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| Number | Title | Issue Date |
| 8026335 | Baked resin product and electronic device comprising the same The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that cont... | 09/27/2011 |
| 7994270 | Method for producing thermosetting resin having benzoxazine ring The present invention provides a method for producing a thermosetting resin having a benzoxazine ring, comprising the step of: reacting a bifunctional phenol compound, a diamine compound, and an aldehyde compound in a mixed solvent of an aromatic nonpol... | 08/09/2011 |
| 7378469 | Method for the preparation of 1-benzotriazolyl carbonate esters of poly(ethylene glycol) The invention provides a method for preparing a 1-benzotriazolylcarbonate ester of a water-soluble and non-peptidic polymer by reacting a terminal hydroxyl group of a water-soluble and non-peptidic polymer with di(1-benzotriazolyl)carbonate in the presence of an ami... | 05/27/2008 |
| 7378523 | Quinolinols as fluxing and accelerating agents for underfill compositions Underfill compositions comprise a quinolinol or a quinolinol derivative as a fluxing agent, as an accelerating agent, or as both. The compositions are sufficiently acidic to perform well as fluxes, but not so acidic as to cause premature gelation or corrosion. The c... | 05/27/2008 |
| 7351784 | Chip-packaging composition of resin and cycloaliphatic amine hardener A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting o... | 04/01/2008 |
| 7157509 | Curable compositions Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention. ... | 01/02/2007 |
| 7157549 | Polymerization of oxiranes with a lithium-containing initiator A method is provided for polymerizing oxiranes by employing a lithium-containing polymerization initiator in a liquid reaction medium devoid of polymerization additives. Linear and star polymers can be produced by practicing the subject method. ... | 01/02/2007 |
| 7109061 | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a... | 09/19/2006 |
| 7108920 | Reworkable compositions incorporating episulfide resins This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of whic... | 09/19/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7037399 | Underfill encapsulant for wafer packaging and method for its application A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, fluxing agent... | 05/02/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 6977274 | Epoxy resin curing system containing latent catalytic curing agent causing the expansion of volume The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction... | 12/20/2005 |
| 6955735 | Pultrusion with plastisol A pultrusion machine for forming a laminated composite with a predetermined profile and the product obtained. The apparatus comprises at least two spools for supplying elongated reinforcements. A collator receives the elongated reinforcements and arranges the reinfo... | 10/18/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6946503 | Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins. ... | 09/20/2005 |
| 6893736 | Thermosetting resin compositions useful as underfill sealants The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip... | 05/17/2005 |
| 6808819 | Heat resistant resin composition and adhesive film A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf st... | 10/26/2004 |
| 6800157 | Bonding members with epoxy composition containing chain extender, toughener and catalyst A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a therm... | 10/05/2004 |
| 6649673 | Single component room temperature curable low VOC epoxy coatings A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single compon... | 11/18/2003 |
| 6645631 | Flame retardant phosphorus element-containing epoxy resin compositions A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of... | 11/11/2003 |
| 6627683 | Reworkable thermosetting resin compositions and compounds useful therein Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided ... | 09/30/2003 |
| 6624216 | No-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the compo... | 09/23/2003 |
| 6624246 | Method for the preparation of 1-benzotriazolyl carbonate esters of poly(ethylene glycol) The invention provides a method for preparing a 1-benzotriazolylcarbonate ester of a water-soluble and non-peptidic polymer by reacting a terminal hydroxyl group of a water-soluble and non-peptidic polymer with di(1-benzotriazolyl)carbonate in the presenc... | 09/23/2003 |
| 6620862 | Sheet resin composition and process for manufacturing semiconductor device therewith A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a sub... | 09/16/2003 |
| 6613839 | Polyepoxide, catalyst/cure inhibitor complex and anhydride An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value "n" of greater than zero and less than 2.5, or an organic acid havin... | 09/02/2003 |
| 6608161 | Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a catalyst selected from one or more carboxylic acid(s) or one or m... | 08/19/2003 |
| 6605355 | Epoxy resin composition An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a ... | 08/12/2003 |
| 6562410 | Heat curable epoxy compositions Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1... | 05/13/2003 |
| 6559269 | Curable resin composition and novel latent curing agent A curable resin composition which has excellent curability and storage stability, and in particular, which has improved storage stability under the condition where the resin composition only contains the resin component and the latent curing agent. A cura... | 05/06/2003 |
| 6558812 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1... | 05/06/2003 |
| 6548576 | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders compr... | 04/15/2003 |
| 6548620 | Epoxy resin composition and process for producing the same The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epox... | 04/15/2003 |
| 6548189 | Epoxy adhesive In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the g... | 04/15/2003 |
| 6531549 | Crystallized epoxy resins, their production method, and curable compositions comprising them A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130... | 03/11/2003 |
| 6512074 | Polymerization catalysts of oxirane compounds and process for preparing polymers of oxirane compounds using the catalysts Polymerization catalysts of oxirane compounds are catalysts which are suitable to carry out suspension precipitation polymerization of the oxirane compounds in an organic solvent which cannot dissolve the polymers and comprise a reaction product of (A) an... | 01/28/2003 |
| 6495270 | Compounds, hardening accelerator, resin composition, and electronic part device Nitrogen compounds represented by formula (XXIa) or (XXIb); an epoxy resin hardening accelerator and a resin composition each containing any of the compounds; and an electronic part device containing an element encapsulated with the composition. In the fo... | 12/17/2002 |
| 6486256 | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.... | 11/26/2002 |
| 6465597 | Epoxy-amine compositions containing sulfur as a cure accelerator An epoxy-amine composition includes an epoxy resin, an amine curing agent and elemental sulfur as a cure accelerator. The degree of acceleration is highly regulated by the concentration of sulfur in the epoxy-amine composition and the time and conditions ... | 10/15/2002 |
| 6462164 | 2-phenylimidazole-phosphoric acid salt as an accelerator for acid anhydride curatives in one-component epoxy compositions A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for the acid anhydride curing agent characterized in that 2-phen... | 10/08/2002 |
