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| Number | Title | Issue Date |
| 7361727 | Copolymerization of 1,4-dioxan-2-one and a cyclic ester monomer producing thermal stabilized 1,4-dioxan-2-one (co)polymers A polymerization process to derive a thermal-stabilized poly(1,4-dioxan-2-one) and cyclic ester monomer copolymer using a coordination-insertion catalyst/initiator. 1,4-dioxan-2-one and cyclic ester monomer, each containing less than 100-ppm water and having an acid... | 04/22/2008 |
| 7186454 | Dielectric films and materials therefor A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hy... | 03/06/2007 |
| 7169878 | Diamines, polyimide precursors and polyimides produced by using the diamines, and liquid crystal aligning agents A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl... | 01/30/2007 |
| 7129318 | RTM and RI processable polyimide resins Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than abou... | 10/31/2006 |
| 7105211 | Liquid crystal aligning agent, liquid crystal aligning films, and liquid crystal display devices A liquid crystal alignment treating agent for optical alignment treatment, whereby it is possible to obtain a liquid crystal alignment film which presents a high and stable tilt angle of liquid crystal and which is excellent in an accumulated charge property by a DC... | 09/12/2006 |
| 7090900 | Liquid crystal aligning agent for vertical alignment, alignment layer for liquid crystal, and liquid crystal displays made by using the same A liquid crystal alignment treating agent containing a polyamic acid which is represented by the following formula (I) and exhibits a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methyl-2-pyrrolidone at 30° C. at a concentration of 0.5 g/dl) or a polyimide obta... | 08/15/2006 |
| 7090925 | Dielectric films and materials therefor A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y1, Y2, Y3 | 08/15/2006 |
| 7078477 | Process for producing solvent-soluble polyimide In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine. The tetracarboxylic acid component is... | 07/18/2006 |
| 7074880 | Polyimide aerogels, carbon aerogels, and metal carbide aerogels and methods of making same A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a ri... | 07/11/2006 |
| 7074882 | Polyimide resin for electrical insulating material The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represent... | 07/11/2006 |
| 7071282 | Benzimidazole diamine-based polyetherimide compositions and methods for making them Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected fro... | 07/04/2006 |
| 7053168 | Method for preparing polyimide and polyimide prepared thereby A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The ... | 05/30/2006 |
| 7041773 | Polyimide sulfones, method and articles made therefrom Polyimide sulfone resins are provided with a glass transition temperature of from 200–350° C., residual volatile species concentration of less than 500 ppm and a total reactive end group concentration of less than about 120 milliequivalents/kilogram resin. The re... | 05/09/2006 |
| 7041778 | Processable thermally stable addition polyimide for composite applications A novel polyimide resin consisting essentially of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 3,4,3′,4′-biphenyltetracarboxylic dianhydride (BPDA), 2,2 bis (3′,4′-dicarboxy phenyl) hexafluoro propane dianhydride (6FDA), 2-(3,4-dicarboxyphen... | 05/09/2006 |
| 7026436 | Low temperature polyimide adhesive compositions and methods relating thereto The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an... | 04/11/2006 |
| 7022809 | Polyimides for anchoring liquid crystals, display devices including same and method for the preparation of said devices The present invention relates to novel polyimides derived from 6FDA and from 3,3-dihydroxy-4,4′-diaminobiphenyl and novel polyimides derived from PMDA and from Bis-AP-AF, having alkyl, arylalkyl, heteroarylalkyl, (cycloalkyl)alkyl, fluoroalkyl or siloxane side gro... | 04/04/2006 |
| 7019103 | Polyamic acid oligomer, polyimide oligomer, solution composition, and fiber-reinforced composite material A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obt... | 03/28/2006 |
| 7015304 | Solvent free low-melt viscosity imide oligomers and thermosetting polyimide composites This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3′,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromat... | 03/21/2006 |
| 7001446 | Dense, layered membranes for hydrogen separation This invention provides hydrogen-permeable membranes for separation of hydrogen from hydrogen-containing gases. The membranes are multi-layer having a central hydrogen-permeable layer with one or more catalyst layers, barrier layers, and/or protective layers. The in... | 02/21/2006 |
| 6998464 | Method for producing a solution consisting of a polymer containing recurrent azole units, solutions produced according to said method and use of the same The present invention relates to a method of preparing a solution of a polymer comprising recurring azole units, which comprises dissolving a sufficiently dried polymer comprising recurring azole units of the formula wh... | 02/14/2006 |
| 6984714 | Siloxane-modified polyimide resin This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide res... | 01/10/2006 |
| 6979721 | Substituted cyclohexene endcaps for polymers with thermal-oxidative stability This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparati... | 12/27/2005 |
| 6962756 | Transparent electrically-conductive film and its use A transparent electrically-conductive film comprising a substrate made of an aliphatic polyimide having a repeating unit of the formula [I] and a transparent electrically-conductive thin film layer, the transparent electrically-conductive thin film layer being provi... | 11/08/2005 |
| 6949618 | Polymer compound, precursor for the same and thin film-forming method using the same polymer precursor Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multi... | 09/27/2005 |
| 6949619 | Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comp... | 09/27/2005 |
| 6936663 | Powder coating compositions containing POSS compounds Disclosed is a powder coating composition containing a powder coating resin and a polyhedral oligomeric silsesquioxane (“POSS”) compound. ... | 08/30/2005 |
| 6927274 | Resin compositions, processes for preparing the resin compositions and processes for forming resin films Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but ... | 08/09/2005 |
| 6924348 | Polyamide acid and polyimide, and optical material A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as the raw material therefor are provided. Specifically, a polyamide acid... | 08/02/2005 |
| 6919229 | Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. T... | 07/19/2005 |
| 6919422 | Polyimide resin with reduced mold deposit A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficien... | 07/19/2005 |
| 6919418 | Approach to reduce cyclics formation in 3-CIPA based polyetherimide polymers Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties. ... | 07/19/2005 |
| 6916898 | Process for producing polyimide A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound i... | 07/12/2005 |
| 6911519 | Low viscosity melt processable high temperature polyimides A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenyleth... | 06/28/2005 |
| 6908685 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when ... | 06/21/2005 |
| 6891067 | Optical polyimide precursor, optical polyimide compound and fabricating method thereof The present invention provides an optical polyimide precursor for use in making a polyimide. The precursor is defined by the following formula: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl, and A is a di... | 05/10/2005 |
| 6890626 | Imide-benzoxazole polycondensate and process for producing the same A polyimide-based polycondensate which may be used as an insulation film by coating a copper foil with the polycondensate and by heating the coated copper foil, which insulation film does not warp the foil, as well as a production process thereof, is disclosed. The ... | 05/10/2005 |
| 6887967 | Thermosetting polyimide resin composition process for producing polyimide resin, and polyimide resin A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properti... | 05/03/2005 |
| 6881815 | Method for the preparation poly(etherimide)s A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated ... | 04/19/2005 |
| 6861497 | Polyimides having an unusually low and tunable electrical resistivity useful for electrical and optical applications A polyimide is disclosed of the formula: CG1 and CG2 are independently electron-accepting and/or electron-donating groups; x is an integer from about 3 to about 3000; ODAH is any of a number of... | 03/01/2005 |
| 6852826 | Manufacturing method of polyamic acid, and polyamic acid solution In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in whic... | 02/08/2005 |
