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| Number | Title | Issue Date |
| 8188165 | Fire-retardant low-density epoxy composition The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1... | 05/29/2012 |
| 8058327 | Composition The instant invention relates to highly filled epoxy resin compositions suitable as casting resins without the need of an extended curing step, to a casting process using said compositions and use of said compositions in a casting process not needing an extended cur... | 11/15/2011 |
| 8017670 | Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the ... | 09/13/2011 |
| 7994238 | Article and associated method An article includes a reaction product of a filler having binding sites, a coupling agent composition including an aromatic amine and a first cycloolefin substituted with at least one epoxy group, a polymer precursor including a second cycloolefin, and a metathesis ... | 08/09/2011 |
| 7906568 | Coupling agent composition and associated method A composition includes a coupling agent composition and a polymer precursor. The coupling agent composition includes an aromatic amine and a first cycloolefin substituted with at least one epoxy group. The polymer precursor includes a second cycloolefin and an epoxy... | 03/15/2011 |
| 7741388 | Epoxy resin composition and semiconductor device The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulati... | 06/22/2010 |
| 7652079 | Polybutylene terephthalate resin composition for vibration welding The present invention provides a polybutylene terephthalate resin composition which has an excellent vibration welding performance, an excellent resistance to heat shock, and is useful for a case, housing and the like of electric/electronic parts. Specifically, it p... | 01/26/2010 |
| 7645816 | Water-soluble compositions of bioactive lipophilic compounds Water-soluble compositions comprising a lipophilic compound and a solubilizing agent of the general formula: {X—OOC—[(CH2)n—COO]m}p—Y (I) wherein: X is a ... | 01/12/2010 |
| 7605195 | Epoxy coating system A “hybrid” epoxy resin coating system formed by a solvent-borne epoxy resin and a water-reducible curing agent. The coating formed by this system exhibits excellent resistance to most household chemicals, and yet is permeable to water vapor transmission to reduc... | 10/20/2009 |
| 7553890 | Circuit-connecting material and circuit terminal connected structure and connecting method A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as esse... | 06/30/2009 |
| 7550521 | Toughening of thermosets A method of manufacturing thermosets such as epoxy resins includes adding expandable hollow microspheres, which expand with temperature as shown in the accompanying graph, to the base thermoset components in the liquid phase and applying heat treatment to the mixtur... | 06/23/2009 |
| 7442434 | Epoxy resin composition A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing te... | 10/28/2008 |
| 7431990 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this inve... | 10/07/2008 |
| 7393419 | Conductive adhesive rework method A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other mo... | 07/01/2008 |
| 7390571 | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 06/24/2008 |
| 7358211 | Catalyst for the production of 1,3-propanediol by catalytic hydrogenation of 3-hydroxypropanal A process for preparing a catalyst, comprising sequentially: (a) saturating a TiO2 support with aqueous ruthenium solution; (b) treating the ruthenium saturated TiO2 support with an aqueous base solution; and (c) curing the ruthenium saturated ... | 04/15/2008 |
| 7358312 | Epoxy resin curing agent of epoxy resin-liquid amine adduct and polyamidoamine This invention describes epoxy-amine compositions that have low mix viscosity and a fast drying property at temperatures below freezing. The composition is useful for high solids coating applications, for adhesive and membrane applications, and for preparing ... | 04/15/2008 |
| 7354989 | Thioepoxy based polymerizable composition and method for production thereof A polymerizable composition and a manufacturing method thereof are provided, in which the composition is capable of meeting requirements of overcoming decrease in production yield of a resin composed of a thioepoxy compound, the decrease being caused by variations i... | 04/08/2008 |
| 7351645 | Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method fo... | 04/01/2008 |
| 7338712 | Coating composition for a smoothing and/or polishing element and a grinding wheel provided with said coating composition The invention concerns a coating for a smoothing and/or polishing element, particularly a flexible grinding wheel, provided with a flexible abrasive insert, for smoothing and polishing stone material, consisting essentially of: a blend of epoxy resin and polysulfide... | 03/04/2008 |
| 7338226 | Aerosol can containing a two-component epoxy-paint The invention relates to an aerosol can containing a two-component paint with an aerosol preparation, in particular for use in the automotive industry and for automotive repairs. Said aerosol can contains a binding agent component and a curing component. The binding... | 03/04/2008 |
