Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8084567 | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced o... | 12/27/2011 |
| 7985822 | Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy grou... | 07/26/2011 |
| 7608676 | Coatings comprising the reaction product of a terpene, an acrylic monomer and a phenolic compound Coatings comprising the reaction product of a terpene, an acrylic monomer and a phenolic compound containing at least one unsubstituted carbon atom ortho or para to a phenolic group and/or the reaction product of a phenolic compound containing at least one unsubstit... | 10/27/2009 |
| 7394965 | Photosensitive resin composition for optical waveguide formation and optical waveguide A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portion 5 of an optical waveguide 1, and the like. In... | 07/01/2008 |
| 7390540 | Method for preparation of anisotropic materials Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manuf... | 06/24/2008 |
| 7365147 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a ... | 04/29/2008 |
| 7341783 | Functionalized polyphenylene ether An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an avera... | 03/11/2008 |
| 7332557 | Epoxy resin, epoxy resin composition thereof and cured product thereof An epoxy resin represented by general formula (2), wherein R1-R4 indicate a hydrocarbon group of carbon number 1-6, n is 0 or integer of 1 or more and X is a bond or the following general fo... | 02/19/2008 |
| 7279546 | Hydroxy-functional polyesters The present invention provides thermoplastic hydroxy-functional polyesters. The polyesters have at least 10 sequential units, wherein the sequential units consist of units selected from units represented by the following formula (1) and units represented by the foll... | 10/09/2007 |
| 7261843 | Photochromic optical article Describes a photochromic article, e.g., an ophthalmic photochromic plastic article, such as a lens, in which the article includes (1) a rigid substrate, e.g., a transparent substrate such as a glass or organic polymeric substrate, as for example, a thermoset or ther... | 08/28/2007 |
| 7208551 | Polyaryleneetherketone phosphine oxide compositions incorporating cycloaliphatic units for use as polymeric binders in thermal control coatings and method for synthesizing same Polyaryleneetherketone triphenylphosphine oxide compositions incorporating cycloaliphatic units are provided which may be used as a polymeric binders in thermal control coatings for use in space environments. A method is also provided for synthesizing the polyarylen... | 04/24/2007 |
| 7204950 | Dispensing package A seamless collapsible container has a molded finish, configured and adapted for sealing with a closure and, optionally, for attachment to a dispensing apparatus, and a seamless, blow molded body portion, comprising an inner surface, an outer surface, and a wall, wh... | 04/17/2007 |
| 7160962 | Elastomer-modified epoxy siloxane compositions Elastomer-modified Epoxy-polysiloxane compositions of this invention are prepared by combining a silicone intermediate, with an epoxy resin, an elastomeric resinous intermediate, a polyfunctional amine, an optional organometallic catalyst, and optional fillers, pigm... | 01/09/2007 |
| 7087702 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a ... | 08/08/2006 |
| 7060779 | Processes for producing hydrocarbon/phenol resin and producing epoxy resin A process for efficiently producing hydrocarbon/phenol resin having a satisfactory hue through reaction of phenol with an unsaturated cyclic hydrocarbon having two or more carbon—carbon double bonds in the presence of an acid catalyst, which comprises (1) a step i... | 06/13/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7049388 | Process for manufacturing an α-dihydroxy derivative and epoxy resins prepared therefrom A process for manufacturing an α-dihydroxy derivative from an aryl allyl ether wherein such α-dihydroxy derivative can be used to prepare an α-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an α-halohydrin intermediate produc... | 05/23/2006 |
| 7045478 | Method of producing a catalyst for ethylene homo-and co-polymerization The present invention relates to a catalyst for homo-polymerization or co-polymerization of ethylene, or more particularly to a solid complex titanium catalyst for homo-polymerization or co-polymerization of ethylene. The catalyst may be produced by preparing a magn... | 05/16/2006 |
| 7025825 | Plastic fibers for improved concrete A concrete article comprised of concrete having therein a reinforcing fiber, where at least about 50 percent of the reinforcing fibers are frayed only at an end or ends of the reinforcing fibers, may be made by mixing concrete, water and a reinforcing fiber for a su... | 04/11/2006 |
| 7022779 | One-pack moisture-curing epoxy resin composition A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition include... | 04/04/2006 |
| 6998011 | Epoxy adhesive having improved impact resistance In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both ... | 02/14/2006 |
| 6962744 | Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —... | 11/08/2005 |
| 6933332 | Powdered epoxy composition A cured epoxy coating comprising from about 30% to about 40% of at least one epoxy resin selected from the group consisting of diglycidyl ethers of bisphenol A, from about 55% to about 60% of a particulate flame retardant, from about 1% to about 4% of at least one m... | 08/23/2005 |
| 6903180 | Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and c... | 06/07/2005 |
| 6894091 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler conta... | 05/17/2005 |
| 6878448 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali alkaline earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 ho... | 04/12/2005 |
| 6852263 | Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight;... | 02/08/2005 |
| 6838176 | Epoxy resin composition and prepreg made with the epoxy resin composition Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compos... | 01/04/2005 |
| 6835786 | (Meth)acrylate compound and cured product thereof There are provided a polyfunctional (meth)acrylate compound which has the excellent properties of polyphenylene ether and is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a polyfunctional (meth)acrylate group in... | 12/28/2004 |
| 6818369 | Toner for electrostatic image development and image forming method and apparatus using the toner A toner for electrostatic image development in which the weight concentration of polar-solvent-soluble material is 1000 μg/g or less, based on the toner, and an image forming method comprising a step of forming a toner image by developing a latent electrostatic ima... | 11/16/2004 |
| 6794481 | Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH (... | 09/21/2004 |
| 6790901 | Fiber-treating agent, glass fiber and rubber product both made with the fiber treating agent A glass fiber containing a fiber processing agent for increasing the surface strength of a rubber product, such as a rubber belt or a tire, and a rubber product containing the glass fiber. The fiber processing agent is comprised of a dispersion solution having a 2-c... | 09/14/2004 |
| 6740706 | Method for obtaining coating compositions having reduced VOC The invention relates to an economical method of making a polymer having reduced VOCs and coating compositions containing such polymers. In one embodiment, the method of invention requires providing a reactant mixture (a), providing a solvent mixture (b) comprising ... | 05/25/2004 |
| 6733880 | Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to... | 05/11/2004 |
| 6720077 | Resin composition, and use and method for preparing the same The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has... | 04/13/2004 |
| 6670445 | Curable compounds, curable resin compositions containing the same and methods of easily disassembling cured materials Disclosed are a curable resin composition, which is liquid and therefore has good workability before curing and which can be softened or liquefied at a temperature lower than the thermal decomposition temperature in a short time after curing and a curable... | 12/30/2003 |
| 6670042 | Insulating film Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): ##STR1## and (B) 0.1 to 60 parts by weight of a... | 12/30/2003 |
| 6670006 | Epoxy resin composition for FRP, prepreg, and tubular molding produced therefrom The present invention relates to an epoxy resin composition for FRP that will be used for fishing rods, golf club shafts, and the like, a prepreg that is an intermediate material made up of an epoxy resin composition combined with reinforcing fibers, and ... | 12/30/2003 |
| 6621170 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of f... | 09/16/2003 |
| 6620862 | Sheet resin composition and process for manufacturing semiconductor device therewith A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a sub... | 09/16/2003 |
