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| Number | Title | Issue Date |
| 8101689 | Shape memory epoxy copolymer The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phe... | 01/24/2012 |
| 8101690 | Amine functional adducts and curable compositions comprising same An amine functional adduct is obtained by admixing a stoichiometric excess of a cycloaliphatic diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group. ... | 01/24/2012 |
| 8093340 | High strength reversible noncovalent adhesion methods for a solid polymer-polymer interface A reversible adhesive system for coupling together two objects may consist of two shape memory polymers with molecular “hooks and loops” on the surfaces (i.e. the surface away from each of the objects). Utilizing the shape memory properties of the polymers, the ... | 01/10/2012 |
| 8063157 | Curing agents for epoxy resins Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a polyethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) preferably being isolated by removal... | 11/22/2011 |
| 8058363 | Varnish and prepreg, and substrates thereof A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal... | 11/15/2011 |
| 8008409 | Energetic poly (azidoaminoethers) The currently disclosed device is a novel poly(azidoaminoether)-based energetic polymer utilizing a chemical design that possesses great versatility in tailoring properties such as endothermicity, oxygen balance, flexibility, toughness, and crystallinity. Furthermor... | 08/30/2011 |
| 7999042 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl,... | 08/16/2011 |
| 7981980 | Development of a cross-linked epoxy resin with flame-retardant properties The invention discloses a cross-linked epoxy resin with flame-retardant properties and method for producing the same. The polymeric material of the invention includes an epoxy resin, a curing agent and a modification agent. Particularly, the modification agent is a ... | 07/19/2011 |
| 7910666 | Mercaptan-hardened epoxy polymer compositions and processes for making and using same Mercaptan-hardened epoxy polymer compositions, methods of making the mercaptan-hardened epoxy polymer compositions, and methods of using the mercaptan-hardened epoxy polymer compositions are provided. The mercaptan-hardened epoxy polymer can be produced by contactin... | 03/22/2011 |
| 7910665 | Composition of epoxy resin and epoxy-reactive polyphosphonate An epoxy resin composition comprising an epoxy resin and, as the effective curing agent, an epoxy-reactive polyphosphonate which can be of the formula (I) where “Y” is an arylene and “n” can range from about 2 to about 30. | 03/22/2011 |
| 7902305 | Composition of cationic initiator and oxetane compound This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator. ... | 03/08/2011 |
| 7897702 | Epoxy resin, curing agent and 9,10-Dihydro-9-oxa-10-phosphaphenanthrene derivative The invention discloses a novel cross-linked epoxy resin with flame-retardant properties and method for producing the same. The polymeric material of the invention includes an epoxy resin, a curing agent and a modification agent. Particularly, the modification agent... | 03/01/2011 |
| 7897703 | Epoxy resin and 4,4′-diaminobenzanilide powder Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4′-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns. | 03/01/2011 |
| 7872079 | Naphthoxazine composition The present invention is intended to provide a novel naphthoxazine composition having a smaller amount of volatile components (weight reduction) upon curing, and is to provide a naphthoxazine composition characterized in that a naphthoxazine compound having a phenol... | 01/18/2011 |
| 7842762 | Electrodepositable coating composition containing a cyclic guanidine The present invention is directed towards an electrocoating composition comprising a cyclic guanidine. ... | 11/30/2010 |
| 7834105 | Thiol-, hydroxyl-, amine- or vinyl-terminated polythioethers Curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies, and methods of using curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies are disclosed. Cured, curable compositions exhibit enhanced ... | 11/16/2010 |
| 7790814 | Radiopaque polymers for circuit board assembly The thermosetable composition incorporating organo-iodine compounds that provide improved x-ray contrast are prepared by reacting an epoxy resin with crosslinking agents, wherein the crosslinking agents include compounds having iodo-phenyl functionalities, and where... | 09/07/2010 |
| 7786223 | Epoxy resin and curing agent of di- and/or mono-glycidyether/monoamine-polyamine reaction product A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of ... | 08/31/2010 |