| 7329711 | Modified epoxy resins The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the ... | 02/12/2008 |
| 7326755 | Coolant resistant and thermally stable primer composition A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additi... | 02/05/2008 |
| 7312260 | Epoxide adducts and their salts as dispersants The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one pr... | 12/25/2007 |
| 7297406 | Lead-free electrodeposition coating composition and coated article The present invention relates to a cationic electrodeposition coating composition substantially free of lead compounds, which is excellent in curability and can be finish-coated with a splendid appearance, and an article coated with the composition. The invention pr... | 11/20/2007 |
| 7288161 | Reworkable adhesives containing thermally labile groups Embodiments of the present invention relate to adhesive compositions containing thermally-labile groups for decreasing the degradation temperature of the adhesive for reworkability of electronic components in surface mounting applications. In one embodiment, the the... | 10/30/2007 |
| 7285581 | Processed pigments, pigment-dispersed solution, ink for ink jet, manufacturing method of processed pigments and manufacturing method of pigment-dispersed solution There is disclosed a processed pigment comprising a pigment having a dispersing agent adsorbed physically and/or chemically onto part of the surface of the pigment, and a cationic polymerizable compound bonded through a covalent bond to the surface of the pigment. P... | 10/23/2007 |
| 7276562 | Epoxy-silicone mixed resin composition and light-emitting semiconductor device An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight o... | 10/02/2007 |
| 7268181 | Volume-modified casting compounds based on polymeric matrix resins Bulk-modified potting composition based on a curable epoxy resin or on a mixture of these resins, where the resin or the mixture is composed of an epoxy resin, a hardener, where appropriate an accelerator, and also other additives, such as fillers, flexibilizers, an... | 09/11/2007 |
| 7268174 | Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same The present invention relates to homogeneous alumoxane-LCT-epoxy polymers and methods for making the same. The homogeneous alumoxane-LCT-epoxy polymers comprise alumoxane-containing sub-structures evenly dispersed and essentially completely co-reacted with the LCT-e... | 09/11/2007 |
| 7262233 | Surface treated silicas Disclosed is a silica substrate treated with a polysiloxane, and an organosilane, wherein the organosilane is described by the formula: RSi(R′)x(OR″)3-x; wherein R is a long-chain hydrocarbon group having between about 8 to about 30 carbon ... | 08/28/2007 |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7253219 | Functional composite material using shape memory alloy and production method therefor A functional composite material characterized by being molded by solidifying by a resin base material a martensite-phase shape memory alloy wire produced by cold drawing a shape memory alloy which changes between an austenite phase and a martensite phase via a phase... | 08/07/2007 |
| 7247684 | Network polymers comprising epoxy-terminated esters The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a subst... | 07/24/2007 |
| 7244786 | Flame-retardant resin composition, moldings thereof and flame retardant A flame-retardant resin composition comprising 100 parts by weight of a rubber-reinforced polystyrene resin, from 0.1 to 20 parts by weight of an epoxy-modified phenolic resin, and from 1 to 30 parts by weight of an aromatic phosphate has good flame retardancy and g... | 07/17/2007 |
| 7241856 | Dental resins, dental composite materials, and method of manufacture thereof A low shrinkage, polymerizable oligomer comprises units of the structure: AB (I) wherein A is an organic radical comprising 1 to about 6 (meth)acrylate groups and 0 to about 5 hydroxy groups; B is an organic radical comprising 1 to about 5 e... | 07/10/2007 |
| 7208228 | Epoxy resin for fiber reinforced composite materials An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing agent, and (C) a liquid rubber that is liquid at room temperature and com... | 04/24/2007 |
| 7189307 | Low odor binders curable at room temperature Topically-applied binder materials for imparting wet strength to soft, absorbent paper sheets, such as are useful as household paper towels and the like, include an epoxy-reactive polymer, such as a carboxyl-functional polymer, and an epoxy-functional polymer. These... | 03/13/2007 |
| 7183661 | Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof Epoxy-resin systems resistant to aging, molded materials and components generated from them, and their utilization. An epoxy-resin system especially suitable in the application of casting-resin methods comprising an epoxide-containing A component based on a g... | 02/27/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
