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Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
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| Number | Title | Issue Date |
| 7410694 | Adhesive The invention relates to an adhesive. Provision is made for the adhesive to comprise (a) 50 to 95% by weight of a heat-activable or pressure-sensitively adhesive polymer formed from a comonomer mixture comprising, based on the polymer, ... | 08/12/2008 |
| 7235293 | Recyclable carpet comprising hot melt adhesive composition A hot melt adhesive is provided that is useful in the production of textiles, such as a tuft carpet, contains a blend of constituents that allows synthetic carpet members to be fully recycled without first separating the adhesive from the carpet members. The adhesiv... | 06/26/2007 |
| 7208541 | Hot melt adhesive A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required. ... | 04/24/2007 |
| 7199204 | Hot melt adhesive composition A hot melt adhesive comprising an adhesive polymer and a modified rosin-terpene, preferably a phenol modified rosin terpene. The adhesive is particularly useful in packaging applications. ... | 04/03/2007 |
| 7189793 | Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a... | 03/13/2007 |
| 6939936 | Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a... | 09/06/2005 |
| 6926959 | Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the ... | 08/09/2005 |
| 6881442 | Continuous two-stage preparation of solvent-free polyacrylate hotmelt PSAs In a continuous two-stage process for preparing solvent-free polyacrylate hotmelt pressure sensitive adhesives which is gentle on the polymer and redeploys the solvent used in the process the following steps are carried out: polyme... | 04/19/2005 |
| 6787244 | Adhesively bonded chip-and wafer stacks The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and... | 09/07/2004 |
| 6670442 | Hot melt adhesives based on polyamides Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly--olefins.... | 12/30/2003 |
| 6590063 | Low-melting copolyamide and their use as hot-melt adhesives Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic ,ω-dicarboxylic acids wit... | 07/08/2003 |
| 6579915 | Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optio... | 06/17/2003 |
| 6528615 | Copolymers containing polyamide blocks and polyether blocks based on ethoxylated amines The present invention relates to copolymers containing polyamide blocks and polyether blocks based on ethoxylated primary amines, these copolymers having a melting point of between 80° C. and 135° C. and an MFI (melt flow index) of between 5 and 80 g/10... | 03/04/2003 |
| 6359107 | Composition of and method for making high performance resins for infusion and transfer molding processes A composition of and method for making high performance imide resins that are processable by resin transfer molding (RTM) and resin infusion (RI) techniques were developed. Materials with a combination of properties, making them particularly useful for th... | 03/19/2002 |
| 6307008 | Polyimide for high temperature adhesive A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures. The polyimide adhesive is based on the polyimide represented by the following formula II which can be prepared th... | 10/23/2001 |
| 6235818 | Hot melt adhesive composition containing -olefin/aromatic vinyl compound random copolymer A hot melt adhesive composition exhibiting excellent adhesive strength and which is useful as an adhesive for styrene resins contains (B) tackifier and (C) ethylene/C3 -C20 -olefin/aromatic vinyl compound random copolymer and,... | 05/22/2001 |
| 6150017 | Process for preparing high-performance pressure-sensitive hotmelt adhesive compositions and the use thereof for producing self-adhesive tapes Pressure-sensitive hotmelt adhesive composition based on non-thermoplastic elastomers, obtained by a) preparing, as the preliminary batch, a composition comprising the elastomers and one or more of the following additives such as fillers, anti-ageing agen... | 11/21/2000 |
| 5973106 | Acrylonitrile polymer compositions, method for producing the compositions, and method for producing shaped articles from the compositions Disclosed are a hot-melting acrylonitrile (AN) polymer composition comprising a non-volatile component modified from AN alone or a AN monomer composition through chemical reaction, an AN polymer and water, a method for producing the composition, and a met... | 10/26/1999 |
| 5866676 | Copolyimides prepared from 3,4'-oxydianiline and 1,3-bis(3-aminophenoxy) benzene with 3,3', 4, 4'-biphenylcarboxylic dianhydride Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA) and endcapping with an effective amount of a non-reactive endcapper. W... | 02/02/1999 |
| 5773509 | Heat resistant resin composition, heat resistant film adhesive and process for producing the same A heat resistant resin composition comprising, as the main components, (A) 100 parts by weight of an organic solvent-soluble polyimide resin having a glass transition temperature of 350° C. or less, (B) 5 to 100 parts by weight of an epoxy compound having at least... | 06/30/1998 |
| 5770676 | Process for controlling morphology and improving thermal mechanical performance of high performance interpenetrating and semiinterpenetrating polymer networks In the process of the present invention, a non-polar, aprotic solvent is removed from an oligomer/polymer solution by freeze-drying in order to produce IPNs and semi-IPNs. By thermally quenching the solution to a solid in a short length of time, the size ... | 06/23/1998 |
