Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 8153732 | Biaxially oriented polyphenylene sulfide film A biaxially oriented polyphenylene sulfide film contains polyphenylene sulfide and polyether imide, wherein the contents of the polyphenylene sulfide and the polyether imide are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount ... | 04/10/2012 |
| 8053533 | Phenolic OH-containing polyimide silicone, epoxy resin and curing agent A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin,... | 11/08/2011 |
| 8034882 | Biscarbazol-9-yl-substituted triarylamine-containing polymers and electronic devices A conjugated or partially conjugated polymer including a structural unit of Formula (I); where T is an aryl or heteroaryl group that may be substituted or unsubstituted, or a C1-C24 alkyl group; R1 is alkyl, alkoxy, aryl group, cyano, or F; and a and b are independe... | 10/11/2011 |
| 7888434 | Aromatic polyamide and epoxy group-containing phenoxy resin A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy... | 02/15/2011 |
| 7714078 | One pot procedure for poly (glycidyl nitrate) end modification A method is provided in which PGN is end-modified in a process using a single solvent. The resulting end-modified PGN may be stably crosslinked using aliphatic polyisocyanates. Further provided are methods of producing energetic compositions comprising PGN which has... | 05/11/2010 |
| 7432335 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carbox... | 10/07/2008 |
| 7425594 | Copolymer of glycidyl ester and/or ether with polyol A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X ... | 09/16/2008 |
| 7390497 | Poly(ester amide) filler blends for modulation of coating properties Provided herein is a PEA polymer blend and coatings or implantable devices formed therefrom. The PEA polymer blend is formed of a PEA polymer and a material capable of hydrogen bonding with the PEA. The PEA polymer blend can form a coating on an implantable device, ... | 06/24/2008 |
| 7371801 | Vinyl ester and epoxide resins toughened with thermoplastic resin particles A material having a fracture toughness (K1c) of at least 1.2 Mpam.m1/2 as determined according to Standard ISO 13586:2000 comprises a vinyl ester and/or epoxide resin polymerizable at a temperature of less than 70° C. combined with thermoplast... | 05/13/2008 |
| 7364797 | Adhesive composition and adhesive film An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared fr... | 04/29/2008 |
| 7361715 | Polymer additives for powder coatings Star polymers prepared by reacting a highly branched polymer and either a lactone or lactam are disclosed. These star polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating... | 04/22/2008 |
| 7358189 | Copper clad laminate To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thi... | 04/15/2008 |
| 7358312 | Epoxy resin curing agent of epoxy resin-liquid amine adduct and polyamidoamine This invention describes epoxy-amine compositions that have low mix viscosity and a fast drying property at temperatures below freezing. The composition is useful for high solids coating applications, for adhesive and membrane applications, and for preparing ... | 04/15/2008 |
| 7345101 | Aqueous composition of reaction product of epoxy and phosphorus materials with curing agent A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 03/18/2008 |
| 7339009 | Cross-linked polyimide and method of making them A cross-linked polyimide is disclosed. The cross-linked polyimide includes a polyimide and at least one oxygenated hydrocarbon. The oxygenated hydrocarbon cross-links the polyimide. A porous cross-linked membrane is also disclosed. The porous cross-linked membrane i... | 03/04/2008 |
| 7329711 | Modified epoxy resins The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the ... | 02/12/2008 |
| 7320830 | Flame-retardant heat-resistant resin composition and adhesive film comprising the same The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant... | 01/22/2008 |
| 7300986 | Polyepoxy compounds having an amide linkage The present invention provides compounds that have an amide linkage and at least two epoxy groups. The compounds are preferably aliphatic. ... | 11/27/2007 |
| 7288493 | Body armor with improved knife-stab resistance formed from flexible composites Flexible body armor formed from flexible composites which have improved knife-stab resistance. The body armor is formed from composites which include layers of a fabric base, formed from high tenacity fibers, and a rubber layer bonded to the fabric base. A thermopla... | 10/30/2007 |
| 7279521 | Nylon nanocomposites A method for modifying the properties of a nylon block copolymer comprising: supplying a nylon block copolymer wherein the nylon block copolymer has a flexural modulus, a tensile modulus, and an unnotched Izod impact strength. Incorporated into the nylon block copol... | 10/09/2007 |
| 7271224 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/18/2007 |
| 7267877 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/11/2007 |
| 7253230 | Method of manufacture of polyester molding compositions and articles produced therefrom A thermoplastic molding composition comprises a resin composition having 50 to about 90 weight percent of a polyester, about 8 to about 48 weight percent of a polyetherimide, about 2 to about 25 weight percent of a high rubber graft impact modifier, each based on th... | 08/07/2007 |
| 7247684 | Network polymers comprising epoxy-terminated esters The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a subst... | 07/24/2007 |
| 7204574 | Polyimide thickfilm flow feature photoresist and method of applying same A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potenti... | 04/17/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7148294 | Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercapta... | 12/12/2006 |
| 7135530 | Polymeric/oligomeric methacrylate functionalized amide acetals in coatings The present invention relates to polymeric/oligomeric methacrylate functionalized amide acetals are effective in preparing coating composition based on their reaction with isocyanates. ... | 11/14/2006 |
| 7115681 | Resin composition The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, solder... | 10/03/2006 |
| 7105591 | Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H: a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulf... | 09/12/2006 |
| 7098273 | Resin composition An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance. ... | 08/29/2006 |
| 7094845 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic ... | 08/22/2006 |
| 7084214 | Polyester resin composition for profile extrusion molding and molded article comprising the same A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composit... | 08/01/2006 |
| 7060761 | Epoxy resin compositions An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or i... | 06/13/2006 |
| 7060786 | Heat resistant resin composition and adhesive film A resin composition comprising the associated product of a polyimide resin having phenolic hydroxyl groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin having at least two glycidyl groups, and an epoxy resin-curing agent has a high bond streng... | 06/13/2006 |
| 7037578 | Power transmission belt An endless power transmission belt including a treated fiber embedded in an elastomeric body, the treated fiber having a first treatment of a polyamide and an epoxy, and optionally, a second treatment including an RFL adhesive. ... | 05/02/2006 |
| 7008555 | Epoxy resin curing agents and epoxy resin compositions A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine). | 03/07/2006 |
| 7001662 | Transfer sheet and wiring board using the same, and method of manufacturing the same A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern ... | 02/21/2006 |
| 7001560 | Molding resin composition and method of molding The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin ... | 02/21/2006 |
| 6998011 | Epoxy adhesive having improved impact resistance In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both ... | 02/14/2006 |