| 7741413 | Curable compositions having improved adhesion performance The present invention relates to adhesion-improved, curable compositions comprising a cyclic ether, a cyclic thiocarbonate, an amine and a carboxylic acid. A method of making such compositions and their use in adhesives, sealants and coatings are also provided. ... | 06/22/2010 |
| 7718741 | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced o... | 05/18/2010 |
| 7709582 | Epoxy resin composition for fiber reinforced composite material, a production method for fiber reinforced composite material, and a fiber reinforced composite material An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphen... | 05/04/2010 |
| 7671146 | Epoxy resin composition for encapsulating semiconductor and semiconductor device This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as ... | 03/02/2010 |
| 7671145 | Epoxy-capped polythioethers by reacting dithiol, diolefin and monoepoxy olefin Epoxy-capped polythioethers and curable compositions of epoxy-capped polythioethers are disclosed. ... | 03/02/2010 |
| 7666954 | Epoxy resin amine curing agent of N,N′-dimethyl secondary diamine polymer The present invention provides N,N′-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N′-dimethyl ... | 02/23/2010 |
| 7612153 | Heterobifunctional poly(ethylene glycol) and uses thereof The present invention provides bifunctional polymers, methods of preparing the same, and intermediates thereto. These compounds are useful in a variety of applications including the PEGylation of biologically active molecules. The invention also provides methods of ... | 11/03/2009 |
| 7582706 | Low chlorine content epoxy resin The invention relates to epoxy resins having an extremely low content of chlorine, particularly a low content of organically bound chlorine. The invention also relates to a production method during which total chlorine contents of less than 100 ppm in the epoxy resi... | 09/01/2009 |
| 7538166 | Epoxy compounds and cured epoxy resins obtained by curing the compounds Novel epoxy compounds represented by the general formula (1) wherein Ar1, Ar2 and Ar3 are each optionally substituted phenylene, cyclohexanyl or the like, R1, R2, R | 05/26/2009 |
| 7528200 | Epoxy hardener systems based on aminobis(methylene-ethyleneurea) An epoxy-hardener system is provided having relatively long latency periods combined with relatively short cure times at low cure temperatures. The hardeners of the present invention are ureidoamines and their derivatives, which are chelates of ureido compounds and ... | 05/05/2009 |
| 7514507 | Comb-shaped epoxy resin and method for preparing comb-shaped epoxy resin The present invention provides a comb-shaped epoxy resin represented by the following formula (1): in the formula (1), X1 and X2 represent a divalent group having a residue selected from xanthene resid... | 04/07/2009 |
| 7504460 | Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X—((CH2)m—(N)—((CH2)... | 03/17/2009 |
| 7498389 | Multi-component kit of epoxy resin and mannich base components A multi-component kit for a curable composition for fixing purposes, comprising an epoxy component (a), which comprises curable epoxides, and a hardener component (b), which comprises a Mannich base formulation, and the use of Mannich base formulations and, especial... | 03/03/2009 |
| 7495060 | Tetrakisphenol and non-clathrated curing agent for epoxy resin The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in ... | 02/24/2009 |
| 7470755 | Polyepoxide, amine and mercaptan-terminated polyoxyalkylene Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component and the amine component includes a sulfur-containing polymer. Also di... | 12/30/2008 |
| 7449526 | Oligomeric, hydroxy-terminated phosphonates Epoxy resins that are suitable for forming epoxy laminates that meet a UL-94 rating of V-0 comprise a hydroxy-terminated oligomeric phosphonate comprising the repeating structure —OP(═O)(R)OArylene-, where R is alkyl, as a flame retardant. ... | 11/11/2008 |
| 7442729 | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 10/28/2008 |
| 7442434 | Epoxy resin composition A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing te... | 10/28/2008 |
| 7431990 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this inve... | 10/07/2008 |
| 7429800 | Molding composition and method, and molded article A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica... | 09/30/2008 |
| 7427652 | Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxaz... | 09/23/2008 |
| 7425347 | Composition for forming anti-reflective coating for use in lithography The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a weight average molecular weight of 5,000 or less, and a polymer (B) havi... | 09/16/2008 |
