Bizarre Patents
Vehicular Impact Signaling Device
An apparatus for the deployment of a visible plume to alert other motorists that a proximate motor vehicle has been involved in a collision.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8431653 | Curing agent composition for epoxy resins and epoxy resin composition The present invention relates to a curing agent composition for epoxy resins comprising (A) a polyamine compound which is a reaction product of a compound having at least one glycidyl group in a molecule with a diamine having a specific structure, (B) a polyether-mo... | 04/30/2013 |
| 8283422 | Polyethersiloxanes carrying alkoxysilyl groups and method for production thereof Alkoxysilyl-functional polyether-siloxanes and processes for preparing them by noble metal-catalysed SiC coupling of hydrogensiloxanes having SiH groups with unsaturated polyethers bearing alkoxysilyl groups or by alkoxylation of polyethersiloxanes or polysiloxanes ... | 10/09/2012 |
| 8268939 | Process for modifying surfaces Use of one or more mixed curable hydroxyl-containing silyl polyethers as a constituent of compositions, as modifiers for surfaces, the silyl polyethers being prepared by DMC-catalysed alkoxylation of epoxy-functional alkoxysilanes. ... | 09/18/2012 |
| 8232355 | Liquid resin composition for electronic components and electronic component device The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resi... | 07/31/2012 |
| 8138276 | Silicone containing encapsulant The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol f... | 03/20/2012 |
| 8133957 | Resin composition for encapsulating optical semiconductor element A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2 | 03/13/2012 |
| 7985806 | Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents... | 07/26/2011 |
| 7985807 | Thermosetting composition A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, an epoxy silicone, and a silicone elastomer. The thermosetting composition of the present invention can be used for, for example, encapsulating material... | 07/26/2011 |
| 7981977 | Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at le... | 07/19/2011 |
| 7863391 | Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formu... | 01/04/2011 |
| 7781541 | Polyimide silicone resin and thermosetting composition comprising the same A polyimide silicone resin, characterized in that the polyimide silicone resin comprises repeating units represented by the following formula (1) and has a number average molecular weight of from 5,000 to 200,000 | 08/24/2010 |
| 7759435 | Adducts and curable compositions using same The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having im... | 07/20/2010 |
| 7750094 | Adducts and curable compositions using same The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fract... | 07/06/2010 |
| 7714080 | Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device A primer composition comprising an alkoxysilyl-containing polyamide-imide resin, an epoxy resin, a curing promoter, and an organic solvent forms a cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of ep... | 05/11/2010 |
| 7674865 | Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin ... | 03/09/2010 |
| 7612152 | Self-healing polymers A composite material includes a polymer matrix, a polymerizer, and a plurality of capsules containing a corresponding activator for the polymerizer. The composite material can also include an adhesion promoter, and the polymerizer can be phase separated from the pol... | 11/03/2009 |
| 7592399 | Epoxy/silicone hybrid resin composition and optical semiconductor device An epoxy/silicone hybrid resin composition is provided comprising (A) an organosilicon compound having at least one silicon-bonded hydroxyl group, (B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or... | 09/22/2009 |
| 7432335 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carbox... | 10/07/2008 |
| 7432334 | Silicone-modified single-component casting compound A casting compound based on a resin which cures by a chemical reaction. The casting compound is suitable for insulation of electric components and contains an epoxy resin component, a silicone-containing component, a filler, and a thermal initiator. This casting com... | 10/07/2008 |
| 7425594 | Copolymer of glycidyl ester and/or ether with polyol A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X ... | 09/16/2008 |
| 7405247 | Conductive adhesive composition A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. ... | 07/29/2008 |
| 7350571 | Methods of preparing and using coated particulates The present invention involves methods of preparing coated particulates and using such coated particulates in subterranean applications such as production enhancement and sand control. One embodiment of the present invention provides a method of preparing coated par... | 04/01/2008 |
| 7351783 | Composition to be used in paints A paint composition has a resin constituent which includes (i) a non-aromatic epoxy resin, (ii) a polysiloxane and (iii) an epoxysilane. The paint composition has an anti-corrosive effect. ... | 04/01/2008 |
