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| Number | Title | Issue Date |
| 7985809 | Polymer solutions There is provided a method of making a polymer solution comprising polymerizing one or more monomer in a solvent, wherein said monomer comprises one or more ethylenically unsaturated monomer that is a multi-functional Michael donor, and wherein said solvent comprise... | 07/26/2011 |
| 7781542 | Cure accelerators An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for th... | 08/24/2010 |
| 7425594 | Copolymer of glycidyl ester and/or ether with polyol A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X ... | 09/16/2008 |
| 7425347 | Composition for forming anti-reflective coating for use in lithography The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a weight average molecular weight of 5,000 or less, and a polymer (B) havi... | 09/16/2008 |
| 7423096 | Underfill of resin and sulfonic acid-releasing thermally cleavable compound An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a moun... | 09/09/2008 |
| 7405247 | Conductive adhesive composition A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. ... | 07/29/2008 |
| 7393419 | Conductive adhesive rework method A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other mo... | 07/01/2008 |
| 7388044 | Coatings with enhanced water-barrier and anti-corrosive properties The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimiz... | 06/17/2008 |
| 7371804 | Monomers and polymers for optical elements Compositions comprising a matrix polymer and a mixture of monomers are used for making polymer mixtures containing the matrix polymer and a second polymer formed from the monomer mixture. Preferably, the matrix polymer comprises a polyester, polystyrene, polyacrylat... | 05/13/2008 |
| 7354499 | Method for making a lubricating fast setting epoxy composition A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystallin... | 04/08/2008 |
| 7345140 | Phenol-reacted non-ester alicyclic diepoxides The present invention provides a non-ester type epoxy resin having a low hydrolytic chlorine content and containing no ester bond that is easily hydrolyzed, and a resin composition containing the non-ester type epoxy resin as an essential ingredient. Using the non-e... | 03/18/2008 |
| 7323242 | Thermally curable binding agents A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short)... | 01/29/2008 |
| 7312261 | Thermal interface adhesive and rework A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved metho... | 12/25/2007 |
| 7312266 | Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers Organic thiol compounds based on pentaerythritol and dipentaerythritol are described herein. More specifically, the compounds of the present invention are mixed esters of pentaerythritol and dipentaerythritol having at least one sulfhydryl group and preferably a plu... | 12/25/2007 |
| 7279196 | Liner for waste water system rehabilitation A technique and device for rehabilitating or repairing waste water system components or the like, comprising a spray-applied, multi-layer liner which seals the components and imparts structural integrity. The liner comprises a primer layer, a first moisture barrier ... | 10/09/2007 |
| 7244786 | Flame-retardant resin composition, moldings thereof and flame retardant A flame-retardant resin composition comprising 100 parts by weight of a rubber-reinforced polystyrene resin, from 0.1 to 20 parts by weight of an epoxy-modified phenolic resin, and from 1 to 30 parts by weight of an aromatic phosphate has good flame retardancy and g... | 07/17/2007 |
| 7216592 | Plastic shipping and storage containers and composition and method therefore A polymeric composition comprises a thermosetting resin and a polyolefin resin that cures to a semi-interpenetrating polymer network and is useful for producing plastic shipping and storage containers. The containers exhibit one or more friction surfaces, and can in... | 05/15/2007 |
| 7208228 | Epoxy resin for fiber reinforced composite materials An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing agent, and (C) a liquid rubber that is liquid at room temperature and com... | 04/24/2007 |
| 7196124 | Elastomeric material compositions obtained from castor oil and epoxidized soybean oil Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reac... | 03/27/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7157549 | Polymerization of oxiranes with a lithium-containing initiator A method is provided for polymerizing oxiranes by employing a lithium-containing polymerization initiator in a liquid reaction medium devoid of polymerization additives. Linear and star polymers can be produced by practicing the subject method. ... | 01/02/2007 |
| 7157313 | Epoxy resin composition and semiconductor device using thereof The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, t... | 01/02/2007 |
