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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 8124686 | Process for the manufacture of polyamide-12 powder with a high melting point The present invention relates to a process for the preparation of polyamide-12 powder by anionic polymerization of lauryllactam in solution in a solvent of the lactam, the polyamide-12 powder being insoluble in this solvent, the polymerization being carried out: | 02/28/2012 |
| 8044139 | Fiber reinforced nylon composition The present invention relates to a fiber reinforced nylon composition, wherein the composition includes (A) 25 to 75 parts by weight of a polyarylamide resin, (B) 25 to 75 parts by weight of a reinforcing fiber having a cross-sectional aspect ratio of 1.5 or more, a... | 10/25/2011 |
| 7820757 | Production of a titania-pigmented polyamide Disclosed is a method for producing a polyamide containing titanium dioxide pigments. Said method is characterized by the fact that titanium dioxide pigments are dispersed in an initial mixture containing water and caprolactam by means of a device comprising a dispe... | 10/26/2010 |
| 7683120 | Dispersants and compositions thereof The present invention provides a composition comprising (i) a particulate solid; (ii) an organic medium; and (iii) a salt of a hydrocarbyl-substituted acrylating agent. The invention further provides for the use of the composition in various applications including p... | 03/23/2010 |
| 7388050 | Proton conductor and method for producing the same A hyperbranch polymer is bonded to a pore surface existing on a SiO2 glass porous body, such that the hyperbranch polymer is bonded to the pore surface only at the base end moiety. The hyperbranch polymer has a first generation branched moiety branched fr... | 06/17/2008 |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7361291 | Antistatic composition Polymer compositions comprising a) a polymer substrate selected from the group consisting of the polyolefins, polyesters, polyamides and polylactic acids and b) a combination of i) at l... | 04/22/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7294915 | Underfill and mold compounds including siloxane-based aromatic diamines An apparatus including a first substrate comprising a first set of contact points; a second substrate including a second set of contact points coupled to the first substrate through interconnections between a portion of the first set of contact points a portion of t... | 11/13/2007 |
| 7276555 | Amide-modified resin or hydrocarbyl moiety for dispersing a pigment A method of dispersing pigment using an amide-modified resin or an amide-modified hydrocarbyl moiety, and the resulting pigment concentrate or coating or ink composition. ... | 10/02/2007 |
| 7273897 | Ink jet ink composition An ink jet ink composition of water, a humectant, and a hyperbranched polymeric dye of a hyperbranched polymer having a dye chromophore pendant on the polymer chain or incorporated into the polymer backbone. ... | 09/25/2007 |
| 7223519 | Imaging compositions and methods Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to... | 05/29/2007 |
| 7211615 | Polyamide powder with long-lasting, consistently good flowability A composition containing from 88 to 99.99% by weight of a polyamide, a compound of a polyamide and mixtures of these, and from 0.01 to 0.25% by weight of a flow aid where the drying loss from the flow aid after 5 days of conditioning at a relative humidity of 95% is... | 05/01/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7179855 | Polyamide molding compositions containing prepolymeric polyamides, a method for the preparation thereof and the use thereof The invention concerns polyamide molding compositions with good surface quality and good flow behavior containing prepolymeric polyamides with a solution viscosity of μrel 1.01–1.30 in quantities from 0.1 to 20 wt. %. ... | 02/20/2007 |
| 7166669 | Laser beam weldable thermoplastic molding materials Dark-colored thermoplastic molding compositions are disclosed. The compositions are suitable for making molded parts which in the wavelength region from 700 to 1200 nm are laser-transmitting, at least in spectral partial regions, and may be welded to laser-absorbing... | 01/23/2007 |
| 7160978 | Aromatic amide polymer systems and methods for making the same A method of making amide polymers with improved back-bone rigidity, stability and/or planarity through the promotion of intra-molecular interactions is disclosed. Amide polymers, in accordance with the embodiments of the invention, are formed using aromatic dicarbox... | 01/09/2007 |
| 7151127 | Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings The present invention relates to the use of thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during a thermoplastic conversion into commodity goods in discontinuous processes in particular in... | 12/19/2006 |
| 7151134 | Dynamic vulcanization of polyurethane elastomeric material in the presence of thermoplastics A thermoplastically processable cured rubber composition comprises a crosslinked or cured urethane polymer dispersed in a matrix made of a thermoplastic polymeric material. In one aspect, the matrix forms a continuous phase and the crosslinked urethane polymer is in... | 12/19/2006 |
| 7144676 | Imaging compositions and methods Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to... | 12/05/2006 |
