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| Number | Title | Issue Date |
| 7888411 | Thermally conductive adhesive composition and process for device attachment A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melt... | 02/15/2011 |
| 7348370 | Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer A corrosion resistant epoxy primer comprises a epoxy resin, a curing agent, and a non-chromate containing corrosion-inhibiting pigment. ... | 03/25/2008 |
| 7255925 | Thermosetting resin composition for high speed transmission circuit board The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and ... | 08/14/2007 |
| 7179853 | Resin dispersion for cationic electrodeposition and cationic electrodeposition coating composition including the same Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent propertie... | 02/20/2007 |
| 7157507 | Ultraviolet curable silver composition and related method A photocurable silver composition is provided which comprises an ultraviolet light curable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake composition comprises at least 20% of the weight of the silver powder. The... | 01/02/2007 |
| 7125917 | Epoxy molding compounds with resistance to UV light and heat A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantial... | 10/24/2006 |
| 7095125 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtai... | 08/22/2006 |
| 7018716 | Corrosion-and chip-resistant coatings for high tensile steel Corrosion- and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating powder composition of “toughened” epoxy resin. In a single coat embodiment, the entire coating is loaded with at least 75 phr zin... | 03/28/2006 |
| 7008981 | Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b)... | 03/07/2006 |
| 6994891 | Method for producing an epoxy composition An epoxy composition for application to the surface of a marine vessel. The epoxy composition comprises an epoxy resin and an iron particulate combined with one or more materials, preferably dry materials, which are piped into a feeder and then into a mixer. The dry... | 02/07/2006 |
| 6989412 | Epoxy molding compounds containing phosphor and process for preparing such compositions A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantiall... | 01/24/2006 |
| 6955739 | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated su... | 10/18/2005 |
| 6951686 | Architectural concrete and process to make same A concrete article comprised of concrete having therein a reinforcing polymer that has a surface comprised of a thermoplastic hydroxy-functionalized polyether or polyester. The concrete article is made by mixing concrete, water and a reinforcing polymer that has a s... | 10/04/2005 |
| 6905319 | Stator for down hole drilling motor An improved down hole drilling motor suitable for drilling applications. The down hole drilling motor comprising a stator disposed in the tubular housing. The stator includes an internal cavity having one or more lobes. A rotor operatively positioned in the cavity o... | 06/14/2005 |
| 6830815 | Low wear and low friction coatings for articles made of low softening point materials The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts ma... | 12/14/2004 |
| 6815495 | Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an a... | 11/09/2004 |
| 6809162 | Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least ... | 10/26/2004 |
| 6794058 | Flip-chip type semiconductor device A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i): wherein n is 0 or a positive number, | 09/21/2004 |
| 6791839 | Thermal interface materials and methods for their preparation and use A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which co... | 09/14/2004 |
| 6777464 | Circuit connecting material, and structure and method of connecting circuit terminal A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as esse... | 08/17/2004 |
| 6750274 | Weldable coating of phosphated epoxy polymer, curing agent and electroconductive pigment A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent... | 06/15/2004 |
| 6737108 | Microcapsulating conductive metal particles with polymerized monomers A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contac... | 05/18/2004 |
| 6699351 | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after conne... | 03/02/2004 |
| 6689459 | Clear cathodic electrocoating compositions An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct which is an epoxy resin that has been reacted with an amine, a blocked polyisocyanate crosslinking agent and an organic or inorganic acid as the neutralizing ... | 02/10/2004 |
| 6641928 | Adhesives and electric devices An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin... | 11/04/2003 |
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copo... | 10/07/2003 |
| 6627328 | Light-transmissive epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): wherein nA is the refractive index at T1° C. of the cured ... | 09/30/2003 |
| 6617401 | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D... | 09/09/2003 |
| 6617400 | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, a... | 09/09/2003 |
| 6610406 | Flame retardant molding compositions Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame ... | 08/26/2003 |
| 6610407 | Corrosion resistant coating for an iron-based part and method for applying same A method for treating a fastening part made from an iron-based alloy comprising the steps of degreasing and blasting the part; coating the part with an epoxy resin undercoating; and applying another coating thereon as a finish coat. The epoxy resin underc... | 08/26/2003 |
| 6583201 | Conductive materials with electrical stability for use in electronics devices An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the elec... | 06/24/2003 |
| 6544651 | High dielectric constant nano-structure polymer-ceramic composite The present invention is directed to polymer-ceramic composites having high dielectric constants formed using polymers containing a metal acetylacetonate (acacs) curing catalyst. In particular, it has been discovered that 5 weight percent Co(III) acac can... | 04/08/2003 |
| 6528552 | Resist composition excellent in flame resistance A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of ... | 03/04/2003 |
| 6525115 | Method of making an aqueous dispersion of particles comprising an epoxy material for use in coatings The present invention relates to a method of making an aqueous dispersion of particles comprising epoxy-functional and acid-functional materials. Coating compositions made from such a dispersion can be used to protect various substrates, including imaging... | 02/25/2003 |
| 6475641 | Connecting material and connection structure A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; a... | 11/05/2002 |
| 6469074 | Composition of cyanate ester, epoxy resin and acid anhydride Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2... | 10/22/2002 |
| 6465541 | Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same Polymerizable composition that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radi... | 10/15/2002 |
| 6462108 | High Tg potting compound A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two ... | 10/08/2002 |
| 6432540 | Flame retardant molding compositions Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed are the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits.... | 08/13/2002 |
