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| Number | Title | Issue Date |
| 7288289 | Method and apparatus for manufacturing sheet flooring by simultaneous multi-layer die coating Surface coverings and surface covering components and methods for forming them using slot die coating are disclosed. The methods involve applying a plurality of wet layers to a substrate simultaneously or in sequence using a slot die coater, wherein a plurality of w... | 10/30/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains th... | 09/11/2007 |
| 7204950 | Dispensing package A seamless collapsible container has a molded finish, configured and adapted for sealing with a closure and, optionally, for attachment to a dispensing apparatus, and a seamless, blow molded body portion, comprising an inner surface, an outer surface, and a wall, wh... | 04/17/2007 |
| 7074738 | Curing accelerator, epoxy resin composition, and semiconductor device A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 07/11/2006 |
| 7060786 | Heat resistant resin composition and adhesive film A resin composition comprising the associated product of a polyimide resin having phenolic hydroxyl groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin having at least two glycidyl groups, and an epoxy resin-curing agent has a high bond streng... | 06/13/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7025825 | Plastic fibers for improved concrete A concrete article comprised of concrete having therein a reinforcing fiber, where at least about 50 percent of the reinforcing fibers are frayed only at an end or ends of the reinforcing fibers, may be made by mixing concrete, water and a reinforcing fiber for a su... | 04/11/2006 |
| 6962780 | Method for synthesis of nucleic acids The present invention is a method for synthesis of nucleic acids to amplify an intended nucleic acid in a region in which a GC content is rich, wherein a polyhydric alcohol and/or ammonium sulfate is present in an amplification reaction solution. According to the pr... | 11/08/2005 |
| 6956086 | Water dispersible epoxy resins A amidoamine composition containing oligomeric amidoamine compounds having the structure: the average of x based on the amidoamine composition is at least 0.2, and Z is the residue of a polyoxyalkylene polyether polyca... | 10/18/2005 |
| 6946421 | Latent catalyst This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to th... | 09/20/2005 |
| 6939431 | Paste for circuit connection, anisotropic conductive paste and uses thereof Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and... | 09/06/2005 |
| 6887919 | Pressure sensitive adhesive and its preparation A pressure sensitive adhesive composed of a mixture comprising a) a styrene block copolymer having a star-shaped structure and a molecular weight Mw of more than 300,000 g/mol, or having elastomer blocks which contain more than 30% by weight ... | 05/03/2005 |
| 6881812 | Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to th... | 04/19/2005 |
| 6830825 | Epoxy resin composition and semiconductor device An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for mo... | 12/14/2004 |
| 6828407 | Polymer electrolyte composition and uses thereof The present invention provides a polymer electrolyte composition excellent in radical resistance and/or proton conductivity. The polymer electrolyte composition comprises an aromatic polymer phosphonic acid derivative represented by the following formula (1); and at... | 12/07/2004 |
| 6803004 | High throughput process for reactive extrusion of epoxy resin The present invention provides low cost resins (e.g., advanced epoxy resins), processes for making these resins, and coatings made with theses resins. Specifically, the present invention provides high throughput extrusion processing of advanced epoxy resins using an... | 10/12/2004 |
| 6800717 | Acid catalyzed copolymerization of water and epoxy resin and uses thereof Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphen... | 10/05/2004 |
| 6765043 | Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes ... | 07/20/2004 |
| 6762251 | Thermoplastic polyhydroxypolyether resin and an insulation film produced therefrom The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, | 07/13/2004 |
| 6753086 | Thermosetting resin composition, epoxy resin molding material and semiconductor device An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any ... | 06/22/2004 |
| 6670017 | Photocurable form-in-place gasket for electronic applications Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in... | 12/30/2003 |
| 6649728 | Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition A catalyst for curing epoxy resins comprises a tetraalkylphosphonium tetrafluoroborate represented by Formula (1): ##STR1## wherein R1, R2, R3, and R4 are each C1-C5 linear or branched alkyl and may be the same ... | 11/18/2003 |
| 6645631 | Flame retardant phosphorus element-containing epoxy resin compositions A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of... | 11/11/2003 |
| 6620862 | Sheet resin composition and process for manufacturing semiconductor device therewith A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a sub... | 09/16/2003 |
| 6613839 | Polyepoxide, catalyst/cure inhibitor complex and anhydride An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value "n" of greater than zero and less than 2.5, or an organic acid havin... | 09/02/2003 |
| 6599960 | Storage-stable cationcally polymerized preparations with improved hardening characteristics The invention relates to preparations with improved curing behavior, which are characterized in that they contain 0.0005 to 50 wt. % of soluble and/or fine-particle organic and/or inorganic alkaline earth and/or alkali metal compounds. The preparations ac... | 07/29/2003 |
| 6562410 | Heat curable epoxy compositions Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1... | 05/13/2003 |
| 6558812 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1... | 05/06/2003 |
| 6555628 | Epoxy resins and process for making the same A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by reacting an epoxy resin with a dihydric phenol, an acid anh... | 04/29/2003 |
| 6551714 | Flame-retardant resin composition, and prepregs and laminates using such composition The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame... | 04/22/2003 |
| 6548620 | Epoxy resin composition and process for producing the same The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epox... | 04/15/2003 |
| 6548627 | Flame-retardant phosphorus-modified epoxy resins The present invention relates to novel flame-retardant phosphorus-containing epoxy resins with an epoxy value of from 0.05 to 1.0 moll 100 g containing structural units which derive from (A) polyepoxy compounds having at least two epoxy groups per molecule, an... | 04/15/2003 |
| 6531549 | Crystallized epoxy resins, their production method, and curable compositions comprising them A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130... | 03/11/2003 |
| 6524989 | Tetraorganophosponium dicyclic tetraorganoborate catalyst This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are b... | 02/25/2003 |
| 6512074 | Polymerization catalysts of oxirane compounds and process for preparing polymers of oxirane compounds using the catalysts Polymerization catalysts of oxirane compounds are catalysts which are suitable to carry out suspension precipitation polymerization of the oxirane compounds in an organic solvent which cannot dissolve the polymers and comprise a reaction product of (A) an... | 01/28/2003 |
| 6492483 | Integrated continuous process for upstaging epoxy resins The present invention discloses a continuous process and the associated system for upstaging liquid epoxy resins to produce resins with higher molecular weight. The process comprises passing continuously (i) a liquid epoxy resin having a first molecular w... | 12/10/2002 |
| 6462164 | 2-phenylimidazole-phosphoric acid salt as an accelerator for acid anhydride curatives in one-component epoxy compositions A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for the acid anhydride curing agent characterized in that 2-phen... | 10/08/2002 |
| 6441064 | Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, dicyandiamide latent heat activated curing agent and an accelerator for the dicyandiamide curing agent characterized in that an imida... | 08/27/2002 |
| 6420460 | Cationically curable compositions containing triarylcyclopropenylium salts The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. T... | 07/16/2002 |
