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| Number | Title | Issue Date |
| 7786225 | Curable resin composition A curable resin composition, which is a solid resin at ordinary temperatures obtained by reacting an epoxy resin with a (meth)acrylic anhydride, contains an unsaturated resin having a (meth)acryloyl group (A) which has a double bond equivalent weight of 200 to 500, ... | 08/31/2010 |
| 7772333 | Film-forming material containing resin with -Si(OR)and crosslinkable groups Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a ... | 08/10/2010 |
| 7560519 | Dual-stage wafer applied underfills A 100% non-volatile, one-part liquid underfill encapsulant is disclosed for application to the active side of a large wafer or integrated circuit chip. Upon coating, the encapsulant is converted to a liquefiable, tack-free solid by exposure to radiation, particularl... | 07/14/2009 |
| 7425594 | Copolymer of glycidyl ester and/or ether with polyol A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X ... | 09/16/2008 |
| 7423096 | Underfill of resin and sulfonic acid-releasing thermally cleavable compound An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a moun... | 09/09/2008 |
| 7405247 | Conductive adhesive composition A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. ... | 07/29/2008 |
| 7396869 | Metallic acrylate curing agents and usage thereof in intermediate compositions The disclosure relates to using metallic acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat,... | 07/08/2008 |
| 7393419 | Conductive adhesive rework method A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other mo... | 07/01/2008 |
| 7388044 | Coatings with enhanced water-barrier and anti-corrosive properties The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimiz... | 06/17/2008 |
| 7342047 | Crosslinkable hydrophilic materials from reactive oligomers having pendent unsaturated groups The present invention provides cross linkable compositions useful in the preparation of hydrophilic gels, and are prepared from obligers having pendent hydrophilic ploy(alkenylene oxide) groups, and pendent pulverizable functional groups, and cross linked by polyfun... | 03/11/2008 |
| 7323242 | Thermally curable binding agents A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short)... | 01/29/2008 |
| 7247684 | Network polymers comprising epoxy-terminated esters The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a subst... | 07/24/2007 |
| 7235615 | Synthetic polymers with highly-functionalized liquid-rubber chain-end moieties A method is provided for synthesizing a polymer that has highly-functionalized chain-end moieties. The method functionalizes liquid rubber to terminate a metallic or organometallic initiated living polymer. After the living polymer has been terminated with the funct... | 06/26/2007 |
| 7208538 | Metal-acrylates as curing agents for polybutadiene, melamine and epoxy functional compounds The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds. ZDA and ZDMA containing c... | 04/24/2007 |
| 7204574 | Polyimide thickfilm flow feature photoresist and method of applying same A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potenti... | 04/17/2007 |
| 7202154 | Suspension for filling via holes in silicon and method for making the same A metallization process and material system for metallizing either blind or through vias in silicon, involving forming a low coefficient of thermal expansion composite or suspension, relative to pure metals, such as copper, silver, or gold, and filling the via holes... | 04/10/2007 |
| 7183338 | Tile grout A durable, stain resistant tile grout comprised of naturally rounded quartz particles and water-borne polyurethane. The naturally rounded quartz particles are permanently colored and encapsulated within the water-borne polyurethane, which remains transparent and sho... | 02/27/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7166675 | Low gloss powder coating composition A thermosetting protective and/or decorative coating composition that includes a co-reactable solid, particulate mixture of a film-forming material that includes a copolymer containing functional groups and a crosslinking agent having at least two functional groups ... | 01/23/2007 |
| 7144630 | Aqueous adhesive compositions for bonding elastomers The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal. ... | 12/05/2006 |
| 7087684 | Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same Self-dispersing, hardenable epoxy resins produced by reacting one or more α,β-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Pr... | 08/08/2006 |
| 7084210 | Heat activated epoxy adhesive and use in a structural foam insert An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small vo... | 08/01/2006 |
| 7078106 | Thermosetting resin composition and use thereof A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 | 07/18/2006 |
| 7045581 | Method for carrying out polymerization reactions A method for carrying out homogenous polymerization reactions in a reactor, wherein monomers and/or prepolymers are fed (apportioned). In a first step, an initiator is optionally admixed with the monomer and/or prepolymer. In a second step, once viscosity is substan... | 05/16/2006 |
| 7037584 | Coatings having low volatile organic compound content The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no ... | 05/02/2006 |
| 7022779 | One-pack moisture-curing epoxy resin composition A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition include... | 04/04/2006 |
| 7014699 | Oxalkylation products produced from epoxides and amines and their use in pigment preparations The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated ali... | 03/21/2006 |
| 7009009 | Fluxing underfill compositions A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which... | 03/07/2006 |
| 7001938 | Epoxy resin curing compositions and resin compositions including same Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agent... | 02/21/2006 |
| 6964813 | Ultraviolet curable resin composition and photo solder resist including the same An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacti... | 11/15/2005 |
| 6916538 | Thermosetting resin composition and semiconductor device obtained with the same A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) o... | 07/12/2005 |
| 6914103 | Powder coating composition, method for the curing thereof, and articles derived therefrom A powder coating composition includes an epoxy resin and a styrene-maleic anhydride copolymer having a glass transition temperature less than 105° C. The compositions provide low gloss finishes at low curing temperatures, as well as consistent gloss over a wide ran... | 07/05/2005 |
| 6911109 | Two-part, room temperature curable epoxy resin/ (meth)acrylate compositions and process for using same to bond substrates The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and o... | 06/28/2005 |
| 6905778 | Powder coating composition, method for the curing thereof, and articles derived therefrom A powder coating composition includes an acid-functional polyester resin and a matting agent selected from styrene-maleic anhydride copolymers and acid-functional acrylic resins. The compositions provide low gloss finishes at low curing temperatures, as well as cons... | 06/14/2005 |
| 6900276 | Low VOC vinylester resin and applications A low viscosity (and therefore low VOC) resin can be produced by limiting the molar ratio of the reactants, especially the dicarboxylic acid compound, used in the reaction. Specifically, reacting a reaction mixture comprising (i) one mole of a diepoxide having at le... | 05/31/2005 |
| 6896967 | Ultraviolet-curable resin composition and photosolder resist ink containing the composition An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated mo... | 05/24/2005 |
| 6887737 | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably... | 05/03/2005 |
| 6884854 | Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compo... | 04/26/2005 |
| 6846559 | Activatable material An activatable (e.g., heat expandable) material and articles incorporating the same is disclosed. The material includes an epoxy resin; an epoxy/elastomer hybrid or reaction product; a blowing agent; a curing agent; and optionally, a filler. In preferred embodiments... | 01/25/2005 |
| 6818702 | Thermosetting resin composition and flexible circuit overcoating material comprising the same A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured ... | 11/16/2004 |
