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| Number | Title | Issue Date |
| 7312260 | Epoxide adducts and their salts as dispersants The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one pr... | 12/25/2007 |
| 7300604 | Tetrahydroxybenzene tetraester derivative and polymer thereof The invention includes compounds represented by Formula (1): wherein R1 is an alkyl having 1 to 20 carbon atoms; A1 and A2 are a 1,4-cyclohexylene or 1,4-phenylene; X is a single ... | 11/27/2007 |
| 7220616 | Methods for epoxy loc die attachment A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead fr... | 05/22/2007 |
| 7189770 | Curing component and curable resin composition containing the curing component An amine curing component which can be used with various types of prepolymers including a urethane prepolymer having a reactive functional group of highly reactivity is provided. Also provided is a curable resin composition containing such curing component. This cur... | 03/13/2007 |
| 7169859 | Weatherable, thermostable polymers having improved flow composition A copolymer composition comprises an arylate polyester unit, an aromatic carbonate unit, and a soft-block moiety, wherein individual occurrences of the soft block moiety are linked by a spacer unit comprising one or more of the arylate polyester units, one or more o... | 01/30/2007 |
| 7157283 | Continuous process for the production of combinatorial libraries of modified materials A system is provided wherein a devolatilizing reactor is used to make combinatorial libraries of materials. Examples of suitable reactors include continuous high viscosity devolatilizers and continuous devolatilizing kneaders. ... | 01/02/2007 |
| 7157549 | Polymerization of oxiranes with a lithium-containing initiator A method is provided for polymerizing oxiranes by employing a lithium-containing polymerization initiator in a liquid reaction medium devoid of polymerization additives. Linear and star polymers can be produced by practicing the subject method. ... | 01/02/2007 |
| 7157143 | Two-component epoxy adhesive formulation for high elongation with low modulus Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, ... | 01/02/2007 |
| 7141684 | Diepoxide derivatives of diallyl phenolics The present invention relates to the preparation of ethers and esters of diallylphenols and the epoxidation of the diallyl moiety to provide bis-epoxide ether and ester intermediates useful in the preparation of epoxy resins. ... | 11/28/2006 |
| 7087663 | Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation Adducts ABC of epoxy resins A and reaction products BC of epoxy resins B with phosphorus-derived acids C, and mixtures of such adducts, containing a mass fraction of not more than 5% of unreacted acid C, the reaction products BC containing at least one acidic phosph... | 08/08/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7037399 | Underfill encapsulant for wafer packaging and method for its application A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, fluxing agent... | 05/02/2006 |
| 7001938 | Epoxy resin curing compositions and resin compositions including same Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agent... | 02/21/2006 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6812318 | Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the same The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained... | 11/02/2004 |
| 6790532 | Coating composition, based on organically modified inorganic condensates A coating composition comprises a polycondensate obtained by reacting a prehydrolysate based on at least on epoxide-containing hydrolysable silane; at least one amine component selected from a prehydrolysate based on at least one amino-containing hydrolysable silane... | 09/14/2004 |
| 6734260 | Cationic coating composition The present invention provides a cationic coating composition capable of forming a coating film which is excellent in an electrodepositablly coating property and an adhesive property toward a rust preventive steel plate, a corrosion resistance and a low temperature ... | 05/11/2004 |
| 6673877 | Product A'ABC of epoxy resins A' and product of polyepoxides A, fatty acids B and amines C Binders for aqueous corrosion protection systems, comprising products A'ABC of reaction of epoxy resins, fatty acids, and amines, having a number average molar mass Mn of at least 5000 g/mol, obtained by reacting epoxide compounds A' containing... | 01/06/2004 |
| 6663930 | Chemical resistant adhesive composition Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used... | 12/16/2003 |
