Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7331414 | Protective structure for an electrical circuit device A protective structure for an electrical circuit device attached to a vehicle includes a resin case, an electrical circuit, and a rigid body. The electrical circuit is contained in the resin case. The rigid body is contained in the resin case. The rigid body protrud... | 02/19/2008 |
| 7303457 | Method of bonding display substrates by application of an electric current to heat and melt a bonding material After sealing layers are formed on peripheral edge parts of a front substrate and a rear substrate, the front substrate and the rear substrate are disposed to be opposed to each other. Current paths are formed in the sealing layers, and power supply is begun. An ele... | 12/04/2007 |
| 7302142 | Method and device for assembling optical components or an optical component and a substrate An optical assembly includes an optical component, a substrate, and a thin glass layer located at the interface between the optical component and the substrate. The substrate can be a metal, a semiconductor, a plastic, a shape memory material, or a metal layer depos... | 11/27/2007 |
| 7211923 | Rotational motion based, electrostatic power source and methods thereof A power system includes a member with two or more sections and at least one pair of electrodes. Each of the two or more sections has a stored static charge. Each of the pair of electrodes is spaced from and on substantially opposing sides of the member from the othe... | 05/01/2007 |
| 7201022 | Systems and methods for filling voids and improving properties of porous thin films Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or ... | 04/10/2007 |
| 7192844 | Glass-based SOI structures Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer (15) of a substantially single-crystal semiconductor (e.g., doped silicon) attached to a support substrate (20... | 03/20/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7176528 | Glass-based SOI structures Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer (15) of a substantially single-crystal semiconductor (e.g., doped silicon) attached to a support substrate (20... | 02/13/2007 |
| 7152433 | Method of manufacturing image display apparatus and apparatus for manufacturing the same A method of manufacturing an image display apparatus is provided and includes the steps of bringing panel members that constitute a display panel of the image display apparatus into a bake processing chamber, subjecting to bake processing the display panel members, ... | 12/26/2006 |
| 7115012 | Method for manufacturing discharge tube using heat for oxidation of adhension area of electrode lead In a discharge tube manufacture line, electrode clamps are attached to both sides of an electrode lead except on a predetermined adhesion area to fix a glass bead. Then, a power section is driven to energize the area between the electrode clamps. The surface of the ... | 10/03/2006 |
| 7115182 | Anodic bonding process for ceramics A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed ov... | 10/03/2006 |
| 7043881 | Insulated glass assembly with an internal lighting system An insulated glass (IG) assembly for windows which includes an internal lighting system is disclosed. The IG assembly includes two or more panes of glass, a spacer and a strip of light emitting diodes (LEDs). The spacer separates glass panes and provides the hermeti... | 05/16/2006 |
| 6301931 | Vacuum fusion bonded glass plates having microstructures thereon An improved apparatus and method for vacuum fusion bonding of large, patterned glass plates. One or both glass plates are patterned with etched features such as microstructure capillaries and a vacuum pumpout moat, with one plate having at least one hole ... | 10/16/2001 |
| 6197139 | Method for electrostatic thermal bonding of a pair of glass substrates by utilizing a silicon thin film An electrostatic thermal bonding method for bonding a pair of glass substrates, is capable of solving the problems such as a contamination of a device and incomplete vacuum packaging due to gas generated during the bonding of glass substrates utilizing a ... | 03/06/2001 |
| 5987921 | Method for making a semiconductor acceleration sensor A semiconductor acceleration sensor has a silicon detecting body and a glass substrate. The silicon detecting body has a weight, a supporting frame, and beams for coupling the weight to the supporting frame, which are integrally processed from a silicon w... | 11/23/1999 |
| 5948130 | Method and apparatus for making large-scale precision structures in flat glass Flat glass provided with precision structures is required for precision applications, especially for glasses with optical properties, for example for modern flat display screen glass. A method for forming precision structures in or on flat glass includes ... | 09/07/1999 |
| 5938911 | Process for producing glass coatings for anodic bonding purposes The invention relates to a method of anodic bonding and a method for producing glass coatings for purposes of anodic bonding and colloidal solutions suitable for this purpose. The method is particularly suitable for anodic bonding with glass coatings with... | 08/17/1999 |
| 5868811 | Method of making a channel plate for a flat display device A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching in a substrate laterally-spaced channels and bonding a thin dielectric sheet over the etched substrate. Adjoining each of the channels are shallow ledge... | 02/09/1999 |
| 5837113 | Small glass electrode A small glass electrode and process for preparation thereof, the small glass electrode having a bonded structure and comprising a reference electrode composed of silver/silver chloride, a glass substrate having a pad embedded therein, the pad being compos... | 11/17/1998 |
| 5827343 | Process for changing the bend of anodically bonded flat composite bodies made of glass and metal or semiconductor materials A method for the controlled bending of anodically bonded two-dimensional composites of glass and metal or semiconductor materials. The composite is heated after bonding, for up to 200 hours to a temperature of from 250° C. to Tg-10 K. As a result of this... | 10/27/1998 |
