Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7390765 | Catalyst of reaction product of polyisocyanate and tertiary amino group-containing amine, alcohol or polyol Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an or... | 06/24/2008 |
| 7301053 | Modified cyclic aliphatic polyamine An object of the present invention is to provide a modified cyclic aliphatic polyamine having a low viscosity and a small content of unreacted polyamine which can provide, when it is used as a curing agent for epoxy resin, an epoxy resin composition having an improv... | 11/27/2007 |
| 7288595 | Polyether carbamate compounds, compositions containing such compounds, and methods related thereto The present invention provides a reaction product having polyether carbamate groups formed from (A) polyoxyalkylene amine, and (B) cyclic carbonate, in an equivalents ratio ranging from 1:0.5 to 1:1.5. Further provided is a process for preparing the aforementioned r... | 10/30/2007 |
| 7223466 | Fiber reinforced resin assembly An uncured fiber reinforced assembly that includes a reinforcement layer containing a fibrous material and at least one highly reactive curing agent. A matrix film layer is applied to the reinforcement layer so that it does not substantially impregnate the reinforce... | 05/29/2007 |
| 7217771 | Epoxy resin Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C.... | 05/15/2007 |
| 7189770 | Curing component and curable resin composition containing the curing component An amine curing component which can be used with various types of prepolymers including a urethane prepolymer having a reactive functional group of highly reactivity is provided. Also provided is a curable resin composition containing such curing component. This cur... | 03/13/2007 |
| 7129290 | Polymeric crosslinkable compositions containing spiroorthocarbonates Polymeric compositions containing spiroorthocarbonate groups and another functional group which reacts with hydroxyl groups are readily crosslinked on contact with water. These compositions are useful as sealants, coatings and encapsulants. ... | 10/31/2006 |
| 7108919 | Reactive non-isocyanate coating compositions Reactive, non-isocyanate coating compositions prepared by mixing epoxy, tertiary amine, anhydride, hydroxy- and, optionally, acid functional compounds, a system of making the coating composition, a method of coating the composition on a substrate and a substrate coa... | 09/19/2006 |
| 7087799 | Amino group containing phenol derivative An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present ... | 08/08/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7026512 | Tertiary alkanolamines containing surface active alkyl groups The present invention relates to novel tertiary alkanolamines useful as catalysts for preparing polyurethane foams and as additives to reduce the dynamic surface tension of aqueous solutions. The tertiary alkanolamines may be represented by formula (I): ... | 04/11/2006 |
| 7019045 | Amino group containing phenol An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present ... | 03/28/2006 |
| 7001938 | Epoxy resin curing compositions and resin compositions including same Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agent... | 02/21/2006 |
| 6977274 | Epoxy resin curing system containing latent catalytic curing agent causing the expansion of volume The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction... | 12/20/2005 |
| 6962964 | Hydrogenation of methylenedianiline homologs and epoxy resins cured with same This invention relates to improved polyepoxide resins cured with a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines and a process for preparing such polyepoxide resins as well as to the methylene bridged poly(cycloaliphatic-aromatic)amine composition... | 11/08/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6946503 | Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins. ... | 09/20/2005 |
| 6924438 | Epoxy sight bowls for use in power transformers A cured filler-less epoxy compound formed as a rigid, three-dimensional, transparent structure, including a cylindrical sight bowl of a utility or industrial high voltage bushing. A process for making a three-dimensional (e.g., cylindrical), transparent structure wi... | 08/02/2005 |
| 6822341 | Latent catalysts for molding compounds A latent catalyst particularly useful in epoxy molding compositions for use in electronic packaging materials is provided. The latent catalyst is in the form of a curative represented by a combination of an inorganic-based carrier having an activated surface and a c... | 11/23/2004 |
| 6800157 | Bonding members with epoxy composition containing chain extender, toughener and catalyst A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a therm... | 10/05/2004 |
| 6773754 | Accelerated curing of epoxy gelcoats Aqueous solutions of inorganic nitrate salts are used to accelerate the gelling of epoxy gelcoat resins without adversely affecting the glass transition temperature of the finally cured gelcoat. The aqueous accelerants may be used to accelerate gelling of gelcoats t... | 08/10/2004 |
| 6756469 | Polysilazane-modified polyamine hardeners for epoxy resins Novel polysilazane-modified polyamine hardeners for epoxy resins, such classes as glycidyl ether epoxy resins and novolac epoxy resins, including reaction mixtures, compositions and reaction products comprising such hardeners, impart enhanced high temperature proper... | 06/29/2004 |
| 6740359 | Ambient cure fast dry solvent borne coating compositions The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin having at least one acetoacet... | 05/25/2004 |
| 6677426 | Modified epoxy resin composition, production process for the same and solvent-free coating comprising the same There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acet... | 01/13/2004 |
| 6670017 | Photocurable form-in-place gasket for electronic applications Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in... | 12/30/2003 |
| 6649673 | Single component room temperature curable low VOC epoxy coatings A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single compon... | 11/18/2003 |
| 6649729 | Novolaks as water-unaffected accelerators for epoxy resin hardeners Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wh... | 11/18/2003 |
| 6624213 | High temperature epoxy adhesive films The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.... | 09/23/2003 |
| 6620862 | Sheet resin composition and process for manufacturing semiconductor device therewith A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a sub... | 09/16/2003 |
| 6613839 | Polyepoxide, catalyst/cure inhibitor complex and anhydride An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value "n" of greater than zero and less than 2.5, or an organic acid havin... | 09/02/2003 |
| 6608161 | Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a catalyst selected from one or more carboxylic acid(s) or one or m... | 08/19/2003 |
| 6605355 | Epoxy resin composition An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a ... | 08/12/2003 |
| 6592994 | Thermosetting epoxy powder coatings having improved degassing properties A clear coat dicyandiamide cured epoxy powder coating for non-metallic substrates wherein the finish coat is visually haze-free as a result of the addition of a small amount of an aromatic substituted urea compound. Non-metallic substrates, such as brass,... | 07/15/2003 |
| 6565935 | Polymer concrete structures A structure comprising a filled thermosetting polymer composition. The filled thermosetting polymer composition has a mineral filler content of at least 92% by weight and not more than 8% by weight of thermosetting polymer and a co-efficient of thermal ex... | 05/20/2003 |
| 6555628 | Epoxy resins and process for making the same A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by reacting an epoxy resin with a dihydric phenol, an acid anh... | 04/29/2003 |
| 6548575 | High temperature underfilling material with low exotherm during use A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may ... | 04/15/2003 |
| 6548627 | Flame-retardant phosphorus-modified epoxy resins The present invention relates to novel flame-retardant phosphorus-containing epoxy resins with an epoxy value of from 0.05 to 1.0 moll 100 g containing structural units which derive from (A) polyepoxy compounds having at least two epoxy groups per molecule, an... | 04/15/2003 |
| 6538052 | Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators The invention relates to curable compositions comprising a) an epoxy resin, b) an aminic curing agent and c) a curing accelerator, which comprise as curing accelerator c) at least one or more than one compound selected from c1) a compound of formula (I) #... | 03/25/2003 |
| 6489405 | Epoxy resin formulation containing epoxy group-terminated polyesters A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester... | 12/03/2002 |
| 6486256 | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.... | 11/26/2002 |