| 7135516 | Sizing agent for carbon fiber, method for sizing carbon fiber by said sizing agent, sized carbon fiber and knitted or woven fabric using said carbon fiber The present invention relates to a carbon fiber sizing agent comprised of water-soluble thermoplastic resin and amphoteric surfactant within a weight ratio range of 6/1 to 1/3, a carbon fiber sizing method comprising treating carbon fibers using a sizing liquid cont... | 11/14/2006 |
| 7129318 | RTM and RI processable polyimide resins Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than abou... | 10/31/2006 |
| 7083851 | High refractive index layers A composition for forming a layer on a substrate includes a polyelectrolyte that is soluble in a polar solvent. The polyelectrolyte includes a plurality of aromatic groups and nitrogen atoms in a main polymer chain and has a refractive index of at least about 1.64 a... | 08/01/2006 |
| RE39207 | Anti-static and peroxide-stable molding compounds The invention concerns anti-static, peroxide-stable molding compounds on the basis of polyamides and/or polyesters, whereby the molding compounds are modified with very pure conductive carbon black with a low specific surface area. These anti-static molding compound... | 07/25/2006 |
| 7067577 | Apatite-reinforced resin composition The present invention relates to a resin composition comprising a resin and apatite, wherein referring to the particulate form of said apatite present in the resin composition thus obtained, the apatite is present in a particulate form having an average diameter or ... | 06/27/2006 |
| 7053169 | Polyamide molding compounds for producing optical lenses The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and ... | 05/30/2006 |
| 7053172 | Fuel-barrier polyamide resin and multilayer shaped article The fuel-barrier polyamide resin of the present invention is a product of the polycondensation of a diamine component comprising 70 mol % or higher of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or higher of a mixed dicarboxylic acid whic... | 05/30/2006 |
| 7034065 | Ink jet ink composition An ink jet ink composition comprising water, a pigment, a humectant and a hyperbranched polymer having end groups consisting essentially of hydrophilic moieties, said hyperbranched polymer having the following formula: HB—Xg ... | 04/25/2006 |
| 7026435 | Water-dispersible, hydrophobic polyalkyleneimine polyamide fiberglass lubricant, process for producing the same, and method of use therefor Polymer derivatives based upon polyalkyleneimine backbones having from about 20% to about 60% of their reactive amino functionalities substituted by C14-20 carboxylic acids, are disclosed. Fiber lubricants and/or sizing compositions comprising such polyme... | 04/11/2006 |
| 7009029 | Polyamide composition Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-oc... | 03/07/2006 |
| 7008995 | Carboxy resin crosslinkers Carboxy resins of low equivalent weight per carboxyl group are synthesized by reacting a compound having two or more isocyanate groups with a compound having one hydroxyl group and two or more carboxyl groups. In a preferred embodiment, the compound having isocyanat... | 03/07/2006 |
| 6955848 | Curable composition and multilayered circuit substrate This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable comp... | 10/18/2005 |
| 6956099 | Polyamide-polyether block copolymer Copolymers having linked internal polyether blocks and internal polyamide blocks have advantageous physical properties and solvent-gelling abilities. The copolymer may be prepared from a reaction mixture that contains 1,4-cyclohexane dicarboxylic acid (CHDA) and pol... | 10/18/2005 |
| 6943231 | Transparent polyamide molding materials having improved transparency, resistance to chemicals and high permanent fatigue strength Transparent polyamide molding materials are provided which are characterized in that they have a melting enthalpy between 0 and 12 J/g and the polyamides are constituted of 100 mole-% of a diamine mixture having 10-70 mole-% of PACM [bis-(4-amino-cyclohexyl)-... | 09/13/2005 |
| 6936682 | Polyamide A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 t... | 08/30/2005 |
| 6936649 | Strippable film coating composition for surfaces The present invention provides a strippable film coating mixture that includes a resin component having an acrylic polymer and a polyvinyl polymer, wherein the acrylic polymer comprises from about 20% to about 40% by weight of the mixture and the polyvinyl polymer c... | 08/30/2005 |
| 6936644 | Releasable microcapsule and adhesive curing system using the same An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire su... | 08/30/2005 |
| 6930155 | Powder coatings based on thermoset-modified polymers and polyesters A polyurethane composition comprising: A) from 3 to 35% by weight of a polymeric composition comprising 1) at least one polymer and 2) at least one thermoset in amounts of from 0.5 to 50% by weight, based on... | 08/16/2005 |
| 6930165 | Modified polyamides, compositions based on same and macromolecular compounds used to obtain them The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide ... | 08/16/2005 |
| 6919422 | Polyimide resin with reduced mold deposit A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficien... | 07/19/2005 |
