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| Number | Title | Issue Date |
| 8124695 | Resin composition for semiconductor encapsulation and semiconductor device A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) a... | 02/28/2012 |
| 8084553 | Curable adhesive compositions, process, and applications The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released o... | 12/27/2011 |
| 8058364 | Method for functionalization of nanoscale fibers and nanoscale fiber films A method is provided for functionalizing nanoscale fibers including reacting a plurality of nanoscale fibers with at least one epoxide monomer to chemically bond the at least one epoxide monomer to surfaces of the nanoscale fibers to form functionalized nanoscale fi... | 11/15/2011 |
| 8008410 | Epoxy resin composition for encapsulating semiconductor and semiconductor device There is provided an epoxy resin composition for encapsulating a semiconductor comprising an epoxy resin (A), wherein the epoxy resin (A) including: a crystalline epoxy resin (a1) having a melting point of 50° C. to 150° C., an epoxy resin (a2) represented by form... | 08/30/2011 |
| 8003737 | Coating system A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a hybrid hardener, whereby said hardener is a blend of b1) an aminic compound selected from... | 08/23/2011 |
| 7960483 | Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W represents, for example, a hydrogen atom, X is bonded to a bridge-head adama... | 06/14/2011 |
| 7956136 | Resin composition for semiconductor encapsulation and semiconductor device The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved t... | 06/07/2011 |
| 7943706 | Semiconductor encapsulating epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B... | 05/17/2011 |
| 7888436 | Compositions comprising thioether-functional oligomeric polythiols Sealant and potting formulations comprising a thioether-functional, oligomeric polythiol prepared by reacting together: (a) a compound having at least two thiol functional groups; and (b) a compound having triple b... | 02/15/2011 |
| 7829639 | Composition for conductive layers in electronic devices A composition for conductive materials comprises a compound represented by the following general formula (A1): wherein: R1 is the same or different and each independently repres... | 11/09/2010 |
| 7786224 | Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator A liquid epoxy resin composition of an epoxy resin, a curing agent, and a curing accelerator, where the epoxy resin is an alicyclic epoxy compound present in an amount from 100 to 30% by weight. The alicyclic epoxy compound is preferably produced by using a percarbo... | 08/31/2010 |
| 7608672 | Infiltrant system for rapid prototyping process An infiltrant system for rapid prototyping processes. The infiltrant system generally includes a resin component and a hardener component. The resin component typically includes an epoxy resin, and a diluent. The hardener component typically includes an amine, optio... | 10/27/2009 |
| 7566757 | Flame retarding epoxy resin composition containing no halogen The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a hi... | 07/28/2009 |
| 7438782 | Activatable material for sealing, baffling or reinforcing and method of forming same An activatable material and articles incorporating the same is disclosed. The activatable material includes at least two of epoxy resin; impact modifier; blowing agent; curing agent; and filler. The activatable material is preferably used for sealing, baffling, adhe... | 10/21/2008 |
| 7423096 | Underfill of resin and sulfonic acid-releasing thermally cleavable compound An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a moun... | 09/09/2008 |
| 7410673 | Smooth board and process for preparing a smooth board The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin... | 08/12/2008 |
| 7396885 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid epoxy resin, and (V) a latent curing agent. The resin composition ca... | 07/08/2008 |
| 7390859 | Compositions and methods of making compositions exhibiting fuel resistance Curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies, and methods of using curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies are disclosed. Cured, curable compositions exhibit enhanced ... | 06/24/2008 |
| 7388646 | Perfluoropolyethers Use in optical systems as liquids to transmit light at wave lengths lower than 250 nm, in particular at 157 nm, of perfluoropolyethers having the following formula: X1—O(CF2O)n(CF2CF2O)m(C... | 06/17/2008 |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7345140 | Phenol-reacted non-ester alicyclic diepoxides The present invention provides a non-ester type epoxy resin having a low hydrolytic chlorine content and containing no ester bond that is easily hydrolyzed, and a resin composition containing the non-ester type epoxy resin as an essential ingredient. Using the non-e... | 03/18/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7312260 | Epoxide adducts and their salts as dispersants The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one pr... | 12/25/2007 |
| 7300963 | Hardeners for water-based epoxy resin systems and processes for using the same Hardeners for water-based epoxy resin systems, the hardeners being obtainable by reacting a mixture of: (A) at least one epoxidized polyalkylene oxide selected from the group of epoxidized polyethylene oxides, epoxidized polypropylene oxides and polyethylene propyle... | 11/27/2007 |
| 7294660 | Epoxy resin composition An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The epoxy resin composition contains a large amount of the aluminum bora... | 11/13/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7276563 | Polyphenylene ether oligomer compound, derivatives thereof and use thereof The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition ... | 10/02/2007 |
| 7247684 | Network polymers comprising epoxy-terminated esters The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a subst... | 07/24/2007 |
| 7244793 | Adhesive compositions Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive composition... | 07/17/2007 |
| 7223820 | Amine hardener for epoxy resins Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5, E is an (m+1)-valent aliphatic, cycloaliphatic, ... | 05/29/2007 |
| 7220666 | Interconnection element for BGA housings and method for producing the same An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one ... | 05/22/2007 |
| 7220787 | Photoreactive hot-melt adhesive composition It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate. A p... | 05/22/2007 |
| 7208228 | Epoxy resin for fiber reinforced composite materials An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing agent, and (C) a liquid rubber that is liquid at room temperature and com... | 04/24/2007 |
| 7196124 | Elastomeric material compositions obtained from castor oil and epoxidized soybean oil Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reac... | 03/27/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7157143 | Two-component epoxy adhesive formulation for high elongation with low modulus Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, ... | 01/02/2007 |
| 7150913 | Sizing agent for carbon fiber, aqueous dispersion of the same, carbon fiber treated by sizing, sheet comprising the carbon fiber, and carbon fiber-reinforced composite material A sizing agent for carbon fiber comprising either a component (A) and a component (B), or alternatively, a component (A′), a component (B′) and a component (D), each of which is described below. Component (A): an epoxy compound with at least 1 epoxy group within... | 12/19/2006 |
| 7150902 | High Tcoatings Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy... | 12/19/2006 |