| 6653370 | Aqueous binders based on epoxy resins Water-dilutable, cationically stabilized epoxy resins ZYX are obtained by reacting, in the first stage, aromatic or aliphatic epoxide compounds Z with aliphatic amines Y to form epoxy-amine adducts ZY which are neutralized and then in aqueous dispersion a... | 11/25/2003 |
| 6627683 | Reworkable thermosetting resin compositions and compounds useful therein Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided ... | 09/30/2003 |
| 6624213 | High temperature epoxy adhesive films The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.... | 09/23/2003 |
| 6605355 | Epoxy resin composition An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a ... | 08/12/2003 |
| 6548576 | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders compr... | 04/15/2003 |
| 6548575 | High temperature underfilling material with low exotherm during use A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may ... | 04/15/2003 |
| 6512075 | High Tg brominated epoxy resin for glass fiber laminate A new brominated epoxy resin has been developed, which consists of following components: A. multifunctional phenol-benzaldehyde epoxy resin (formula 1) 10~70 weight %; B. difunctional epoxy resin 0~55 weight %; C. bromine-containing difunctional epoxy resin 0~... | 01/28/2003 |
| 6506868 | Partial condensate of glycidyl ether group-containing alkoxysilane, silane-modified resin, compositions thereof and preparation methods thereof The present invention provides a partial condensate of glycidyl ether group-containing alkoxysilane which is obtainable by dealcoholization reaction between glycidol and a partial condensate of alkoxysilane, compositions comprising the same and preparatio... | 01/14/2003 |
| 6492483 | Integrated continuous process for upstaging epoxy resins The present invention discloses a continuous process and the associated system for upstaging liquid epoxy resins to produce resins with higher molecular weight. The process comprises passing continuously (i) a liquid epoxy resin having a first molecular w... | 12/10/2002 |
| 6489405 | Epoxy resin formulation containing epoxy group-terminated polyesters A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester... | 12/03/2002 |
| 6475621 | Water based primer compositions The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated tempera... | 11/05/2002 |
| 6462108 | High Tg potting compound A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two ... | 10/08/2002 |
| 6441121 | Epoxy compounds containing styrenic or cinnamyl functionality A curable composition comprises a compound having at least one epoxy group and at least one styrenic or cinnamyl group per molecule.... | 08/27/2002 |
| 6365708 | Polyamines and coating compositions with enhanced resistance to yellowing This invention relates to novel polyamines which are the reaction product of A) at least one nonaromatic diamine containing from 2 to 40 carbon atoms, wherein the amine groups are primary amine groups; and B) at least one epihalohydrin of the formula ##ST... | 04/02/2002 |
| 6359062 | Coating compositions Coating composition including a film-forming component, further including (a) a product formed by reacting a mixture including carboxy functional polymer, hydroxy functional polymer, or a mixture thereof, or ethylenically unsaturated monomer, with epoxy r... | 03/19/2002 |
| 6358877 | Metal catalysts complexed with sulfone or sulfoxide compounds Metal cyanide catalysts are complexed with organic sulfone or sulfoxide compounds. The catalysts are active alkylene oxide polymerization catalysts that tend to have short induction periods and moderate exotherms.... | 03/19/2002 |
| 6329473 | Amine-modified epoxy resin composition Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as dise... | 12/11/2001 |
| 6291077 | Lactone chain-extended phenolic polyester polyols A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise th... | 09/18/2001 |
| 6255365 | Epoxy resin composition for semiconductor encapsulation An epoxy resin composition comprising (a) an epoxy resin comprising a mixture of the following components: (1) about 50-95 parts by weight of a novolak type epoxy resin, and (2) about 5-50 parts by weight of 4,4'-biphenol type epoxy resin (b) a phenolic resin represente... | 07/03/2001 |
| 6201070 | Method for enhancing the toughness of cycloaliphatic epoxide-based coatings Methods are disclosed for enhancing the toughness, e.g., resistance to cracking upon flexation, of coatings made from cycloaliphatic epoxide derivatives wherein the cycloaliphatic epoxide derivative is a cycloaliphatic epoxide ester of a hydroxy-functiona... | 03/13/2001 |
| 6166151 | Lactone chain-extended phenolic polyester polyols A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise th... | 12/26/2000 |
