Quotables
"One of the greatest labor saving inventions of today is tomorrow!"
Vincent T. Floss
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7414097 | Curing epoxy resin with aliphatic diamine-styrene product and carboxyl- and hydroxyl-containing accelerator The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl ... | 08/19/2008 |
| 7396902 | Epoxy resin curing agent of aliphatic diamine/styrene addition product The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl ... | 07/08/2008 |
| 7378461 | Curable epoxy resin compositions and process for production thereof The invention relates to (1) a curable epoxy resin composition comprising (A) a non-gel type amine-modified epoxy resin which is obtained by reacting an epoxy resin with a polyamine and (B) at least one of boric acid and boric ester, (2) a powder form of the curable... | 05/27/2008 |
| 7307128 | Epoxy compound, preparation method thereof, and use thereof The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanica... | 12/11/2007 |
| 7304120 | Epoxy compound, preparation method thereof, and use thereof An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 eac... | 12/04/2007 |
| 7282553 | Flexible isopropylidene and tetramethyl-containing fluoropolyamide and fluoropolymide and preparation method thereof Polyamides and polyimides containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents and their synthetic method are disclosed. Polyamide containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents is synthesized by reacting... | 10/16/2007 |
| 7148294 | Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercapta... | 12/12/2006 |
| 6987161 | Epoxy hardeners for low temperature curing Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines... | 01/17/2006 |
| 6979829 | Devices and methods for determining the amount of energy absorbed during irradiation Devices and methods are disclosed for determining the amount of energy absorbed during irradiation. Such devices comprise a material that absorbs radiation in a quantifiable manner and a cooling agent to maintain the temperature of that material within a predetermin... | 12/27/2005 |
| 6962964 | Hydrogenation of methylenedianiline homologs and epoxy resins cured with same This invention relates to improved polyepoxide resins cured with a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines and a process for preparing such polyepoxide resins as well as to the methylene bridged poly(cycloaliphatic-aromatic)amine composition... | 11/08/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6908982 | Amino composition and process for producing the same An object of the present invention is to provide an amino composition which provides, when used as a curing agent for epoxy resin, a long pot life and an excellent appearance of a coating film to an epoxy resin composition without deteriorating the reactivity of the... | 06/21/2005 |
| 6818318 | Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination o... | 11/16/2004 |
| 6809130 | Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin togeth... | 10/26/2004 |
| 6770370 | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same An adhesive composition for semiconductor device, comprising 10 to 30% by weight of a reactive elastomer (A), 40 to 65% by weight of an epoxy resin (B) having two or more glycidyl ether groups, a phenol resin (C) and a curing accelerator (D), wherein a ratio of the ... | 08/03/2004 |
| 6727325 | Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in ... | 04/27/2004 |
| 6723763 | Cure accelerators for anaerobic adhesive compositions The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provid... | 04/20/2004 |
| 6723821 | Polyurea polymers prepared from polyamine epoxide adduct The invention features a polyamine epoxide adduct, prepared by admixing a source of epoxy group with a polyamine, and allowing the epoxy groups to react with the terminal amino groups of the polyamine so as to form the polyamine epoxy adduct. The polyamine epoxide a... | 04/20/2004 |
| 6670430 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the ... | 12/30/2003 |
| 6646064 | Reacting epoxy resin with p-containing dihydric phenol or naphthol A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a b... | 11/11/2003 |
| 6627684 | Dielectric compositions having two steps of laminating temperatures The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, c... | 09/30/2003 |
| 6617399 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combin... | 09/09/2003 |
| 6569983 | Method and composition for recovering hydrocarbon fluids from a subterranean reservoir A water-soluble branched polyhydroxyetheramine, wherein the branched polyhydroxyetheramine is prepared by reacting an amine having two reactive hydrogen atoms with a diepoxide to form a polyhydroxyetheramine and then reacting the polyhydroxyetheramine wit... | 05/27/2003 |
| 6538052 | Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators The invention relates to curable compositions comprising a) an epoxy resin, b) an aminic curing agent and c) a curing accelerator, which comprise as curing accelerator c) at least one or more than one compound selected from c1) a compound of formula (I) #... | 03/25/2003 |
| 6500912 | Epoxy resin system A curable epoxy composition comprises an epoxy resin having at least 1.5 epoxy groups per molecule and an amine-terminated polyamide. The liquid amine-terminated polyamide is prepared by reacting a long-chain, C20 -C60 dicarboxylic a... | 12/31/2002 |
| 6485834 | Flexible deployable preform A thermosetting composition with a glass transition temperature of at least 100° C. comprises at least one epoxy resin formed from at least one polyepoxide containing at least two epoxy groups in its molecule and at least one aromatic polyamine containin... | 11/26/2002 |
| 6476160 | One-pack composition of epoxy resin(s) with no oh groups and ketimine A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an... | 11/05/2002 |
| 6475621 | Water based primer compositions The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated tempera... | 11/05/2002 |
| 6465598 | Urethane resins Amine-terminated urethane oligomer compositions are described that include very high oligomer concentrations. The compositions are melts of the amine-terminated oligomers. The compositions can include one or more property modifiers. The compositions are u... | 10/15/2002 |
| 6455116 | Poly(hydroxy amino ether) composition, method for preparing the same and articles prepared therefrom A composition comprising a poly(hydroxy aminoether) and an effective amount of a propoxylated or ethoxylated phenol, process for preparing the same and articles prepared from the composition.... | 09/24/2002 |
| 6451931 | Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate A curing agent composition for an epoxy resin which comprises (B) a reaction product obtained from (a) an amine compound represented by formula (I): ##STR1## wherein R1 and R2 each represent an alkyl group having 1 to 8 carbon a... | 09/17/2002 |
| 6410127 | Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. Th... | 06/25/2002 |
| 6380344 | Cyanate ester composition and cured product thereof A cyanate ester-epoxy resin composition that can be cured to obtain a product which has excellent mechanical properties is provided. More particularly, a cyanate ester composition comprising (A) a cyanate ester in which the total content of impurities con... | 04/30/2002 |
| 6346573 | Amine-modified epoxy resin reacted in presence of latent hardener A method for the manufacture of a one-component epoxy resin system comprises mixing at 15-30° C. and reacting at room temperature over 2-14 days (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation t... | 02/12/2002 |
| 6329473 | Amine-modified epoxy resin composition Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as dise... | 12/11/2001 |
| 6309757 | Gas barrier coating of polyamine, polyepoxide and hydroxyaromatic compound Gas barrier coating compositions are provided which include a polyamine component, a polyepoxide component and a hydroxy-substituted aromatic compound that is present in an amount sufficient to provide a gas barrier coating having an oxygen permeability l... | 10/30/2001 |
| 6294597 | Curable polymeric composition and use in protecting a substrate A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloalip... | 09/25/2001 |
| 6291626 | Phosphorus-containing dihydric phenol or naphthol-advanced epoxy resin or cured Flame-retardant advanced epoxy resins and cured epoxy resins contain a rigid phosphorus group emanating from a dihydric phenol or naphthol which provides thermal and flame retardant properties. The advanced epoxy resins are suitable for making a fiber-rei... | 09/18/2001 |
| 6187443 | Thermosetting composition, uses thereof and a flexible deployable preform comprising the composition A thermosetting composition with a glass transition temperature of at least 100° C. comprises at least one epoxy resin formed from at least one polyepoxide containing at least two epoxy groups in its molecule and at least one aromatic polyamine containin... | 02/13/2001 |
| 6054221 | Curable epoxy resin compositions, on release liners with 9,9-bis4-aminophenyl) fluorenes as curatives Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with sur... | 04/25/2000 |
