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| Number | Title | Issue Date |
| 7538150 | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation produ... | 05/26/2009 |
| 7326934 | Detector for the detection of electromagnetic radiation The invention relates to a detector for the detection of electromagnetic radiation, which detector includes at least one scintillator (6), at least one CMOS chip (3) and a ceramic basic element (4), a respective intermediate layer (2) tha... | 02/05/2008 |
| 7230052 | Epoxy resin composition and fiber reinforced composite material using epoxy resin composition A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa·s and provides a cured product displaying a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epox... | 06/12/2007 |
| 7220616 | Methods for epoxy loc die attachment A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead fr... | 05/22/2007 |
| 7213739 | Underfill fluxing curative The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Spec... | 05/08/2007 |
| 7101933 | Process for producing high speed transmitting dielectric material A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of ... | 09/05/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 6969756 | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith Novel phosphorus element-containing vinyl ester resin compositions and process for preparing epoxy vinyl ester resin compositions include non-halogenated, ignition resistant epoxy vinyl ester resin formulations. The ignition resistant epoxy vinyl ester resin formula... | 11/29/2005 |
| 6864314 | Block polymers, compositions and methods of use for foams, laundry detergents, shower rinses and coagulants The present invention relates to a block polymeric material. Typically the block polymer comprises units capable of having an average cationic charge density of about 15 or less, preferably 5 or less, more preferably from about 0.05 to about 5, even more preferably ... | 03/08/2005 |
| 6825315 | Method of making thermally removable adhesives A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homog... | 11/30/2004 |
| 6770965 | Wiring substrate using embedding resin A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an... | 08/03/2004 |
| 6518331 | Composition of epoxy resins and curing agent capable of being coarsened A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation... | 02/11/2003 |
| 6467961 | Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an o... | 10/22/2002 |
| 6433042 | Curing agents for epoxy resins A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component ##STR1## wherein X is --(CH2)n- or --(CH2)1-Y--(CH2)m- , Y is --N(R1 | 08/13/2002 |
| 6379799 | Low moisture absorption epoxy resin systems with alkylated diamine hardeners Resin systems containing a dicyclopentadiene-based epoxy resin and an ortho-alkylated aromatic diamine hardener exhibit low moisture absorption, high Tg and good retention of properties under hot and wet conditions. These properties make the resin systems... | 04/30/2002 |
| 6375867 | Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers A process for making an improved current limiting composition comprising mixing an epoxy thermosetting resin containing more than one 1,2 epoxy groups per molecule with an acid anhydride curing agent, an epoxy reactive diluent, first and second co-acceler... | 04/23/2002 |
| 6376053 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent e... | 04/23/2002 |
| 6376638 | Latent curing agent for epoxy resin initiated by heat and UV-light and epoxy resin composition containing the same and cured epoxy products The present invention relates to a novel latent curing agent which is capable of controlling the initiation reaction stage and is curable by heat and/or UV-light, an epoxy resin composition containing it, and a mixed epoxy composition (blend) having diffe... | 04/23/2002 |
| 6337384 | Method of making thermally removable epoxies A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to l... | 01/08/2002 |
| 6294271 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 ... | 09/25/2001 |
| 6245836 | Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an o... | 06/12/2001 |
| 6046257 | Composition for prepreg comprising epoxy resin, polyamide block copolymer and curing agent A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a po... | 04/04/2000 |
| 6045857 | Curable, water-borne one-component coating system using thermally labile hydrophillic groups Unsaturated hydrophobic resins modified with labile hydrophillic groups exhibit reversible solubility in water. Beta-dialkyl amino carboxylate derivatives of novolak resins are useful to make baking enamels and resists.... | 04/04/2000 |
| 5859097 | Epoxy resin compositions containing red phosphorus Curable epoxy resin composition comprising a bisphenol based epoxy resin having between 1.1 and 2.5 epoxy groups on average per molecule, a polyhydric phenol curing agent having more than two phenolic hydroxyl groups on average per molecule and red phosph... | 01/12/1999 |
| 5856383 | Snap-cure epoxy adhesives This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin... | 01/05/1999 |
| 5854315 | Snap-cure epoxy adhesives This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin... | 12/29/1998 |
| 5770706 | Snap-cure epoxy adhesives This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin... | 06/23/1998 |
| 5759690 | Epoxy resin mixtures for prepregs and composites Epoxy resin mixtures for the production of prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least tw... | 06/02/1998 |
| 5712331 | Curable epoxy compositions containing aziridine in supercritical fluid carbon dioxide A curable resin system in supercritical carbon dioxide as diluent includes an epoxy resin, a co-reactant selected from poly N-substituted aziridines, and a catalyst to promote cure at ambient temperature. The system is compatible with various epoxy resins... | 01/27/1998 |
| 5708056 | Hot melt epoxy encapsulation material A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enha... | 01/13/1998 |
| 5686185 | Disbondment resistant epoxy powder coating composition A thermosetting epoxy resin powder coating composition is provided that comprises an epoxy resin composed of a diglycidyl ether of bisphenol A, a curing agent composed of a bisphenol A encapped diglycidyl ether of bisphenol A, and a cure catalyst composed... | 11/11/1997 |
| 5648171 | Epoxy resin mixtures containing phosphorus acid/epoxy resin adducts Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transi... | 07/15/1997 |
| 5641818 | Aqueous, essentially voc-free adhesive epoxy primer Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water s... | 06/24/1997 |
| 5623003 | Coating compositions containing polyester resin, epoxy resins and an anticorrosion pigment A coating composition containing a resin composition consisting of (A) 10 to 90 parts by weight of at least one resin selected from polyester resin having a glass transition temperature of -5° C. to 80° C. and a number average molecular weight of 5,000 ... | 04/22/1997 |
| 5587243 | Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transi... | 12/24/1996 |
| 5580611 | Polymer concrete coating for pipe, tubular shapes, other metal members and metal structures The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a fill... | 12/03/1996 |
| 5580659 | Polymer concrete coating for pipe, tubular shapes, other metal members and metal structures The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a fill... | 12/03/1996 |
| 5567528 | Polymer concrete coating for pipe, tubular shapes, other metal members and metal structures The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a fill... | 10/22/1996 |
| 5559174 | Electrocoating composition of a polyamine self-condensed epoxy adduct and coatings produced thereby The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross... | 09/24/1996 |
| 5525650 | Electrocoating composition of a polyamise self-condensed epoxy adduct and coatings produced thereby The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross... | 06/11/1996 |