| 5820648 | Anodic bonding process A process for anodic bonding, in which Si substrate and glass substrate are contacting each other, a voltage is applied therebetween, and then light is irradiated on a contact portion thereof, whereby the Si substrate and the glass substrate are bonded at... | 10/13/1998 |
| 5769997 | Method for bonding an insulator and conductor Anodic bonding of an insulator containing no movable ion and a conductor through the medium of a conductive film and an insulator layer containing a movable ion affords a bonded member of the insulator containing no movable ion and the conductor without u... | 06/23/1998 |
| 5747169 | Field-assisted sealing The invention provides a method of bonding a glass substrate and a nonconductive substrate comprising the steps of: (a) contacting a surface of the nonconductive substrate which is coated with a field-assist bonding material with a conforming surface of t... | 05/05/1998 |
| 5702496 | Shaped glass sheet and a process for the preparation thereof A shaped glass sheet having a sharp bend is provided, wherein a radius of curvature of an outer circumference of the bend transverse to the bend is at most 4 times a thickness of the glass sheet and the straight sections of the shaped glass sheet are subs... | 12/30/1997 |
| 5693111 | Method for sealedly forming envelope A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of ... | 12/02/1997 |
| 5141148 | Method of anodic bonding a semiconductor wafer to an insulator An anodic bonding method in which a semiconductor wafer and an inorganic insulating material are bonded together includes the steps of forming a first metallic thin film having a strong contact with the inorganic insulating material on one surface of the ... | 08/25/1992 |
| 5021074 | Method of and apparatus for joining edges of glass sheets, one of which has an electroconductive coating and the article made thereby An insulated glass unit formed from a pair of glass sheets, one of which has an electroconductive coating, i.e. a first sheet, is fabricated by positioning the first sheet on a vacuum support and the other sheet, i.e. second sheet, spaced above the first ... | 06/04/1991 |
| 5009689 | Method of manufacturing a semiconductor device In a method of manufacturing a semiconductor device, at least a support body (1) and a monocrystalline semiconductor body (2) are provided with at least one flat optically smooth surface obtained by means of bulk-reducing polishing (mirror polishing), whi... | 04/23/1991 |
| 5009690 | Method of bonding single crystal quartz by field-assisted bonding The method of producing a hermetic stable structural bond between quartz crystals includes providing first and second quartz crystals and depositing thin films of borosilicate glass and silicon on portions of the first and second crystals, respectively. T... | 04/23/1991 |
| 4961768 | Methods for bonding optical fibers to wafers Methods for bonding transparent materials to opaque materials. The materials to be bonded are placed in tightly abutting relation to one another, and an energetic laser pulse is directed through the transparent material until it melts a thin surface layer... | 10/09/1990 |
| 4932989 | Method and apparatus for fabricating microlenses on optical fibers This invention concerns with a process and apparatus for fabricating microlenses on optical fibers. A pulsed laser beam and an end portion of a fiber are arranged relative to each to another so that the laser beam is incident on the end portion of the fib... | 06/12/1990 |
| 4804395 | Electrode arrangement for lensing method A system is provided for positioning a pair of electrodes on either side of the end portion of an optical fiber extending through a contact, to establish an arc through a cross-aperture in the contact and across the fiber to melt the fiber into a lens, wh... | 02/14/1989 |
| 4755203 | Optic fiber positioning for lensing method A system is described for forming a lens at the end of an optical fiber which extends through a hole in a contact, so the tip of the lens lies at a desired lens position located a predetermined distance rearward of the tip of the contact. The fiber is fix... | 07/05/1988 |
| 4743283 | Alternating current arc for lensing system and method of using same A system is provided for forming an end of an optical fiber into a lens, which produces a lensed fiber having an especially smooth lens surface and high strength near the intersection of the lens and the rest of the fiber. A lens is formed by establishing... | 05/10/1988 |
| 4718928 | Quick access contact mounting fixture A fixture is provided which enables the rapid mounting of an optical fiber contact with its forward end at a predetermined position and orientation with respect to arc-creating electrodes. The fixture includes a frame with a vertical slot having a width g... | 01/12/1988 |
| 4661236 | Fluid electrode and method of making An improved electrode for detecting ion concentration and a method of manufacturing such an electrode. The electrode includes concentric glass tubes, including an inner tube which is filled with a filling solution and a larger, outer tube which extends ab... | 04/28/1987 |
| 4543116 | Welding and fluid tightness process for the production of sensors A process for producing pressure sensors and other similar devices in which a fluid-tight bond between a sealing glass and another material is obtained under the effect of the application of heat and an electric field. The process is characterized in that... | 09/24/1985 |
| 4501060 | Dielectrically isolated semiconductor devices Dielectrically isolated single crystal silicon of high quality is produced by an extremely convenient process. This process involves the fusing of two silicon bodies where at least one of these bodies has a region of silicon oxide. The bodies are contacte... | 02/26/1985 |
| 4452624 | Method for bonding insulator to insulator A method for making an airtight seal between a pair of insulator elements, uch as glass plates, without destroying any fine structure etched in the insulator elements. A thin metal film is deposited on one of the elements to be sealed and then placed in in... | 06/05/1984 |
| 4384899 | Bonding method adaptable for manufacturing capacitive pressure sensing elements A method of utilizing anodic bonding to bond a conductive semiconductor wafer to a metallized dielectric glass plate so as to form a capacitive pressure sensing element is disclosed. The method includes positioning the semiconductor wafer in contact with ... | 05/24/1983 |
