Did You Know...
...that the Eveready Battery began as an invention called the "electric flowerpot," which was a tube with a battery and light bulb inside? The idea was to fasten this gizmo to the side of a flowerpot so it would illuminate the flowers from the bottom. The idea died on the vine and the businessman who licensed the flower pot, Conrad Huber, was left with a pile of useless tubes -- until he found a way to market them as batteries to light the world!
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| Number | Title | Issue Date |
| 7414097 | Curing epoxy resin with aliphatic diamine-styrene product and carboxyl- and hydroxyl-containing accelerator The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl ... | 08/19/2008 |
| 7396902 | Epoxy resin curing agent of aliphatic diamine/styrene addition product The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl ... | 07/08/2008 |
| 7378461 | Curable epoxy resin compositions and process for production thereof The invention relates to (1) a curable epoxy resin composition comprising (A) a non-gel type amine-modified epoxy resin which is obtained by reacting an epoxy resin with a polyamine and (B) at least one of boric acid and boric ester, (2) a powder form of the curable... | 05/27/2008 |
| 7364668 | Process for producing an amino composition The present invention provides a process for producing an amino composition by addition reaction between a polyamine and an unsaturated hydrocarbon compound in the presence of a strongly basic alkali metal catalyst to obtain an amino composition containing not more ... | 04/29/2008 |
| 7351784 | Chip-packaging composition of resin and cycloaliphatic amine hardener A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting o... | 04/01/2008 |
| 7320998 | Carbohydrate analog inhibitors of alpha-amylase The present invention provides carbohydrate analogs of the formula: wherein X is CH2, O, or NH, and R1-8 are independently H, a short hydrocarbon, a substituted amine, an alcohol, a substitu... | 01/22/2008 |
| 7307128 | Epoxy compound, preparation method thereof, and use thereof The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanica... | 12/11/2007 |
| 7304120 | Epoxy compound, preparation method thereof, and use thereof An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 eac... | 12/04/2007 |
| 7157606 | Process for producing an amino composition The process for producing an amino composition of the present invention by addition reaction of a polyamine with an alkenyl group-containing compound wherein said polyamine is reacted preliminarily with a strongly basic catalyst to produce a reaction mixture compris... | 01/02/2007 |
| 7109289 | Modified polyoxyalkylene polyamine A modified polyoxyalkylene polyamine obtained by addition reaction of a polyoxyalkylene polyamine and an alkenyl group-containing compound has a low viscosity and it provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide ... | 09/19/2006 |
| 7078475 | Synergistic amine chain-extenders in polyurea spray elastomers Disclosed are derivatives of isophorone diamine exhibiting a synergistic relationship with other commonly employed chain extenders offering enhanced efficacy with regard to slowing of the polyurea elastomer cure profile, and processes employing their use. According ... | 07/18/2006 |
| 7011940 | Quality control for cytochemical assays The invention describes quality control devices for assays that measure analytes in cells and tissue samples, and methods of use thereof. In particular, the quality control device comprises a matrix affixed with synthetic controls in different concentrations, or dif... | 03/14/2006 |
| 6962964 | Hydrogenation of methylenedianiline homologs and epoxy resins cured with same This invention relates to improved polyepoxide resins cured with a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines and a process for preparing such polyepoxide resins as well as to the methylene bridged poly(cycloaliphatic-aromatic)amine composition... | 11/08/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6908982 | Amino composition and process for producing the same An object of the present invention is to provide an amino composition which provides, when used as a curing agent for epoxy resin, a long pot life and an excellent appearance of a coating film to an epoxy resin composition without deteriorating the reactivity of the... | 06/21/2005 |
| 6838176 | Epoxy resin composition and prepreg made with the epoxy resin composition Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compos... | 01/04/2005 |
| 6818318 | Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination o... | 11/16/2004 |
| 6727325 | Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in ... | 04/27/2004 |
| 6670430 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the ... | 12/30/2003 |
| 6660386 | Flame activated primer for polyolefinic coatings A primer for flame sprayed polyolefin comprises an epoxy resin, preferably of low molecular weight and/or low viscosity; and an amine hardener, part of which becomes highly reactive on exposure to open flame, providing near instant cure of the composition... | 12/09/2003 |