| 7348374 | Induction cured powder coatings for temperature sensitive substrates According to the present invention, powder coating compositions comprise one or more than one thermoplastic or thermosetting polymer or resin and one or more than one finely divided magnetic material, such as a ferromagnetic material. Preferred magnetic materials in... | 03/25/2008 |
| 7342069 | Highly elastomeric and paintable silicone compositions Highly elastomeric, curable, paintable silicone compositions are provided. The paintable silicone compositions comprise an organopolysiloxane, a silicone functional crosslinker, and an organic polymer. The highly elastomeric, curable, paintable silicone compositions... | 03/11/2008 |
| 7334636 | Methods of creating high-porosity propped fractures using reticulated foam One embodiment of the prevent invention provides a method of creating a high porosity propped fracture comprising creating a slurry comprising a treatment fluid, proppant particulates, pieces of reticulated foam having cells, and an adhesive substance such that the ... | 02/26/2008 |
| 7334635 | Methods for fracturing subterranean wells A method of forming a propped fracture comprising: providing a fracture having a far-well bore area and a near-well bore area; placing first proppant particulates at least partially coated with an adhesive substance; placing a portion of second proppant particulates... | 02/26/2008 |
| 7326755 | Coolant resistant and thermally stable primer composition A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additi... | 02/05/2008 |
| 7318474 | Methods and compositions for controlling formation fines and reducing proppant flow-back Provided herein are methods for controlling the migration of particulates within a portion of a subterranean formation that comprise aqueous tackifying treatment fluids, curable resin compositions, and/or noncurable resin compositions. ... | 01/15/2008 |
| 7318473 | Methods relating to maintaining the structural integrity of deviated well bores Methods of enhancing at least partially the structural integrity of a longitudinal portion of a deviated well bore are provided. The methods include providing a gravel matrix composition; providing a longitudinal portion of a deviated well bore; and placing a suffic... | 01/15/2008 |
| 7319128 | Preparation of organyloxysilyl-terminated polymers The present invention relates to a process for preparing organyloxysilyl-terminated polymers which have increased stability toward atmospheric moisture, by reacting hydroxy-terminated organic polymers with isocyanato-functional silanes in the presence of at least on... | 01/15/2008 |
| 7312261 | Thermal interface adhesive and rework A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved metho... | 12/25/2007 |
| 7299875 | Methods for controlling particulate migration Many methods are provided including methods of stabilizing a portion of a subterranean formation or reducing the production of particulates from a portion of a subterranean formation comprising contacting the portion of the subterranean formation with a pre-flush fl... | 11/27/2007 |
| 7288607 | High solids primer composition based on epoxy ring opening curing reaction This invention relates to a primer composition having a low VOC content useful in the manufacture of automobiles and trucks in which the film forming binder contains: a) a cycloaliphatic or polycycloaliphatic epoxy compound; ... | 10/30/2007 |
| 7281581 | Methods of hydraulic fracturing and of propping fractures in subterranean formations A method of propping at least one fracture in a subterranean formation, that comprises forming a plurality of proppant aggregates, each proppant aggregate comprising a binding fluid and a filler material, and introducing the plurality of proppant aggregates into the... | 10/16/2007 |
| 7279223 | Underfill composition and packaged solid state device An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized c... | 10/09/2007 |
| 7276541 | Use of hydroxyl-functional polyalkylorganosiloxanes as solvents for cationic photoinitiators for use in radiation- curable silicones The invention provides for the use of hydroxyl-functional polyalkylorganosiloxanes of the general formula (IV) as solvents for cationic photoinitiators and for the use of these solutions in cationically curable s... | 10/02/2007 |
| 7276562 | Epoxy-silicone mixed resin composition and light-emitting semiconductor device An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight o... | 10/02/2007 |
| 7273099 | Methods of stimulating a subterranean formation comprising multiple production intervals A method of stimulating a production interval adjacent a well bore having a casing disposed therein, that comprises introducing a carrier fluid comprising first particulates into the well bore, packing the first particulates into a plurality of perforations in the c... | 09/25/2007 |
| 7273687 | Toner fuser member having release layer formed from glycidyl end-capped polymer and perfluoroalkyl glycidyl-reactive compound A toner fuser member has a substrate, on which is formed a toner release surface layer from a composition that includes: about 95 wt. % to about 99.9 wt. % of a cross-linked, glycidyl end-capped bisphenolic polymer having the formula | 09/25/2007 |