| 7144630 | Aqueous adhesive compositions for bonding elastomers The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal. ... | 12/05/2006 |
| 7138444 | Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions The invention provides high solids epoxy-based autodeposition coating materials and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. An epoxy pre-polymer is used. The epoxy pre-po... | 11/21/2006 |
| 7132483 | Water-based coating compositions containing epoxy resin(s) and (meth)acrylate(s), and methods of using the same Water-based coating composition comprising: (a) from 0.5 to 90% by weight of at least one epoxy resin other than self-dispersing epoxy resins; (b) from 0.5 to 90% by weight of at least one (meth)acrylate of a polyol; (c) from 5.0 to 98.0% by weight of water; and (d)... | 11/07/2006 |
| 7094816 | Water-based coating compositions containing epoxy resin(s) and (meth)acrylate(s), and methods of using the same Water-based coating composition comprising: (a) from 0.5 to 90% by weight of at least one epoxy resin, wherein the epoxy resin is solid at 20° C., and wherein the epoxy resin is self-dispersing in water; (b) from 0.5 to 90% by weight of at least one (meth)acrylate ... | 08/22/2006 |
| 7087304 | Polysulfide-based toughening agents, compositions containing same and methods for the use thereof In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of comp... | 08/08/2006 |
| 7086420 | Multilayered elastomer hose with reinforcement layer consisting of sulfur-containing polymer material The present invention relates to a multilayered elastomer hose comprising at least an inner layer, an outer layer and a reinforcement layer. To enhance the loadability of conventional elastomer hoses while maintaining the typical flexible structure, it is intended a... | 08/08/2006 |
| 7084210 | Heat activated epoxy adhesive and use in a structural foam insert An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small vo... | 08/01/2006 |
| 7078106 | Thermosetting resin composition and use thereof A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 | 07/18/2006 |
| 7056959 | Dye-containing curable composition and color filter using the same A dye-containing curable composition contains at least an alkali soluble resin, a dye, and a photosensitive compound, the dye being a phthalocyanine compound represented by the following general formula (I): M-Pc-(Y)l General Formula (I) | 06/06/2006 |
| 7045562 | Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls A method of self-healing cracks in a cured epoxy base underfill material between an I/C chip and a substrate is provided. A plurality of capsules is dispersed in the epoxy base. Each capsule has a curable thermosetting adhesive encapsulated in a rupturable shell to ... | 05/16/2006 |
| 7037584 | Coatings having low volatile organic compound content The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no ... | 05/02/2006 |
| 7030198 | Curable compositions comprising an epoxidised unsaturated polyester and mineral fillers A curable composition includes an unsaturated polyester and an unsaturated monomer copolymerisable with the unsaturated polyester in the presence of polymerisation accelerators and initiators. The unsaturated polyester is an epoxidised unsaturated polyester obtainab... | 04/18/2006 |
| 7014699 | Oxalkylation products produced from epoxides and amines and their use in pigment preparations The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated ali... | 03/21/2006 |
| 7005483 | Epoxy ebonite compositions Overall, ebonite coatings or elastomeric linings are not recommended for direct immersion in sulfuric acid with higher than 65% concentration. By blending a chemical resistant epoxy resin to an ebonite coating, the resulting epoxy ebonite composition can be employed... | 02/28/2006 |
| 6979719 | Coating composition comprising a compound comprising at least one bicyclo-orthoester group and at least one other functional group The invention pertains to a coating composition comprising a compound comprising at least one bicyclo-orthoester group and at least one other functional group. The invention also comprises a process for curing the present coating composition. Further, a process for ... | 12/27/2005 |
| 6964813 | Ultraviolet curable resin composition and photo solder resist including the same An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacti... | 11/15/2005 |
| 6924008 | Curable resin composition, a method for the preparation thereof, and a coated article thereof There are provided a curable resin composition composed of an epoxy compound having an ionic polymerizability and viscosity of not more than 1,000 cP at 25° C., an acrylic resin having an ionic polymerizable functional group, and a thermally-activating ionic polyme... | 08/02/2005 |
| 6916538 | Thermosetting resin composition and semiconductor device obtained with the same A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) o... | 07/12/2005 |
