128Method and system for performing lithography verification for a double-patterning process
One embodiment of the present invention provides a system that performs lithography verification for a double-patterning process on a mask layout without performing a full contour simulation of the mask layout. During operation, the system starts by receiving a firs...
03/06/2012
8116894Chemical mechanical polishing method and chemical mechanical polishing device
A chemical mechanical polishing method including a step of forming a plurality of interlayer insulating films so as to coat a plurality of projecting patterns, at least one of the plurality of projecting patterns being formed on each of a plurality of substrates, wh...
02/14/2012
8095901Method and system alerting an entity to design changes impacting the manufacture of a semiconductor device in a virtual fab environment
A design coordination engine coordinates design implementation among a manufacturing facility, a customer, an IP vendor, and a design group during the design phase of a semiconductor device. The design coordination engine includes a tracking module configured to tra...
01/10/2012
8095896Method and system of displaying an exposure condition
There is provided a device which may easily and visually judge which chip in an FEM wafer has a normal exposure condition, or which chip has an abnormal exposure condition. A feature quantity for a sectional shape of a resist pattern of an FEM wafer is calcul...
01/10/2012
8095231Graphical automated machine control and metrology
A graphical programming system allows a user to place geometric shapes onto a scaled image, the shape having associated behavior that operates on the image or on the object of which the image is formed. In a preferred embodiment, the shapes are objects in the Visio ...
01/10/2012
8090464Method and system for enhancing the yield in semiconductor manufacturing
Roughly described, a manufacturing process is enhanced by using TCAD and TCAD-derived models. A TCAD simulation model of the process is developed, which predicts, in dependence upon a plurality of process input parameters, a value for a performance parameter of a pr...
01/03/2012
8078306Polishing apparatus and polishing method
An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substr...
12/13/2011
8073559Material transport systems using autonomous controls
A plurality of autonomous control processes, with each controlling one or more components of the material transport (or processing) system, is used to radically simplify the controller software. Each autonomous control process is responsible for the actions of only ...
12/06/2011
8060233Control system for a plurality of chip mounters and operating method thereof
A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the print...
11/15/2011
8050790Inductor/transformer and manufacturing method thereof
A manufacturing method for the inductor/transformer is disclosed. A simulator is used to simulate the inductance, the quality factor, and the self-resonance frequency of said inductor/transformer to generate at least one group of the area size, the number of the con...
11/01/2011
8050789System and methods for automatic generation of component data
A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automaticall...
11/01/2011
8019458Creating multi-layer/multi-input/multi-output (MLMIMO) models for metal-gate structures
The invention provides a method of processing a wafer using multilayer processing sequences and Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models and libraries that can include one or more measurement procedures, one or more Poly-Etch (P-E) sequences, and one or ...
09/13/2011
8014891Etching amount calculating method, storage medium, and etching amount calculating apparatus
An etching amount calculating method that can stably and accurately calculate the amount of etching even if a disturbance is added. Superposed interference light resulting from superposition of interference light of reflected light from a mask film and reflected lig...
09/06/2011
8014890Method for manufacturing a high-frequency assembly
In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific compo...
09/06/2011
8010222Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a ...
08/30/2011
8010221Cleaning apparatus and method for immersion light exposure
A cleaning apparatus for immersion light exposure includes a cleaning apparatus main body including a mechanism configured to perform a cleaning process on the substrate, and a control section configured to control respective components of the cleaning apparatus mai...
08/30/2011
8001494Table-based DFM for accurate post-layout analysis
Disclosed is a system and method for integrated circuit designs and post layout analysis. The integrated circuit design method includes providing a plurality of IC devices with various design dimensions; collecting electrical performance data of the IC devices; extr...
08/16/2011
7996102Process control using process data and yield data
A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first proce...
08/09/2011
7991499Advanced finishing control
A factory, an apparatus, and methods of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tr...
08/02/2011
7987014Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lo...
07/26/2011
7979154Method and system for managing semiconductor manufacturing device
A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing...
07/12/2011
7979153Exposure data generating apparatus
An exposure-data generating apparatus comprises a first memory, a second memory, and an exposure data memory. The first memory stores drawing data in bitmap format as first data that is used for an exposure. The second memory stores second data whose data unit in a ...
07/12/2011
7974729Server device and program with sub-recipe measurement communication
A server device is provided with a measurement information storage unit 1201 which can store plural measurement information, i.e., information having a measurement value and time information indicating time; an instruction receiving unit for receiving an outp...
07/05/2011
7974728System for extraction of key process parameters from fault detection classification to enable wafer prediction
A system, method, and computer readable medium for extracting a key process parameter correlative to a selected device parameter are provided. In an embodiment, the key process parameter is determined using a gene map analysis. The gene map analysis includes groupin...
07/05/2011
7970486Method for controlling semiconductor manufacturing apparatus and control system of semiconductor manufacturing apparatus
A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment ...
06/28/2011
RE42481Semiconductor yield management system and method
A system and method for yield management is disclosed wherein a data set containing one or more prediction variable values and one or more response values is input into the system. The system can pre-process the input data set to remove prediction variables with mis...
06/21/2011
7962864Stage yield prediction
In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a ...
06/14/2011
7957826Methods for normalizing error in photolithographic processes
A method for fabricating parts using a photolithography system, includes: performing a search of normalization data for an estimated dose operating point; and using the estimated dose operating point for fabrication of new parts. ...
06/07/2011
7957829Method for positioning and/or guiding at least one arbitrary process head for the metalization of thin substrates at a defined distance above the substrate surface
A method for positioning or guiding at least one arbitrary print head or a printing unit having at least one pressure nozzle for the imprinting of thin substrates such as wafers at a defined distance above the surface of the substrate, which is to be provided on a s...
06/07/2011
7957827Method of controlling statuses of wafers
A method of controlling statuses of a plurality of wafers is described. A status of a wafer among the wafers is determined. An action related to the status is taken, according to the status determined, to the wafer and/or other wafers to improve a yield or yields th...
06/07/2011
7957828Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage medium
In the present invention, the line widths within a substrate of an etching pattern are measured for a substrate for which photolithography processing and an etching treatment thereafter have been finished. The line width measurement results are converted into the li...
06/07/2011
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