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| Number | Title | Issue Date |
| 7671114 | Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with ... | 03/02/2010 |
| 7622516 | Composition of epoxy and anhydride components, antioxidant and phosphor material A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantial... | 11/24/2009 |
| 7553891 | Flame-retardant epoxy resin composition, and electronic device, laminated circuit board, multilayered circuit board and printed circuit board using the flame-retardant epoxy resin composition A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin compo... | 06/30/2009 |
| 7432603 | Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Tab... | 10/07/2008 |
| 7372127 | Low cost and versatile resistors manufactured from conductive loaded resin-based materials Resistor devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The cond... | 05/13/2008 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7285581 | Processed pigments, pigment-dispersed solution, ink for ink jet, manufacturing method of processed pigments and manufacturing method of pigment-dispersed solution There is disclosed a processed pigment comprising a pigment having a dispersing agent adsorbed physically and/or chemically onto part of the surface of the pigment, and a cationic polymerizable compound bonded through a covalent bond to the surface of the pigment. P... | 10/23/2007 |
| 7214419 | Conductive paste multilayered board including the conductive paste and process for producing the same A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding t... | 05/08/2007 |
| 7208227 | ETFE lining member The present invention provides a lining member in which an ETFE is used and which shows good adhesion and can show a reduction in coating film defects. An ETFE-lining member comprising a substrate, a primer layer and a surface layer laminated in this order, wherein ... | 04/24/2007 |
| 7204925 | Structure and method of preventing electrolytic corrosion for magnesium alloy member A structure and a method of preventing electrolytic corrosion for a magnesium alloy member (20), the structure wherein a first coated layer (11) formed by electro deposition and a second coated layer (12) formed by distributing PTFE particles on... | 04/17/2007 |
| 7196124 | Elastomeric material compositions obtained from castor oil and epoxidized soybean oil Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reac... | 03/27/2007 |
| 7179684 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula: ... | 02/20/2007 |
| 7156945 | Process for forming a patterned thin film structure for in-mold decoration A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired struct... | 01/02/2007 |
| 7147897 | Weldable compositions comprising a conductive pigment and silicon and methods for using the same A weldable coating composition is disclosed. The composition comprises a binder in which is dispersed a conductive pigment and a source of silicon. Enhanced corrosion protection is offered, without sacrificing weldability of the coating layer. The composition is app... | 12/12/2006 |
| 7144463 | Highly quenchable Fe-based rare earth materials for ferrite replacement The present invention relates to highly quenchable Fe-based rare earth magnetic materials that are made by rapid solidification process and exhibit good magnetic properties and thermal stability. More specifically, the invention relates to isotropic Nd—Fe—B type... | 12/05/2006 |
| 7141619 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 11/28/2006 |
| 7125917 | Epoxy molding compounds with resistance to UV light and heat A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantial... | 10/24/2006 |
| 7122587 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting poin... | 10/17/2006 |
| 7105614 | Curable epoxy resin composition A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is u... | 09/12/2006 |
| 7105591 | Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H: a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulf... | 09/12/2006 |
| 7095125 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtai... | 08/22/2006 |
| 7047633 | Method of using pre-applied underfill encapsulant The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale packages (CSP's) to substrates. One such composition comprises a thermoplas... | 05/23/2006 |
| 7034405 | Resin component for encapsulating semiconductor and semiconductor device using it A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semi... | 04/25/2006 |
| 7008981 | Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b)... | 03/07/2006 |
| 7005186 | Damage resistant and tolerant optical materials A new damage resistant and tolerant optical element is disclosed. Prior art solid or liquid host matrices are replaced by a soft crosslinked polymer or similar host material. The viscoelastic properties of the matrix host material are controlled during formation so ... | 02/28/2006 |
| 6989412 | Epoxy molding compounds containing phosphor and process for preparing such compositions A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantiall... | 01/24/2006 |
| 6984262 | Adhesion enhancing coating composition, process for using and articles produced Described is a coating composition adapted to enhance the adhesion of a polymeric coating or film applied to a substrate. The coating composition is interposed between the substrate and the polymeric coating and comprises (a) at least one coupling agent, partial hyd... | 01/10/2006 |
| 6979409 | Highly quenchable Fe-based rare earth materials for ferrite replacement The present invention relates to highly quenchable Fe-based rare earth magnetic materials that are made by rapid solidification process and exhibit good magnetic properties and thermal stability. More specifically, the invention relates to isotropic Nd—Fe—B type... | 12/27/2005 |
| 6974847 | Melt compounded fusion bonded marine anti-fouling coating Anti-fouling coating composition containing high amounts of zinc, and novel methods of applying melt compounded anti-fouling coating compositions to components by heat fusion techniques. The components that can be treated include fresh water or salt water exposed co... | 12/13/2005 |
| 6955739 | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated su... | 10/18/2005 |
| 6942922 | Cationic paint composition The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl pheno... | 09/13/2005 |
| 6921550 | Etch resist using printer technology The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate ... | 07/26/2005 |
| 6919420 | Acid-cleavable acetal and ketal based epoxy oligomers Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly such as a wafer-level underfilled microelectronic package. ... | 07/19/2005 |
| 6894091 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler conta... | 05/17/2005 |
| 6893736 | Thermosetting resin compositions useful as underfill sealants The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip... | 05/17/2005 |
| 6890974 | Powder coating composition containing low temperature curable epoxy resin The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, t... | 05/10/2005 |
| 6888257 | Interface adhesive The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is pl... | 05/03/2005 |
| 6830825 | Epoxy resin composition and semiconductor device An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for mo... | 12/14/2004 |
| 6809162 | Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least ... | 10/26/2004 |
| 6809130 | Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin togeth... | 10/26/2004 |