| 5760168 | Imide oligomers endcapped with phenylethynl phthalic anhydrides and polymers therefrom Controlled molecular weight phenylethynyl terminated imide oligomers (PETIs) have been prepared by the cyclodehydration of precursor phenylethynyl terminated amic acid oligomers. Amino terminated amic acid oligomers are prepared from the reaction of dianh... | 06/02/1998 |
| 5741883 | Tough, soluble, aromatic, thermoplastic copolyimides Tough, soluble, aromatic, thermoplastic copolyimides were prepared by reacting 4,4'-oxydiphthalic anhydride, 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4'-oxydianiline. These copolyimides were found to be soluble in common amide solvents such as ... | 04/21/1998 |
| 5739263 | Film adhesive and process for production thereof The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350° C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of... | 04/14/1998 |
| 5672677 | Long open time polyamide compositions A polyamide hot melt adhesive is provided. It comprises the polyamide condensation product of substantially equivalent quantities of (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids and (... | 09/30/1997 |
| 5652308 | Tackifiers and a process to obtain tackifiers Novel tackifier resins having a Mn of 5,000 or less and a Tg of 0° C. or above are produced by combining a metallocene catalyst with an alpha-olefin and a cyclic monomer. New adhesives are produced by blending the novel tackifier wi... | 07/29/1997 |
| 5644022 | Copolyimides prepared from 3,4'-oxydianiline and 1,3-bis(3-aminophenoxy) benzene with 3,3'-4,4'-biphenylcarboxylic dianhydride having reactive endgroups Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA), and terminating with an effective amount of a reactive endcapper. The... | 07/01/1997 |
| 5637670 | Polybenzimidazoles via aromatic nucleophilic displacement Novel molecular weight controlled and endcapped polybenzimidazoles (PBI) are prepared by the aromatic nucleophilic displacement reaction of di(hydroxyphenylbenzimidazole) monomers with activated aromatic dihalides or activated aromatic dinitro compounds. ... | 06/10/1997 |
| 5606014 | Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom Controlled molecular weight imide oligomers and co-oligomers containing pendent phenylethynyl groups (PEPIs) and endcapped with nonreactive or phenylethynyl groups have been prepared by the cyclodehydration of the precursor amide acid oligomers or co-olig... | 02/25/1997 |
| 5502157 | Copolyimides prepared from ODPA, BTDA and 3,4'-ODA A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend comprising, based on the total amount of the dianhydride blend, about 67 to 80 mole percent of 4,4'-oxydiphthalic anhydride (ODPA) and about 20 to 33 mole percent... | 03/26/1996 |
| 5478916 | Solvent resistant copolyimide A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diaimine blend comprising, based on the total amount of the diamine blend, about 75 to 90 mole percent of 3,4'-oxydianiline and about 10 to 25 mole percent p-phen... | 12/26/1995 |
| 5459230 | Copolyamide melt adhesives for heat sealing textiles The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamet... | 10/17/1995 |
| 5412059 | Polybenzimidazoles via aromatic nucleophilic displacement Novel molecular weight controlled and endcapped polybenzimidazoles (PBI) are prepared by the aromatic nucleophilic displacement reaction of di(hydroxyphenylbenzimidazole) monomers with activated aromatic dihalides or activated aromatic dinitro compounds. ... | 05/02/1995 |
| 5412066 | Phenylethynyl terminated imide oligomers Four phenylethynyl amine compounds--3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone--were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and ph... | 05/02/1995 |
| 5371168 | Amorphous polyimide powder, preparation process of the powder, and heat-resistant adhesive and bonding method by use of the powder Amorphous polyimide powder which has recurring structural units of the formula (I): ##STR1## as a fundamental skeleton, is blocked at the polymer chain end with dicarboxylic anhydride represented by the formula (II) ##STR2## wherein Z is a ... | 12/06/1994 |
| 5346982 | Heat-resistant adhesive A polyimide-based heat-resistant adhesive having excellent peel strength and heat resistance comprising polyimide composed of 10 to 99% by mole of structural units having the formula (1) and 1 to 90% by mole of structural units having the formula (2) or c... | 09/13/1994 |
| 5262479 | Plasticizer resisant hot melt pressure sensitive adhesive Improved plasticizer resistant pressure sensitive hot melt adhesive compositions are prepared by incorporating in the adhesive polymer, tackifying resin and oil 5 to 70% by weight of the adhesive of a core shell modifier comprising a crosslinked rubbery c... | 11/16/1993 |
| 4937138 | Hot melt polybutylene and poly(butylene/ethylene) adhesives and laminar structures A hot melt adhesive, a laminar structure, and non-woven article fabricated from a blend comprising: from about 50 percent by weight to about 5 percent by weight of a butene-1 homopolymer or copolymer; from about 50 percent by weight to about 95 percent by weig... | 06/26/1990 |
| 4554304 | Hot melt butylene/ethylene adhesives Hot melt adhesives with long open time good bonding to cold metals are made of blends of a maleic anhydride modified copolymer of butene-1 and ethylene, an aliphatic, substantially non-polar resin, a antioxidizing agent and, optionally, microcrystalline w... | 11/19/1985 |
| 4404299 | Compositions for the manufacture of hot-melt adhesives A composition for the manufacture of hot-melt adhesives, in which the improvement comprises a terpolymer of ethylene having a melt index between 5 and 500 dg/minute and comprising from 1 to 10 mol % of units derived from an ester selected from alkyl acryl... | 09/13/1983 |