| 6617399 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combin... | 09/09/2003 |
| 6583528 | High performance composite flywheel A flywheel system for storing and delivering on demand electrical energy includes a flywheel supported for high speed rotation on bearings in a vacuum enclosure, and a motor-generator for spinning the flywheel up to speed and then for converting the rotat... | 06/24/2003 |
| 6576297 | Curable resin compositions A coating, sealant or adhesive composition curable at ambient temperatures of 40° C. or below comprises an epoxy resin and an amine-functional curing agent. The curing agent comprises a material containing at least two, and preferably at least three, het... | 06/10/2003 |
| 6562934 | Amino compound and process for producing the same An amino compound obtained by addition reaction of diamine represented by the following formula (1) and an alkenyl compound and a process for producing the same. H2 N--H2 C--A--CH2 --NH2 (1) wherein A is a phenylene... | 05/13/2003 |
| 6548576 | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders compr... | 04/15/2003 |
| 6476160 | One-pack composition of epoxy resin(s) with no oh groups and ketimine A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an... | 11/05/2002 |
| 6465598 | Urethane resins Amine-terminated urethane oligomer compositions are described that include very high oligomer concentrations. The compositions are melts of the amine-terminated oligomers. The compositions can include one or more property modifiers. The compositions are u... | 10/15/2002 |
| 6451931 | Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate A curing agent composition for an epoxy resin which comprises (B) a reaction product obtained from (a) an amine compound represented by formula (I): ##STR1## wherein R1 and R2 each represent an alkyl group having 1 to 8 carbon a... | 09/17/2002 |
| 6410127 | Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. Th... | 06/25/2002 |
| 6399742 | Low viscosity imine reactive diluents and coating compositions made therefrom This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.... | 06/04/2002 |
| 6365708 | Polyamines and coating compositions with enhanced resistance to yellowing This invention relates to novel polyamines which are the reaction product of A) at least one nonaromatic diamine containing from 2 to 40 carbon atoms, wherein the amine groups are primary amine groups; and B) at least one epihalohydrin of the formula ##ST... | 04/02/2002 |
| 6346573 | Amine-modified epoxy resin reacted in presence of latent hardener A method for the manufacture of a one-component epoxy resin system comprises mixing at 15-30° C. and reacting at room temperature over 2-14 days (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation t... | 02/12/2002 |
| 6329473 | Amine-modified epoxy resin composition Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as dise... | 12/11/2001 |
| 6294597 | Curable polymeric composition and use in protecting a substrate A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloalip... | 09/25/2001 |
| 5940570 | Composition for encapsulating signal transmission devices A method for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks with a room-temperature curable composition comprising: (1) a hydroxy-functional compound having a molecular weight of greater than 500 and ... | 08/17/1999 |
| 5789520 | Curing agent for resins and resin composition containing the same A curing agent having less odor and providing a cured resin which is excellent in appearance, mechanical properties, water resistance and chemical resistance, and a one-component type humidity-curing resin composition having excellent storage stability an... | 08/04/1998 |
| 5698631 | Epoxy resin compositions for encapsulating signal transmission devices A room-temperature curable composition useful for encapsulating transmission signal devices, comprising: (1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more; (2) an epoxy-functional compound ... | 12/16/1997 |
| 5681907 | Fast cure amines for ambient and subambient cure of epoxy resins comprising methylamine adducts A curable epoxy resin composition comprising a polyepoxide resin and an amine curative characterized in that the amine curative comprises the reaction product of excess monomethylamine (MMA) and a polyglycidyl ether. When a diglycidyl ether is used in the... | 10/28/1997 |
| 5656862 | Solder interconnection structure Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a pre... | 08/12/1997 |
| 5631332 | Curing agents for epoxy resins comprising bis(aminomethyl)bicyclo[2.2.1]heptane adducts A curing agent for epoxy resins, prepared by reacting 2,5- and 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptanes (1 equivalent of the active hydrogen in the amino group) with an epoxy resin (a reaction product of bisphenols or a novolak resin with epichlorohydr... | 05/20/1997 |
